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Cybersecurity

SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework

Sep 30, 2024

Seeking to strengthen the semiconductor industry’s resilience to cybersecurity threats, the global association SEMI today announced the creation of a strategic roadmap for cybersecurity implementation throughout the industry. The SEMI Semiconductor Manufacturing Cybersecurity Consortium (SMCC) has partnered with the National Institute of Standards and Technology (NIST) to develop a semiconductor...

Community Member Monthly News – August 2024

Aug 28, 2024

August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...

Critical minerals

Sustainability 101: Critical Minerals and Collaboration

Aug 14, 2024

We need governments, companies, and communities worldwide to cooperate if we want to build a more circular and more equitable economy. This applies to all industries, including semiconductors and 3D integration. Mineral supplies are a crucial issue for our industry. Metals are needed for all aspects of semiconductor manufacturing and...

Generative AI

Generative AI Needs Advanced Packaging Solutions

Jul 07, 2024

The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a...

Uniting the World Through Technology Innovation

Nov 25, 2019

What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the...

U2U 2019 Conference Dives into 2.5/3D IC Design

May 13, 2019

Key advanced packaging technology influencers came out in force to discuss the status of  EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business (Mentor) and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor,...

SEMI 2020: Transforming for the New Supply Chain

Aug 02, 2016

2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry.  An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed.  As a result, in 2016, we are working within a significantly reshaped...

EV Group Unveils New Via-Filling Process to Improve Reliability of 3D-IC / TSV Packaging

Sep 04, 2013

Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications.  Available on the EVG100 series of resist processing systems, the new...

EVG Unveils EVG520L3 Next-Generation Wafer Bonding System with Key Cost-of-Ownership Advantages for Advanced Packaging and MEMS

Oct 19, 2010

New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance   SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...