Matches for your search: "SEMICON West"
SEMICON Taiwan is arguably the most influential semiconductor event in Taiwan, reaching records high in terms of scale in its 27 years of history, attracting 700 exhibitors, using a total of 2,450 booths, and organizing more than 20 international forums. This year it will spotlight eight key industry themes: advanced...
Aylesbury, United Kingdom — May 2023 — Nordson TEST & INSPECTION today announced that it will unveil the new Quadra 7 Pro Manual X-Ray Inspection (MXI) system at SEMICON China, scheduled to take place June 29-July 1, 2023 at the Shanghai New International Expo Center in booth E3014. The Quadra...
SEMICON Europa kicks off next week as microelectronics experts and visionaries gather for insights into advanced technologies that are driving industry growth and critical issues such as sustainability, mobility, healthcare, workforce development and supply chain management. We are excited to connect with our community members and industry friends and look...
Minneapolis, Minnesota — October 7, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions, will exhibit at SEMICON Europa 2022, scheduled to take place November 15-18, 2022 at the Messe Munchen in Munich, Germany. The company will feature its next-generation WaferSense®...
Minneapolis, Minnesota — August 15, 2022 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan. The company will also exhibit WaferSense® and ReticleSense® sensors and feature the...
Paper Titled ‘3D Inspection Is Becoming Essential in Advanced Packaging (AP)’ Minneapolis, Minnesota — November 29, 2021 — CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan Dec...
Wilmington, Mass. (September 11, 2017)—Rudolph Technologies, Inc. (NYSE: RTEC) announces new Truebump™ Technology on the Dragonfly™ Inspection System. Truebump Technology provides fast, accurate and repeatable three-dimensional (3D) metrology for all advanced packaging bumping applications, from copper (Cu) pillar, to micro-bumps, and even large C4 bumps. With the Dragonfly system, the...
System integration is moving forward. Denser and high performing systems require advanced packaging, assembly, and test players to move closer together, and they mandatorily need to be involved in the collaboration along the full supply and value chain from the early beginning of new projects. The package is becoming a...
I attended the 3D IC Technology Forum at SEMICON Taiwan 2014, where many of the discussions focused on the latest memory announcements in 3D ICs from Micron, SK Hynix, Samsung, and Tezzaron. While the world still waits for the introduction of a Wide I/O mobile DRAM and logic part, memory...
SEMICON Singapore 2014 featured a Friday round-table workshop about SEMI 3D IC Standards, which was held to determine local needs for standardization for 3D integration activities, to channel that activity to the right standards organizations. The goal was to trigger a discussion around what the most important standards are for...
