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Onto’s JetStep® lithography and Firefly® G3 inspection systems offer a powerful solution as the industry pursues glass core panel transition Wilmington, Mass., July 9, 2024 – Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep® X500 panel-level packaging lithography system with hybrid substrate handling...
The 3rd Annual Heterogeneous Integration Roadmap (HIR) Symposium confirms it: Heterogeneous Integration is the best way for the semiconductor industry to achieve $ 1 Trillion in revenues. SEMI hosted the event at its headquarters in Milpitas. Almost 200 IC design and manufacturing experts joined, to celebrate the release of the 2019...
From the semiconductor industry panels on gender diversity and inclusion and networking receptions to casual lunches and one-on-one interviews, I’ve been listening to women of all levels of experience talk about what brought them to pursue careers in microelectronics and semiconductors. The stories are as varied as the women telling...
Once again this year, the industry came out in full force to honor excellence in heterogeneous integration at the 2017 3D InCites Awards Ceremony and Cocktail Reception to benefit KidSizeCures for childhood cancer. After a brief ceremony during which we presented 11 awards in 10 categories (find out who won...
Wilmington, Mass. (July 11, 2016)—Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging techniques. Organic contaminants are often the root cause of field failures, which occur after the material has been exposed...
My wife, born and raised in Hong Kong, tells me that the Chinese language uses the same word for challenge and opportunity. What can we, in the 200-year-old US of A, learn from the 4000 years old Chinese culture? The Chinese have a point! Based on my personal experience, I...
If you had been a fly on the wall in my office last week, you would have seen more than one performance of my happy dance. After all, watching an idea come to life is nothing short of intoxicating. Little by little, 3D InCites is evolving into what we initially...
Oerlikon’s double-barrel news about the sale of its Oerlikon Esec business unit to BESI, and expected management buyout of its etch unit brings to fruition strategic plans I got wind of in October at SEMICON Europa. At that time, Sven Jarby, who heads up marketing and communications for Oerlikon...
JDA to Extend Limits of Temporary Bonding/Debonding Technology to Support High-Topography Wafers and Chips SEMICON EUROPA, Dresden, Germany, October 11, 2011—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has established an agreement with world-renowned research...
Last fall before SEMICON Europa, Andreas Ostmann, manager of the embedding and substrate technologies group, Fraunhofer IZM, spent some time with me explaining what he decribed as 3 distinct levels of 3D packaging. The first was die stacking through TSV.
