Matches for your search: "SEMICON West"
SEMI, together with FlexTech, the MEMS & Sensors Industry Group, the Nano-Bio Materials Consortium (NBMC) and NextFlex, held FLEX/MSTC 2020 at the DoubleTree in San Jose from February 24 to 27. Executives from above industry organizations and their member companies presented current capabilities of flexible hybrid electronics (FHE), MEMS and...
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today unveiled the new SmartView® NT3 aligner, which is available on the company’s industry benchmark GEMINI® FB XT integrated fusion bonding system for high-volume manufacturing (HVM) applications. Developed specifically for fusion...
Automotive electronics, with the Holy Grail being fully autonomous vehicles, is currently being touted as one of the biggest growth drivers for the semiconductor industry. So much so, that every event I’ve attended so far this year has featured sessions, presentations, keynotes, and panel discussions espousing the benefits of autonomous...
Heterogeneous Integration Versus Dimensional Scaling; One Year In (Part 2)At SEMICON West 2016, the big story was the end of the ITRS Roadmap for dimensional scaling according to Moore’s Law and the birth of the Heterogeneous Integration Roadmap (HIR). There were many reasons for this: the cost of continued scaling...
Françoise promised in her recent blog that my ECTC blog would follow shortly. Finally, after attending DAC in Austin as well as the iMAPS’ SiP Conference in California’s Wine Country and shortly before attending Semicon West in San Francisco, I found some time to report what I saw and learned...
Part 1 of my DAC 53 reporting focused on this year’s really impressive keynotes, now posted on the DAC website, together with videos of other remarkable pavilion presentations, panels, interviews, demos, etc.…. Part 2 will cover a few highlights that I found very interesting and useful at DAC. Considering that...
The semiconductor fabrication industry has been wandering in something of a wilderness recently, what with the continued delays in EUV lithography as a production-ready technology, 450mm gone quiet, ‘teenage’ FinFET costs zooming, and the baton in single-digit nanometer FinFET passing from Intel to IBM and its partners. It’s a situation...
As 3D integration technologies become established in low volume manufacturing, the supply chain is gearing up to address high volume manufacturing challenges so that ultimately, these technologies can be used in consumer products. Cost is king, and industry-wide efforts are focused on lowering it. We talk a lot about optimizing...
I’ve been following the Alchimer story as it unfolds ever since I first started following the course of 3D integration in 2009. In my opinion, the technology has been cool and disruptive pretty much since day one. The wet, electrochemical process that enables growth of nanometric films offers an elegant,...
Ever since SEMICON West 2014, I’ve been seeing a lot of coverage of the 2.5D and 3D adoption question on Semiconductor Engineering, an industry content platform that covers the spectrum of semiconductor topics, and occasionally covers 2.5D and 3D, providing the perspective of chip architects, engineers, end users, industry organizations...
