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SEMI launched its 20 Under 30 Award Program at SEMICON West in 2022 to recognize the industry’s brightest young leaders who demonstrate outstanding leadership, practice productive collaboration, exhibit a commitment to success, make a significant difference, and actively engage in community. Candidates can come from different areas of the microelectronics...
Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its...
LB Semicon to Use Next-Generation Vacuum Curing Technology in WLCSP Bump/RDL Application FREMONT, Calif., Jan. 23, 2023 — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has sold a VertaCure XP G2 system to Korea’s LB...
HAYWARD, CA January 14, 2022: Gel-Pak, a Delphon company and worldwide leader in protective carriers for optoelectronic devices, will showcase its new micro textured device carrier at Photonics West from January 25-27 in San Francisco, CA. Gel-Pak’s new TXF film carrier uses a unique micro texture to secure and protect...
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized...
As one of the current key drivers of the semiconductor industry, the development of robots with artificial intelligence has been on my mind quite a bit recently, second only to autonomous vehicles. I am curious to understand why we, as humans, are driven to develop technology that will surpass us...
In April 2016, Fogale Nanotech Group acquired the assets of Altatech Semiconductor from Soitec in order to combine the metrology offerings of Fogale Nanotech Semicon with Altatech’s unique 2D and 3D inspection capabilities. The idea was to create a powerhouse of process control for emerging advanced packaging processes for next-generation...
As we move into the final quarter of the year, October marks the annual gathering of Europe’s microelectronics industry at SEMICON Europa. This year’s show, which took place October 6-8, 2014, once again attracted the leading players from across the industry value chain, but with an added French twist of...
While at first glance, 3D integration technologies seem to be relegated to one two-hour session at this year’s SEMICON Europa, which takes place October 7-9, 2014 in Grenoble, France; in reality 3D integration is a pervasive technology that will be discussed in many different programs and sessions. To make it...
MonolithIC 3D Inc., a Silicon Valley startup specializing in 3D ICs, announces a milestone with its 2D and 3D ICs simulator tool. Industry professionals from 35 countries across the globe have downloaded the tool directly from the company’s website over 240 times. The MonolithIC 3D team has developed the open-source...
