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Unfortunately, it’s not enough to have customers clamoring for them (3D devices), or that processes, materials and equipment are ready (or almost) and waiting for implementation to fine-tune them; and that EDA and test vendors working feverishly to fill in the design and test gaps; nothing will roll until the...
A few months ago, Andreas Fischer, of the Microsystem Technology Laboratory School of Electrical Engineering Royal Institute of Technology, Stockholm, Sweden, contacted me to tell me about a novel process for filling TSVs that he had been working on from first proof of concept in August 2008, as part of...
While there’s no denying that our registered members, guest bloggers, forum panelists, advisory board, and regular readers are all vital elements of the 3D InCites community, none of this would be possible without the financial input of our advertisers. So I would like to briefly take up some blog space...
Long before he set out on the 3D Holy Grail, Herb Reiter had other pursuits that involved bringing new technologies to market. Most notable is his work with field programable gate arrays ( FPGAs) and application specific ICs (ASICs), which, according to Reiter, actually started out as customer specific ICs...
Although I don’t often get to attend the GSA 3DI IC Workgroup meetings personally, I am on the mailing list and like to share the notes when they come my way. Harrison Beasley, technical working groups manager sent a brief review of the July 12 meeting that took place at...
MonolithIC 3D Inc., a Silicon Valley startup, announced today that it has been issued its fifth patent on monolithic 3D-IC technology. The patent describes techniques to obtain low-cost monolithic 3D logic chips with single crystal silicon transistors and high vertical connectivity. In addition to the 5 issued patents, the company...
I just got back from the IWLPC 2011 in Santa Clara, and my head is full of commentary just begging to be dumped on a page. This year’s agenda was jam packed with 3D discussion — plenary talks by Matt Nowak of Qualcomm and John Lau of ITRI, a panel...
EVG560HBL Significantly Increases Throughput for Volume HB-LED Production
These days when someone says foundry service one more often than not thinks of large HVM facilities in Asia churning out wafers for companies around the world. Tempe, AZ-based Entrepix however, is a company that breaks that stereotype. It is a provider of CMP and surface conditioning solutions that...
Metrology is consistently one of the more challenging areas in the semiconductor field. Whether it’s the monitoring of ultra-small features and defects, or inspecting the backside or bevel of a wafer, the challenges are ever growing. The situation is further complicated by the need for in-line metrology that can...
