Matches for your search: "SEMICON West"
MUNICH, Germany ─ December 20, 2023 ─ SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Edwards as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award. Christine Pelissier, General Manager, Customer Center EMEA of Semiconductor at Edwards accepted the award at SEMICON...
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
Aylesbury, United Kingdom — May 2023 — Nordson TEST & INSPECTION today announced that it will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China, scheduled to take place June 29-July 1, 2023 at the Shanghai New International Expo Center in booth E3014. The Quadra...
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. We are excited to connect with our community members and industry friends and look...
Minneapolis, Minnesota — October 7, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense®...
Minneapolis, Minnesota — August 15, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan. The company will also exhibit WaferSense® and ReticleSense® sensors and feature the...
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the...
Inspired by all the recent attention for the 50th anniversary of Moore’s Law and SEMI’s cool new Infographic series, which reflects the industry’s role in “Making Small Things Makes Big Things Possible,” my colleague and Impress Labs managing partner, Martijn Pierik, took me on a trip down Silicon Valley Memory...
So here I am in Honolulu with my family, celebrating the return of my nephew from a 6 month deployment on a nuclear submarine, and I realize that the co-located IEEE Symposia on VLSI Technology and IEEE Symposia on VLSI Circuits is taking place at the SAME TIME, and there's...
