Matches for your search: "SEMICON West"
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON...
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in...
The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D”...
SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatement systems installed worldwide. Edwards calculates that its abatement systems have prevented emissions equivalent to over 14 million tons of carbon dioxide in 2017. “The safety...
The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D enhanced will be further categorized as 2DS (silicon substrate) or 2DO (organic substrate). We want to know your opinion....
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime real estate, as pretty much everyone passes by the table at one time or...
Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled alongside major conferences around the globe so that as many people as possible can participate. We’ve been following the progress...
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of...
Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety, and longlasting functionality chips. As materials play a key role in the performance and...
