Matches for your search: "SEMICON West"
I was halfway through my post about my day at Virtual SEMICON Taiwan, when I realized that to do the Global SiP Summit justice, meant it would need its very own post. The live version of the event spanned three full days. That’s a lot of content. While the on-demand...
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at the Ritz-Carlton in Half Moon Bay. Dave Anderson, President, SEMI Americas welcomed everybody and announced that SEMI will celebrate 50 years of service to the semiconductor industry at SEMICON West...
An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced...
Rudolph Technologies, Inc. (NYSE: RTEC) today announced the immediate availability of its new JetStep® lithography systems for advanced packaging processes on wafer and panel formats. The JetStep systems incorporate an option for a new, proprietary submicron lens design, as well as up to 25% increased productivity over the previous JetStep...
Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a...
NIJMEGEN, THE NETHERLANDS – November 08, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, has reached a milestone this month celebrating 15 years of business. As a testimonial of its success, the company recently won the entrepreneurial prize from the Dutch financial institution...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
This week, at the invitation of SEMI Southeast Asia, I made the monumental trek from Phoenix, AZ to Singapore to attend SEMICON Singapore. While I know many of my industry colleagues make these journeys in the regular course of business, this was a new experience for me and my first...
I didn’t make it to the SEMICON Taiwan SiP Global Summit this year and was hoping to find some coverage by other journalists so that I could at least curate and share the information on the 3D IC Technology Forum. Unfortunately, I didn’t see anything posted on the topic, but...
SEMICON Singapore gets underway next week (May 19-21), and the 3D track speaker line-up features presentations by several 3D InCites partners. If you plan on attending, be sure to put these sure-to-be interesting talks on your personal agenda.
