Matches for your search: "SEMICON West"
The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry expert judges will determine the winners of each individual category; one Reader’s Choice Award will be decided by you; the registered members of the 3D InCites Community through an Online...
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that Bryan Black, Senior Fellow at AMD, will present this year’s keynote speech at the 2014 3D InCites Awards Breakfast. Co-hosted...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good...
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed image of a 2.5D multi-project interposer wafer. I’ve been saving it for the next time I interviewed him. So it was the first thing I asked him about when I...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream...
