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Congratulations to the Winners of the 2015 3D InCites Awards

For the third consecutive year, 3D integration enthusiasts gathered at the Impress Lounge at SEMICON West for the 2015 3D InCites Awards Breakfast, sponsored by Micron, to celebrate innovation in 3D integration and honor those who have contributed significantly to the advancement of innovative processes that enable interposer integration, 3D...

Who Should Win the First 3D InCites Individual Achievement Award?

The journey to the commercialization of 3D integration technologies has been long – longer than most expected – an arduous. It has required tremendous investment, and it has required the efforts of the entire supply chain. The industry has experienced a paradigm shift in how it conducts business because of...

Scott Jones to Deliver Keynote at 2015 3D InCites Awards Breakfast

Phoenix AZ – May 8, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced Scott Jones, director, Alix Partners, will deliver a keynote address titled How 2.5/3D Technologies Will Shake Up the Semiconductor Supply Chain and Cost Structure at the third annual 3D...

The Internet of Things and Semiconductor Test

Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones...

Does 3D Integration Need to Go to HVM To be Real?

Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...

SPTS Technologies’ Sigma fxP PVD System Selected by HuaTian Technologies for 300mm Flip Chip Bumping and CMOS Image Sensor Applications

One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP...