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EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-on-a-Chip

Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates an important step forward in process maturity EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, today announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and...

SEMI Market Intelligence Team Discusses Semiconductor Equipment Outlook

The SEMI Market Intelligence Team (MIT) recently recorded the first podcast in a new series with 3D InCites that will provide semiconductor manufacturing updates across the wafer fab; equipment; materials; and assembly, packaging, and test markets to help semiconductor companies and other key industry stakeholders with their day-to-day business decisions....

3D Technology Development is a World-Wide Activity

The CHIPS Act, which is finally gaining some momentum in Congress, is looking at how to improve the United States’ competitiveness as well as supply chain in the semiconductor development and manufacturing space. From the conversations being floated, there appear to be two major concerns: 1) has the U.S. lost...

Update on the Heterogenous Roadmap and the CHIPs Act

Years ago, when I was just a young pup in the industry, my manager asked me to attend a meeting in San Jose, California in 1997, where I participated in helping to define one of the early road maps for semiconductor technology, The early version I participated in was sponsored...

A Look at Semiconductor Equipment Supplier Sustainability Efforts

Most semiconductor equipment companies have been focused on sustainability programs longer than most other industries. In part, some of the focus is probably due to customers, such as Intel and ST Microelectronics, that have had sustainability or environmental programs of some sort since 1993. In 2019, at the last face-to-face...

Managing in Times of Change: SEMI’s Innovation for a Transforming World

Day 1 In place of the SEMICON West in July, SEMI presented a virtual event titled Innovation for a Transforming World. The event format was a bit different than the way SEMI normally runs a conference. Historically, SEMI leans heavily on the semiconductor infrastructure for presentations with a keynote from...

Semiconductor Summer Conference Highlights: Hardware is Back Baby!

June and July have been busy months from a semiconductor conference perspective. VLSI, IITC, imec IFT America, CEA-Leti Innovation Days, MEPTEC, and SEMI’s Innovation for a Transforming World event were all held in roughly a 4-week period. It’s easy to see why a lot of folks are starting to get...

Brussels, Belgium. 3rd Nov. 2018.Activists hold placards and chant slogans during a demonstration to demand immediate an action on climate change in front of European Parliament.

Sustainability: We Will Always Have Paris

On a trip home from Dresden, Germany, my plane was delayed by fog. A fellow analyst and I just missed our connection to San Francisco in Munich. Lufthansa was very accommodating and shipped us to Paris where we spent the night, and the next day caught our respective flights to...

Closing Out 2020 at the MEPTEC Holiday Hangout

After nine months of Zooming into all the virtual events, I can’t wait for things to go live again. In the meantime, I took the opportunity last week to pop into the MEPTEC Holiday Hangout. As my last blog post of 2020, I thought I’d share some tidbits of the...