Matches for your search: "SEMICON West"
Will TSMC, SK Hynix, and Amkor be an Onshore Source for Nvidia? SK Hynix learned to package its own stacked dynamic random access memories (DRAMs) for high bandwidth memory (HBM) components. According to reports, the company is now considering entering the OSAT market by way of a strategic partnership with...
As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities. The industry event season kicked off with SEMICON Taiwan and SEMICON India, IEEE 3DIC, MEMS & Imaging Sensors Summit, and more, and our members actively participated. Many of them were...
Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming Wary of Intel Investment? Toms Hardware, a great site for the latest info on microelectronic hardware, is noting that Intel is reportedly facing a delay in the release of its...
Presentation at SEMICON Taiwan 2024 demonstrates how materials impact sustainability, artificial intelligence, and high-performance computing. Brewer Science, Inc., a global leader in developing and manufacturing innovative materials for micro- and optoelectronics, shares its expertise on the impact materials have on sustainable lithography processes. Additionally, Brewer Science presents the role innovative...
We need governments, companies, and communities worldwide to cooperate if we want to build a more circular and more equitable economy. This applies to all industries, including semiconductors and 3D integration. Mineral supplies are a crucial issue for our industry. Metals are needed for all aspects of semiconductor manufacturing and...
The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a...
YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models....
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging applications, today announced that it has delivered multiple VeroTherm Formic Acid Reflow (FAR) systems to leading logic and memory customers. This system will be utilized to enable 3D stacking of memory and logic chips required...
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to...
SEMI and TechSearch International announced that the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, in their new Global Semiconductor Packaging Materials Outlook report. High-performance applications, 5G, artificial intelligence...
