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DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work for Super Bowl 50. Right across the street from the Convention Center is Levi Stadium, where on Sunday, February 7, this year’s champion will be crowned. Impressive, but let’s not...
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the...
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...
I’m sure by now you’ve all heard or read about the big news at Google: The creation of Alphabet as a holding company, of which Google is now a subsidiary; along with new spin-out companies that were “wacky projects” under the old business model. (David Goldman, CNNMoney’s words, not mine). You...
ST. FLORIAN, Austria, July 30, 2015—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has received a 2015 3D InCites Award for its GEMINI®FB XT automated fusion wafer bonder in the category of 3D manufacturing equipment....
It’s official. Die stacking and interposer integration have been implemented in a high volume consumer application. AMD officially launched the Fiji GPU processor, the first to feature die stacking and high bandwidth (HBM) technology, amidst quite a bit of media fanfare at the E3 gaming conference in Los Angeles and...
At the 2015 3D InCites Awards Breakfast, which took place July 16, 2015 at the Impress Lounge during SEMICON West, Scott Jones, Director, Alix Partners presented a talk in which he described the positive financial impact interposer and 3D integration will have on the semiconductor manufacturing supply chain. He suggested we think like...
For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D InCites Awards Breakfast, sponsored by Micron, to celebrate innovation in 3D integration and honor those who have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D...
The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous. It has required tremendous investment, and it has required the efforts of the entire supply chain. The industry has experienced a paradigm shift in how it conducts business because of...
Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D...
