Matches for your search: "SEMICON West"
Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week, a significant piece of news slipped right by usually alert 3D radar for TWO WHOLE DAYS! On Tuesday, Micron issued a press release announcing a collaboration with Intel to deliver an...
Proceeds to Benefit STEM-based Scholarship Programs PHOENIX– March 18, 2014 – 3D InCites, the premier online content source for reliable 3D technology information, today announced that it has partnered with SEMI and TechSearch International to host the second annual 3D InCites Awards. Proceeds of the 2014 awards program will fund...
We have a guest contribution today from Brian Cronquist, MonolithIC 3D Inc.’s VP of Technology & IP. Brian discusses about MonolithIC 3D Inc.’s participation at Semicon West 2013. Thanks to everybody who came by the Silicon Innovation Forum poster session at SEMICON West 2013. We really enjoyed talking with you about...
That was my kick-off question for Manish Ranjan, Vice President, Product Marketing, Advanced Packaging/Nanotechnology Segment at Ultratech, during our annual SEMICON West Thursday wrap-up discussion. It’s never been planned that way, but I always seem to interview Ranjan at the tail-end of SEMICON West, and subsequently end up bouncing a...
For me, SEMICON West involves a careful balance of attending sessions, keynotes and panels, combined with one-on-one interviews with thought leaders in 3D ICs, as well as manufacturing suppliers who have the onerous task of developing, promoting, and selling the next great solution for 2.5D and 3D IC manufacturing. Over...
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge to witness the inaugural 3D InCites Awards Breakfast, held July 11, 2013 during SEMICON West. For me, it was especially significant as it marked four years since I first launched...
For most of July I focused on coverage of SEMICON West in 3D. Today, I thought I’d take a look at what else people were talking about in 3D space over the past few weeks. The Water Cooling IssueTwo bloggers took on the topic of water cooling 3D IC assemblies...
At SEMICON West 2011, Prof. Rao Tummala of Georgia Tech presented the unique glass and silicon-based 3D Interposer technologies being developed at Georgia Tech, claimed to be simpler and cheaper than 3D ICs with TSV for many mobile and consumer applications at SemiconWest 2011. in his presentation, Tummala discussed the...
In this brave new world powered by consumer electronic devices that cater to the user experience, smartphones and tablets are in the driver’s seat; pushing researchers to the very limits of possibility. At imec’s technology form on Smartphones, held for the first time during SEMICON West, researchers from the institute...
Last year, it was all about through silicon vias (TSVs), this year, it’s all about everything else needed to achieve 3D IC stacks using TSVs. I’m talking about 3D IC technology discussions at this year’s SEMICON West. A clear example of this was SUSS MicroTec’s workshop on wafer thinning...
