Matches for your search: "SEMICON West"
In her opening remarks at the 2013 imec International Technology Forum (ITF), held Monday, July 8, 2013, Karen Savala, SEMI, said it best – this event, preceding SEMICON West, is a great way to set our mindset for the rest of the week. I couldn’t agree more. What I have...
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices St. Florian, Austria, July 8, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced...
Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first...
Fogale Nanotech has been on my radar with its 3D TSV metrology solutions ever since I noticed their booth last summer at SEMICON West. Sometimes it takes an occasion such as a pre-arranged interview at the European 3D TSV Summit for a connection to finally take place. I was happy...
I’ve come across a few interesting announcements in the 3D space today that separately are just random bits of news, but when bundled together, demonstrate acceleration to 3D commercialization. When you think about it, we’re more than halfway to Q1 2013, which has been earmarked by Micron as when 2...
We read a lot about the remaining challenges to be addressed before 3D ICs are fully commercialized. Current roadmaps are now targeting 2015 for commercialization of 3D ICs, while 2.5D gets the ball rolling towards the end of 2012, beginning of 2013. Reports from Xilinx indicate they are shipping 2.5D...
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC technology. The patent describes techniques to obtain low-cost monolithic 3D logic chips with single crystal silicon transistors and high vertical connectivity. In addition to the 5 issued patents, the company...
These days when someone says foundry service one more often than not thinks of large HVM facilities in Asia churning out wafers for companies around the world. Tempe, AZ-based Entrepix however, is a company that breaks that stereotype. It is a provider of CMP and surface conditioning solutions that...
Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can...
It’s easy to see why NEXX is experiencing growth. It’s all about attitude, and the enthusiasm among NEXX’s team is contagious. I spent yesterday afternoon (Thursday, March 5) visiting the company’s new headquarters in Billerica, MA, meeting with the executive team, and touring the manufacturing facility. The team had...
