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EVG achieves RANKED 1st status across all participating award categories, including first-place finishes in “10 BEST” and “THE BEST” suppliers segments as well as lithography equipment for the first time EV Group (EVG) today announced that customers have once again voted it as one of the 10 BEST Focused Suppliers...
It is popular for mainstream media to publicize different industry’s energy consumption and environmental habits. The semiconductor industry is not immune to this occasional finger-pointing concerning energy consumption, water consumption, and hazardous chemicals that are used to produce the chips that are ubiquitous in our daily lives. Major publications highlight...
SEMI University In-Person Courses Aim to Help the Semiconductor Industry Workforce Build Skills, Advance in Careers Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University™ learning platform to include in-person training. Complementing SEMI U online...
From November to April for the past seven years, I have spent a considerable amount of time on the snow as a ski instructor. In 2019 the International Ski and Snowboard Federation implemented a ban on fluorinated waxes that took place in July of 2021. The change left skiers scrambling,...
Innovative bonding materials presented at leading Asia technology conferences Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan...
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding and metrology solutions for heterogeneous integration, and NIL solutions for meta-optics and AR waveguide manufacturing ST. FLORIAN, Austria, August 29, 2023—EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced...
Heterogenous integration in microelectronics requires advanced materials Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON...
SEMICON Europa is back! On the agenda? The latest innovations and smart applications powering the next wave of semiconductor industry growth, including leading-edge technologies such as artificial intelligence (AI), 5G and robotics. SEMICON Europa 2021, co-located with Productronica, will examine how the semiconductor industry can integrate environmental and social sustainability...
SEMICON Europa was an island in the vast sea of Electronica. It occupied one hall out of 18. But without that hall full of equipment, process, and material suppliers, the other 17 wouldn’t have any reason to exist. Think about that for a bit. There’s a reason “Semiconductors drive smart”...
In the past 10 weeks, I’ve attended five conferences: two in Europe, and three in California. Two focused on MEMS and sensors, two on advanced packaging, and one that tied everything all together. At all of these events, the themes were consistent: advanced packaging rules; automotive and IoT is driving...
