Matches for your search: "SEMICON West"
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, announced that it is highlighting its industry-leading IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, as well other wafer bonding and lithography technologies, at the SEMICON Korea 2025...
With SEMICON Europa not too far behind us, the industry is already gearing up again for SEMICON Japan. Taking place from December 11-13, this year’s Japan event will feature interactive sessions that we haven’t seen before, including Yoichi Ochiai’s Passion Lab and SEMICON Stadium, where participants will get to engage...
3D InCites is excited to head to Munich this November for another incredible SEMICON Europa event! With three feature presentations, booth parties, and dozens of presentations from 16 member companies, there’s something for everyone to look forward to. From November 12-15, SEMICON Europa attendees will get access to hundreds of...
Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions at Messe München on November 12-15, 2024. At electronica Booth A3.358, our team of experts will be on hand to discuss how our AOI, SPI and DPI solutions boost your quality and...
Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of...
SEMI launched its 20 Under 30 Award Program at SEMICON West in 2022 to recognize the industry’s brightest young leaders who demonstrate outstanding leadership, practice productive collaboration, exhibit a commitment to success, make a significant difference, and actively engage in community. Candidates can come from different areas of the microelectronics...
HAYWARD, CA January 14, 2022: Gel-Pak, a Delphon company and worldwide leader in protective carriers for optoelectronic devices, will showcase its new micro textured device carrier at Photonics West from January 25-27 in San Francisco, CA. Gel-Pak’s new TXF film carrier uses a unique micro texture to secure and protect...
As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I am curious to understand why we, as humans, are driven to develop technology that will surpass us...
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation...
While at first glance, 3D integration technologies seem to be relegated to one two-hour session at this year’s SEMICON Europa, which takes place October 7-9, 2014 in Grenoble, France; in reality 3D integration is a pervasive technology that will be discussed in many different programs and sessions. To make it...
