Matches for your search: "SEMICON West"
SEMI did a great job at SEMICON West 2016 organizing a bursting-at-the-seams amount of technical content presented on the show floor, content that included (pleasant surprise) a full track devoted to advanced packaging topics. Definitely not business as usual. The distinction between where fab processes end and where packaging processes...
Ever since we first established 3D InCites Awards program in 2013, our intention was to use the funds generated by sponsorship to promote STEM-based education. This year, thanks to the generosity of our platinum sponsor, KLA-Tencor, as well as silver sponsors, Yole Développement, and Amkor Technology, Inc., we are awarding...
FLORIAN, Austria, July 11, 2016—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG®50 automated metrology system. Designed to support the increasingly stringent manufacturing requirements for advanced packaging, MEMS and photonics applications, the EVG50 performs high-resolution non-destructive...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced new capabilities on the EVG ComBond® automated high-vacuum wafer bonding platform specifically designed to support high-volume manufacturing (HVM) of advanced MEMS devices. These capabilities include a new vacuum bond...
In addition to attending the panel and plenary sessions at ECTC 2016, which took place May 31-June 3, 2016, I also spent a good deal of time talking to industry suppliers to get updates on their latest accomplishments that will impact the future of advanced semiconductor packaging, including interposer integration...
At ECTC 2016, which took place at the Cosmopolitan Las Vegas, Las Vegas, May 31-June 1, 2016, the special session entitled, Memory Technology Advances and Prospects for Packaging may have been one of the “most important starts to ECTC ever.” At least that was TechSearch’s, Jan Vardaman’s impression, and I can’t disagree,...
MEPTEC Luncheons returned big to The Bay Area on Wednesday, May 25, 2016, with a new venue (SEMI HQ), a new joining of forces (IMAPS-MEPTEC-SEMI), a great turn-out (fully committed, capacity-wise, as they say in the restaurant biz), and an inspiring talk by Bill Chen, ASE Fellow and Senior Technical...
DesignCon 2016 at the Santa Clara Convention Center gave football fans among us an opportunity to watch the preparation work for Super Bowl 50. Right across the street from the Convention Center is Levi Stadium, where on Sunday, February 7, this year’s champion will be crowned. Impressive, but let’s not...
Now that we’ve determined that advanced wafer level packaging — including embedded technologies, fan-out wafer level packaging, and 3D packaging — add value to the devices in which they are implemented, the next step is understanding which option offers the best cost/performance ratio for specific product applications. One of the...
In a recent blog sharing my impressions of July’s Semicon West, I complained a bit about the lack of substantial IC packaging topics at this large IC manufacturing conference and also mentioned that I had observed the same problem at June’s Design Automation Conference. I am glad that I was fairly...
