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The people have spoken! The results of last week’s poll are in, and it looks like the majority of those who participated think we should keep it simple. When it comes to heterogeneous integration nomenclature for package architectures, it should be 2D or 3D. The Back Story The term “2.5D”...
SAN FRANCISCO – SEMICON West (11 July 2018) – Edwards Vacuum, a leading manufacturer of vacuum and abatement solutions, announces a milestone of 10,000 Edwards inward fired combustion abatement systems installed worldwide. Edwards calculates that its abatement systems have prevented emissions equivalent to over 14 million tons of carbon dioxide in 2017. “The safety...
The Heterogenous Integration Roadmap Committee wants to create a new nomenclature that does away with 2.5D. Instead, the industry will refer to 2D, 2D enhanced (formerly 2.5D) and 3D architectures. 2D enhanced will be further categorized as 2DS (silicon substrate) or 2DO (organic substrate). We want to know your opinion....
For the past few years, the ECTC committee has provided 3D InCites with a table outside the session rooms, rather than the technology corner, as part of our media trade. We consider it to be prime real estate, as pretty much everyone passes by the table at one time or...
Festivities at ECTC 2018 kicked off May 29, 2018, with a full-day Heterogeneous Integration Roadmap (HIR) Workshop. This workshop was a continuation of an ongoing series that have been scheduled alongside major conferences around the globe so that as many people as possible can participate. We’ve been following the progress...
Burlingame, California – Dec. 6, 2018 – 3D InCites, the premier content platform for heterogeneous integration technologies, today from the 2017 3D ASIP Conference, announced a collaboration with IMAPS International to co-host the 2018 3D InCites Awards, the semiconductor industry’s most prestigious award program recognizing contributions for the development of...
Munich, Germany, November 14, 2017– Merck, a leading science and technology company, is offering material solutions to the next generation automotive applications. Future automotive requires different features from current electronic devices, such as heat resistance, safety, and longlasting functionality chips. As materials play a key role in the performance and...
Xperi is a new entity with a complicated back-story, but a pretty cool vision for its future. First, there was Tessera, well-known throughout the advanced packaging sector of the semiconductor industry as an IP-based technology company focused on chip packaging and interconnects that historically licensed its technology know-how and patents....
In the first part of this series, I covered the perspectives of dimensional scaling vs. heterogeneous integration based on discussions during SEMICON West 2017. For part two, I spoke with equipment and material suppliers who serve either (or in some cases, both) the front- and back-ends of the semiconductor manufacturing...
Let’s start with the indoor rainstorm. I arrived at the Swan and Dolphin in Orlando just in time for the fan-out plenary session of ECTC 2017, so tossed my stuff in my room and headed on in (wearing jeans, no less!) You can read about that here. Afterward, I had...
