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EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024

Presentations to highlight breakthrough capabilities of EVG’s maskless lithography, hybrid bonding and IR laser release solutions for heterogeneous integration; EVG sees continued strong growth in region EV Group (EVG) today announced that it will highlight key advances in 3D integration process solutions, including hybrid and fusion wafer bonding, infrared (IR)...

SEMICON Europa Advanced Packaging Conference

SEMICON Europa 2024 Call for Abstracts Opens

Presentation abstracts are now being accepted for the Advanced Packaging Conference, Fab Management Forum, and MEMS & Imaging Sensors Summit SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share...

The Big Game

There’s nothing quite as exciting as watching a major sporting event when rival teams meet head-to-head. Even if you don’t have a vested interest in either team, you still get caught up in the excitement of the game itself. That’s sort of how I feel when I get back-to-back...

EV Group’s GEMINI Wafer Bonding System First to Pass Equipment Maturity Assessment within SEMATECH’s Interconnect and Manufacturability Program

SEMICON West, San Francisco, Calif., July 10, 2012 — EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its GEMINI® Automated Wafer Bonding System has become the first product to pass a systematic, rigorous Equipment Maturity Assessment...

3D R&D Update, As Told by the Experts

The R&D centers were out in full force at this year’s SEMICON West, presenting on their latest activities in all areas of 3D technologies, from 3D transistors, to 3D ICS, to full-blown 3D Systems. I was able to attend a smattering of presentations at events hosted by imec, CEA-Leti, SEMATECH...

Outside the 3D TSV Box

As much as the industry is intent on holding 3D technologies to a narrow definition, I'm compelled to remind readers that before 3D had to include a TSV interconnect to be considered a 3D technology, and before the term 2.5D had been coined, 3D packaging was already being touted as...

Hey Intel, get your own buzzword…

So there I was, listening to Eric Beyne talk about the importance of co-developing advanced CMOS and 3D ICs because one directly affects the other, when my thoughts turned to once again to FinFets (is this what he means by advanced CMOS?) I wondered whether these so-called 3D transistor structures...

Back by Popular Demand

Once again, I can’t let my follow-up coverage of SEMICON West go by without reporting on my annual briefing with Manish Ranjan, of Ultratech. This year I even got a gift! It was little rubber-like replica of the company’s latest lithography tool that encased a 4G flash drive.  (Those little...

3D InCites and MIG: A Natural Fit

You know how sometimes you feel like you know a person you haven’t actually met because you read something they wrote or sat through a presentation? And then when you finally meet face to face, it’s like meeting an old friend, “Oh you’re so-and-so!! I feel like I already KNOW...

Manish’s Market Moment

For me, SEMICON West is never complete until I’ve had my sit-down with Manish Ranjan of Ultratech. He follows the market, and somehow puts it all into perspective for me, often supporting my own intuition with hard data. Plus he’s a wealth of historical...