Matches for your search: "SEMICON West"
Herb Reiter, eda2asic, presented this poster presentation titled “The Internet of Things and Semiconductor Test” at the Test Vision 2020 Workshop during Semicon West 2014. Here is the printed transcript of the talk. The accompanying slides referenced in the text can be downloaded as well. In the 1990s cell phones...
Consider for a moment that the ultimate goal of 3D integration is not to achieve high volume manufacturing (HVM) in high bandwidth memory and logic applications for mobile devices, but rather to be an enabler for heterogeneous integration of disparate technologies for everything from medical and automotive applications to industrial...
The winds of change are blowing in the semiconductor industry. And while some cling tightly to the way things have always been, it’s becoming more apparent that for those who can adapt, there are a multitude of opportunities, and for those who think it can stay the same, it will...
One of China’s Leading Semiconductor Packaging Providers Chooses SPTS PVD Solution for new 300mm Expansion Newport, United Kingdom, 8 July, 2014 – SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced that HuaTian Technologies (Kunshan) Co., Ltd. has selected an SPTS Sigma fxP...
The nominations are officially closed for the 2014 3D InCites Awards; and now comes the fun part. This year, while the industry expert judges will determine the winners of each individual category; one Reader’s Choice Award will be decided by you; the registered members of the 3D InCites Community through an Online...
Panel of judges expanded and Reader’s Choice Award added PHOENIX – May 12, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that Bryan Black, Senior Fellow at AMD, will present this year’s keynote speech at the 2014 3D InCites Awards Breakfast. Co-hosted...
Is Si photonics the vehicle that will finally catapult 2.5D and 3D IC to stardom? While that was the story told during an R&D panel at SEMICON West, it’s not exactly accurate. At this week’s 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) which took place Wednesday, December 11, 2013...
What better way to wrap up a busy week at SEMICON West 2013 than a site visit? After three days of interviews and PowerPoints, I was ready for some some hands-on demonstration. Barbara Loferer, marketing manager of Multitest, was concluding an open-house week at the company’s San Jose facility to promote...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. For a long time, the jury was out on the probe-ability of micro-bumped TSV wafers. The jury was also unsure whether or not there was any point to probing to ensure known good...
Streamlined and versatile: that’s the impression I came away with after talking to Nao Shoda, senior director of business development and technology, Alchimer, about recent developments to further optimize the companies’ electrografting processes for through silicon via (TSV), isolation, barrier, seed and fill steps. I wrote about them frequently in...
