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As summer holidays came to a close, September found our member companies ramping up new products and opening new facilities. The industry event season kicked off with SEMICON Taiwan and SEMICON India, IEEE 3DIC, MEMS & Imaging Sensors Summit, and more, and our members actively participated. Many of them were...
Also: hynix Advanced Packaging in Indiana; Fraunhofer Chiplet Center; Call to Unify Advanced Packaging Standards Is the U.S. Government Becoming Wary of Intel Investment? Toms Hardware, a great site for the latest info on microelectronic hardware, is noting that Intel is reportedly facing a delay in the release of its...
Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Wilmington, Mass., July 9, 2024 – Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling...
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...
From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experience talk about what brought them to pursue careers in microelectronics and semiconductors. The stories are as varied as the women telling...
Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for childhood cancer. After a brief ceremony during which we presented 11 awards in 10 categories (find out who won...
Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed...
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge and opportunity. What can we, in the 200-year-old US of A, learn from the 4000 years old Chinese culture? The Chinese have a point! Based on my personal experience, I...
Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) today introduced Equipment Sentinel™, a state-of-the-art, automated fault detection and classification (FDC) software solution that seamlessly combines key wafer-level data with high-fidelity tool signal and event data into a single framework, giving users a comprehensive, easy-to-understand view of their processes...
Last fall before SEMICON Europa, Andreas Ostmann, manager of the embedding and substrate technologies group, Fraunhofer IZM, spent some time with me explaining what he decribed as 3 distinct levels of 3D packaging. The first was die stacking through TSV.
