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Supplier Updates from ECTC 2016

In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I also spent a good deal of time talking to industry suppliers to get updates on their latest accomplishments that will impact the future of advanced semiconductor packaging, including interposer integration...

ECTC 2016: Memory Technology Advances and Prospects for Packaging

At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...

DesignCon 2016: Where the Chip meets the Board and Great Ideas Come to Life

DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work for Super Bowl 50. Right across the street from the Convention Center is Levi Stadium, where on Sunday, February 7, this year’s champion will be crowned. Impressive, but let’s not...

European 3D Summit: Putting 3D Packaging To Work

Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the...

Ideas for Co-optimizing Chip-Package Design

In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...

ABC, easy as 123: Does Alphabet Spell Good News for the Semiconductor Industry?

I’m sure by now you’ve all heard or read about the big news at Google: The creation of Alphabet as a holding company, of which Google is now a subsidiary; along with new spin-out companies that were “wacky projects” under the old business model. (David Goldman, CNNMoney’s words, not mine). You...

EV Group Receives 3D InCites Award for Gemini FB XT Automated Fusion Wafer Bonder

ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment....

At AMD, Die Stacking Hits the Big Time

It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the Fiji GPU processor, the first to feature die stacking and high bandwidth (HBM) technology, amidst quite a bit of media fanfare at the E3 gaming conference in Los Angeles and...

How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure

At the 2015 3D InCites Awards Breakfast, which took place July 16, 2015 at the Impress Lounge during SEMICON West, Scott Jones, Director, Alix Partners presented a talk in which he described the positive financial impact interposer and 3D integration will have on the semiconductor manufacturing supply chain. He suggested we think like...