Matches for your search: "SEMICON West"
As the semiconductor industry moves into the last month of 2024, industry pundits are looking back and then looking forward to seeing what they missed in 2024 and preparing their assumptions for 2025. This post looks at what they are predicting to bring you the 3D InCites Semiconductor Industry Forecast....
Semicon West in July coincides with many analysts’ mid-year forecasts. The SEMI Market Symposium has long been a show staple, kicking off the week and sometimes setting the temperature for the show, and the industry for the remainder of the year. This year, analysts maintain that we are still on...
My sustainability news feed has been filled with articles regarding COP 28, and news of successes and failures regarding the reduction of CO2 levels in 2023. Most of these are focused on the prospect of missing the 1.5°C target set in Paris, the positives and negatives of carbon capture, the...
Minneapolis, Minnesota — August 15, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan. The company will also exhibit WaferSense® and ReticleSense® sensors and feature the...
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the...
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a...
I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from Micron, SK Hynix, Samsung, and Tezzaron. While the world still waits for the introduction of a Wide I/O mobile DRAM and logic part, memory...
SEMICON Singapore 2014 featured a Friday round-table workshop about SEMI 3D IC Standards, which was held to determine local needs for standardization for 3D integration activities, to channel that activity to the right standards organizations. The goal was to trigger a discussion around what the most important standards are for...
For the 8th year in a row, I did NOT attend SEMICON Singapore. But apparently this is the year I should have been there to cover the 3D IC Forum, as it was well attended and had a robust program with 15 speakers and a panel discussion (at least that’s...
