Matches for your search: "SEMICON West"
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG’s NILPhotonics® and Heterogeneous Integration Competence Centers EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed construction of its new Cleanroom...
Why is attending Design Automation Conference (DAC 2020) important for 3D InCites readers? Two of my previous employers – National Semiconductor and VLSI Technology – could not keep up with market requirements. Lack of competitive electronic design automation (EDA) tools limited their engineers’ productivity and eventually both of these –...
We are preparing content for our 2nd annual print edition! 3D InCites is Looking for: Executive viewpoints on today’s megatrends and what’s needed to achieve them. Contributed Technology Features on topics like: Chiplet integration techniques Process improvements for panel and wafer-level fan-out Inspection technologies for heterogeneous integration (HI) Advancements in...
Earlier this year, John Shalf, department head of Computer Science at Lawrence Berkeley National Labs (LBNL) presented a plenary presentation entitled “The Future of Computing Beyond Moore’s Law” (SEMICON West, July 2019). The premise espoused was one which you have read many times in IFTLE, i.e. now that CMOS scaling...
Technology innovations don’t reach customers right away. Since 1980 I have observed how our industry has improved key parameters like cost per function, power dissipation, form-factor, complexity and clock-speed by many orders of magnitude. However, every new technology took at least several years, sometimes more than a decade, until it...
Building on their previous announcements of its embedded interconnect bridge, EMIB, ( see IFTLE 324 “Intel EMIB Implementation in the Stratix MX”) and Foveros technologies (see IFTLE 400 “Intel Logic-Logic 3DIC and Chiplets are Finally Here”), Intel, as a prequel to SEMICON West this year, hosted a media/analyst event to...
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
Picking up where we left off, Part two of this series celebrating advanced packaging innovation takes us from 2009-2019, beginning with the establishment of 3D InCites in 2009. The first conference I covered was the IMAPS Device Packaging Conference in 2009. We officially launched the first website in time for SEMICON...
The number is sobering: according to the U.S. Bureau of Labor of Statistics, 16.9% of chemical engineers and 12.3% of electrical/electronics engineers in the US are women. For racial diversity, the situation is even worse. These grave statistics came to light during a recent panel discussion during SEMICON West, in...
Don’t miss your chance to receive your copy of 3D InCites: the First Decade Take a look inside our 10th-anniversary commemorative issue.: On the Cover: 10 Years of Invent, Innovate, Implement Françoise von Trapp returns to EV Group headquarters for her fourth visit and reminisces about the past 10 years....
