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The adoption of Generative AI is growing every day. Apple is the latest to announce the use of Generative AI in its Siri App. With this rapid growth of the use of AI in our day-to-day life, comes the need to train the models behind these tools. This requires a...
YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and AR/VR applications, today announced that its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models....
YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging applications, today announced that it has delivered multiple VeroTherm Formic Acid Reflow (FAR) systems to leading logic and memory customers. This system will be utilized to enable 3D stacking of memory and logic chips required...
As the semiconductor industry continues to experience a surge of innovation, companies worldwide are collaborating to propel technology forward while also addressing sustainability issues and investing in STEM education. From pioneering product debuts and events to strategic alliances and efforts in workforce development, our members had lots of news to...
As sustainability matures, the fall of the year seems to be when there is a significant focus on sustainability, culminating in the Conference of the Party (COP) meetings in late November. Companies publish their ESG reports if they have done so earlier in the year. Ratings companies release their rankings,...
What a week we just had at the Munich Messe in Germany! If you’ve never had the chance to attend SEMICON Europa and Productronica simultaneously, I highly recommend you put it on your must-do list. Not only will you reach your daily step goal, but you’ll also learn about the...
Key advanced packaging technology influencers came out in force to discuss the status of EDA tools for 2.5D/3D IC package design at the recent User to User (U2U 2019) Conference, organized by Mentor, A Siemens’ Business (Mentor) and hosted at the Santa Clara Marriott. Presenters from Wave Computing, ARM, Amkor,...
2015 will be remembered mostly for the ‘wild ride’ that fundamentally changed the industry. An unprecedented wave of M&A activity swept across the electronics supply chain with scores of transactions and with notable multi-billion dollar companies being absorbed. As a result, in 2016, we are working within a significantly reshaped...
Semicon Taiwan, Taipei, September 4, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled a new polymer via-filling process for 3D-IC/through-silicon-via (TSV) semiconductor packaging applications. Available on the EVG100 series of resist processing systems, the new...
New wafer bonder from EVG enables 3-5x throughput improvement for breakthrough cost-of-ownership performance SEMICON EUROPA, Dresden, Germany, October 19, 2010 – EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced the latest...
