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Semiconductor Industry Forecast: Looking Forward to Balanced Growth in 2025

As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....

SEMICON Europa 2022 Member Preview

SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. We are excited to connect with our community members and industry friends and look...

CyberOptics to Feature Yield-Improving Auto Teaching Systems™ during SEMICON Europa

Minneapolis, Minnesota — October 7, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense®...

CyberOptics to Deliver Technical Presentation About the Importance of 3D Inspection for Advanced Packaging at SEMICON Taiwan

Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...

Rudolph Technologies Launches New Truebump Technology at SEMICON Taiwan 2017

Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the...

3D IC Notes from SEMICON Taiwan 2014

I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from Micron, SK Hynix, Samsung, and Tezzaron. While the world still waits for the introduction of a Wide I/O mobile DRAM and logic part, memory...

SEMI 3D IC Standards Workshop at SEMICON Singapore 2014

SEMICON Singapore 2014 featured a Friday round-table workshop about SEMI 3D IC Standards, which was held to determine local needs for standardization for 3D integration activities, to channel that activity to the right standards organizations. The goal was to trigger a discussion around what the most important standards are for...