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Taking place from September 3-6, SEMICON Taiwan 2024 is just around the corner. With this year’s theme, Breaking Limits: Powering the AI Era, the event will showcase how the semiconductor industry is driving AI technology. We’re excited to share that SEMI, one of our member companies, has achieved record sales...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its...
LB Semicon to Use Next-Generation Vacuum Curing Technology in WLCSP Bump/RDL Application FREMONT, Calif., Jan. 23, 2023 — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has sold a VertaCure XP G2 system to Korea’s LB...
From January 14 to 16, 2020 SEMI welcomed about 300 high-level executives to the Industry Strategy Symposium (ISS 2020) at the Ritz-Carlton in Half Moon Bay. Dave Anderson, President, SEMI Americas welcomed everybody and announced that SEMI will celebrate 50 years of service to the semiconductor industry at SEMICON West...
An essential part of successfully introducing a new technology is to educate engineers and managers on its benefits and tradeoffs. That’s why Wiley started publishing the Handbook of 3D Integration Series with Volume 1 and 2 in 2008, followed by Volume 3 in 2014. This blog covers Volume 4, introduced...
Wafer and panel-level packaging (WLP/PLP) offers technical and business advantages, compared to traditional IC packages. These cost-effective packaging solutions attracted more than 800 industry experts to the International Wafer Level Packaging Conference (IWLPC 2018) in San Jose’s DoubleTree Hotel at the end of October. In case you were wondering, a...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled its next-generation laser debonding solution, which enables high-throughput, low-cost-of-ownership (CoO) room-temperature debonding for ultra-thin and stacked fan-out packages. Designed as a module for integration in the company’s benchmark EVG®850...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it is demonstrating optimized pre-processing solutions for the implementation of plasma dicing for advanced semiconductor packaging applications. EVG’s latest products and process development services support this emerging semiconductor back-end...
Collected impressions of 2016 to date: the unfortunate passing of too, too many favorite musicians; the hard-to-escape-from strident bellicosity of our national political campaigns; a winter of welcome, abundant, Northern California rains; along with a plethora of riches in the Silicon Valley conference, symposium, and seminar vein. Take the January...
MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs simulator tool. Industry professionals from 35 countries across the globe have downloaded the tool directly from the company’s website over 240 times. The MonolithIC 3D team has developed the open-source...
