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The Heterogeneous Integration Roadmap Explained by Bill Chen

Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled alongside major conferences around the globe so that as many people as possible can participate. We’ve been following the progress...

3D InCites and IMAPS International Partner to Co-host the 2018 3DInCites Awards at the 2018 IMAPS Device Packaging Conference

Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of...

Merck develops innovative materials solutions for a variety of automotive applications

Merck Brings Material Solutions to the Automotive Industry

Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety, and longlasting functionality chips. As materials play a key role in the performance and...

Xperi Sets Out to Enable Immersive Experiences

Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industry as an IP-based technology company focused on chip packaging and interconnects that historically licensed its technology know-how and patents....

Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)

In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment and material suppliers who serve either (or in some cases, both) the front- and back-ends of the semiconductor manufacturing...

Impressions from ECTC 2017

Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had...

Discussing Panel Scale Packaging at SEMI’s Northeast Forum

SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show floor, content that included (pleasant surprise) a full track devoted to advanced packaging topics. Definitely not business as usual. The distinction between where fab processes end and where packaging processes...

The 2016 3D InCites Awards Scholarship goes to Sophie Mathis!

Ever since we first established 3D InCites Awards program in 2013, our intention was to use the funds generated by sponsorship to promote STEM-based education. This year, thanks to the generosity of our platinum sponsor, KLA-Tencor, as well as silver sponsors, Yole Développement, and Amkor Technology, Inc., we are awarding...

EV Group Rolls Out Automated Metrology System for Advanced Packaging, MEMS and Photonics Manufacturing

FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive...