Matches for your search: "SEMICON West"
In Part 1 of this series I drew your attention to what Peter Clarke, writing in EETimes on 02 January 2015, called the “15-in-15: Analog, MEMS and sensor startups to watch in 2015.” What would we find if we were to look for signs of heterointegration in this particular gathering,...
One thought lingers for me today from MEMS Executive Congress US 2014. I heard it said a few years ago, by Rob O’Reilly, a MEMS Industry Group Hall of Famer from ADI, and I heard it again from Peter Merz, whose company, X-FAB, was honored in an open voting process at...
I’m pretty sure the time I got to spend last week at the SEMI High Tech U Graduation ceremonies was the most fun I’ve had all year. The event was held at KLA Tencor in San Jose, CA, November 13, 2014, and I was invited to participate as a guest mock-interviewer, and also to present the...
Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
The winds of change are blowing in the semiconductor industry. And while some cling tightly to the way things have always been, it’s becoming more apparent that for those who can adapt, there are a multitude of opportunities, and for those who think it can stay the same, it will...
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP...
The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry expert judges will determine the winners of each individual category; one Reader’s Choice Award will be decided by you; the registered members of the 3D InCites Community through an Online...
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that Bryan Black, Senior Fellow at AMD, will present this year’s keynote speech at the 2014 3D InCites Awards Breakfast. Co-hosted...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
