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August has been a thrilling month for the semiconductor industry, marked by notable achievements from our community members. From innovative new technological advancements and workforce development initiatives, to exciting industry events and partnerships, here’s a little about what our members have achieved. Technology Innovation: Lam Research has introduced Lam Cryo™...
As sustainability matures, the fall of the year seems to be when there is a significant focus on sustainability, culminating in the Conference of the Party (COP) meetings in late November. Companies publish their ESG reports if they have done so earlier in the year. Ratings companies release their rankings,...
Those of you who have been in the advanced packaging world for 20 years or more may recall the tremendous challenges in replacing eutectic tin/lead (Sn/Pb) solder with lead-free alternatives. Pb is an excellent alloying element. Its low melting point and ductility are ideally suited for solder joints. Unfortunately, as...
Lam Research announced quantifiable progress has been made toward its environmental, social and governance (ESG) goals with the release of its 2022 ESG report. Lam’s continued progress toward its ESG goals included exceeding its 2025 goals for water savings as well as surpassing its 2025 goal for employee volunteer hours, prompting...
SEMI has fully embraced sustainability. Starting slow pre-COVID, they have ramped up and become a significant force in the industry. The organization spearheaded the Semiconductor Climate Consortia, of which 84 members are working cooperatively to encourage collaboration in sustainability and move the industry towards net zero somewhere between 2030 and...
The photo of my May calendar was a picture of a 1956 RAMAC computer with a whopping five megabytes of storage. The note on my calendar states that it could hold the entire phone book of Manhattan. The photo made me think of recent technology announcements, the announcements yet to...
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the...
2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry. An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed. As a result, in 2016, we are working within a significantly reshaped...
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
