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From the keynotes to the sessions to casual conversation, automotive electronics was a hot topic of discussion at SEMICON Europa 2017. That’s likely because Europe leads the world in automotive OEMs and is home to four of the top 10 semiconductor providers in the automotive industry. With over 22% growth...
The memory industry is experiencing a strong growth phase: the total memory market is expected to increase at a ~9% CAGR 2016-2022, reaching about US$135 billion by 2022, with DRAM and NAND constituting almost 95% market share. Moreover, a supply-demand mismatch is pushing memory device asking selling price (ASP), resulting...
Grenoble, France, March 14, 2017 – UnitySC, a wholly owned subsidiary of FOGALE Nanotech Group and a leader in inspection and metrology solutions for advanced semiconductor packaging, today introduced its new NST Series at SEMICON China in Shanghai. The NST Series is the world’s first non-contact metrology solution for accurately...
A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX. Novati is clearly on a roll, because today they added another industry first to their product...
Both Innovators Join Forces to Offer Simple, Cost-Effective Temporary Bonding/Debonding Solution for High-Performance 3D-IC Packaging ST. FLORIAN, Austria, Sept. 3, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced today that Dow Corning has joined its network...
Milestone shipment extends company’s leadership in DRIE Newport, United Kingdom, and SEMICON Singapore, 7 May, 2013 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the company had reached a milestone in shipping its 1000th deep reactive ion etch (DRIE)...
Flexible System Integrates Spin/Spray Coating and Wet Processing for MEMS, Advanced Packaging and Compound Semiconductor Applications SEMICON SINGAPORE, May 7, 2013—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the latest version of its EVG®120 automated resist processing...
All Programmable PlanetToday All Programmable Planet’s newsletter appeared in my inbox, with a great post by Max Maxfield on the Xilinx family of 3D FPGAs. Beyond the detailed descriptions of Xilinx’ products, and explanation between the difference between 3D FPGA and 3D Heterogeneous FPGA, I especially like Max’s musings on...
Redesigned, Fully Automated Modular System Integrates Unmatched Spray Coating Processes for MEMS, Compound Semiconductors and Advanced Packaging SEMICON TAIWAN, Taipei, September 4, 2012 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation EVG150 automated resist...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has introduced a new equipment platform, dubbed the XT Frame, that extends process throughput and tool functionality for virtually all of its current volume-manufacturing product offerings. Specifically designed...
