Matches for your search: "SEMICON West"
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SET is known in the 3D IC world for its high accuracy die bonder for die-to-die and die-to-wafer stacking. The SET Representative in North America (SETNA) has also launched a companion tool, ONTOS7,...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. After my interview with imec’s Ludo Deferm, I met up with Andrew Ho, global industry director, advanced semiconductor materials, for Dow Corning’s Electronic Solutions, to get an update on Dow Corning’s developments in...
A few months ago, Juergen Wolf, director of the 3D program at Fraunhofer IZM-ASSID, shared with me a beautifully photographed image of a 2.5D multi-project interposer wafer. I’ve been saving it for the next time I interviewed him. So it was the first thing I asked him about when I...
This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. As 3D ICs get closer to volume manufacturing, we’re seeing newcomers joining the 3D IC party with solutions that help along established process flows, and fill in gaps. Longtime suppliers to the mainstream...
First it was going to be memory stacks, then it was Wide I/O DRAM on Memory, and now, as commercialization of 3D ICs gets pushed out further, will it be Silicon Photonics that drives 3D ICs to volume manufacturing? That was the opinion expressed by Michael Liehr, executive VP of...
As 2.5D and 3D IC technologies round the ten-year development mark and volume manufacturing keeps getting pushed just beyond our reach, I’m always looking for a new angle to cover while waiting for ‘The Big One’. As usual, SEMICON West provided the opportunity not only to listen to what invited...
SUSS, being an equipment maker addressing various manufacturing challenges faced by 3D IC enablement, definitely has a lot riding on ensuring that all pieces of the 3D IC puzzle are in place. This was evident from the range of presenters they had lined up during this year’s Technology Forum, held...
In her opening remarks at the 2013 imec International Technology Forum (ITF), held Monday, July 8, 2013, Karen Savala, SEMI, said it best – this event, preceding SEMICON West, is a great way to set our mindset for the rest of the week. I couldn’t agree more. What I have...
Enhanced wafer alignment metrology capability coupled with market-leading GEMINI® FB system creates closed-loop fusion wafer bonding solution to enable high-density TSV devices St. Florian, Austria, July 8, 2013 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced...
Proceeds to Benefit The Frances B. Hugle Engineering Scholarship Phoenix AZ and Austin TX – May 21, 2012 – 3D InCites, the premiere online content source for reliable 3D technology information, and TechSearch International, the leading market research and intelligence firm for advanced semiconductor packaging technology, today announced the first...
