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Nordson Test & Inspection today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and...
Visit booth #L0516 to discuss the latest developments in fluid dispensing for advanced semiconductor packaging. Nordson Electronics Solutions, a global leader in electronics manufacturing technologies, will feature the latest technologies in fluid dispensing for semiconductor advanced packaging at the SEMICON Taiwan tradeshow, booth L0516. On display will be the ASYMTEK...
We are excited to let you know that we registered as an exhibitor for the upcoming SEMICON SEA at MITEC, Kuala Lumpur, Malaysia from May 28 to 30. Our booth number at the event is #3813, and we would be happy if you visit us at any time during the...
Carlsbad, CA, USA – 5 March 2024 – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate its latest MARCH and ASYMTEK product divisions equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645. Plasma removes impurities and activates surfaces to enhance flow and adhesion for...
SEMICON China 2024 takes place March 20-22 at the Shanghai New International Expo Centre. This year’s event is expected to draw the attention of the global semiconductor supply chain as the country continues considerable capacity expansion to increase its share of global semiconductor capacity. According to the SEMI Year-End Total Semiconductor...
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. The topic of the week was Shaping a Sustainable $1 Trillion Era. Members weigh in on what their companies are doing to support this...
Last July at SEMICON West, I was honored to witness the dramatic unveiling of UnitySC, the new company formed as a result of Fogale Group’s acquisition of Altatech, resulting in a semiconductor equipment portfolio that spans the spectrum of process control needs for advanced wafer-level and 3D packaging, including metrology,...
Through silicon via (TSV) reveal is a critical part of the wafer-thinning step in 3D IC backside processing, where the wafer is thinned to expose the Cu “nails” that ultimately form the interconnect between die stacks. Some of the risks involved in this step include backside contamination (Cu diffusion) due...
Almost a year ago, Dave Kirsch took over the reins from Steve Dwyer as VP and General Manager of EV Group North America. Since EV Group launched a tool last week at SEMICON Singapore, and since EVG NA’s headquarters are practically in 3D InCites’ back yard, I thought it was...
Note to self: when visiting a class 10 clean room that requires full clean room attire (bonnet, booties, coverall, hood and boots) don’t wear a skirt!
