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The New Heterogeneous Integration Roadmap: Seeing Beyond the Lamp Post

If you, like me, have been wondering about when and where it was you last saw an International Technology Roadmap for Semiconductors update, wonder no more. You didn’t miss the update; rather, it just never really came. (See FvT’s piece on Bill Bottoms and “Revamping the ITRS Roadmap” from March...

Taking 3D Integration to the Next Level

There is no rest for the weary. Just because we can finally declare that 3D ICs are in production doesn’t mean we’re done working on it. To the contrary, efforts are ongoing at research institutes like imec in Belgium and Leti in France to take 3D integration to the next...

3D InCites Opens Nominations for the 2015 3D InCites Awards

Phoenix AZ – March 26, 2015 – 3D InCites, the premiere online content source for reliable 3D technology information, today announced it has partnered with Impress foundation to co-host the third annual 3D InCites Awards during SEMICON West 2015. 3D InCites also announced this year’s proceeds will fund two STEM-based...

Semiconductor Equipment Manufacturer Consolidation Update

It was a much-talked-about topic this year at SEMICON West 2014 (SW2014) – this trend of semiconductor equipment manufacturer consolidation. Just in the past year, we’ve read the headlines about Applied Materials (AMAT) and Tokyo Electron ‘s (TEL) impending merger; LTX Credence’s acquisition of Multitest, Everett Charles, Technologies and atg...

Courtesy of Apple and IBM

Apple and IBM on the Way to Demonstrate That ONE plus ONE is More Than TWO

Tuesday’s (July 15) Nightly Business Report surprised me with an – in my view – very important announcement: Apple and IBM are going to cooperate to offer enterprise solutions. See more about this significant step here and in many other headline news coming out this week. The former rivals are...

wet etch

SSEC’s New Chemistry for TSV Reveal

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. SSEC had a lot to celebrate at this year’s SEMICON West, 2013. The company launched two new equipment platforms, WaferStorm and WaferEtch, each configuring single wet wafer processes for specific applications. Two of...

EV Group: Never a Dull Moment

This is part of a series of short interviews, based on face-to-face meetings at SEMICON West 2013. Sitting down with EV Group execs to talk about the company’s latest achievements and contributions to the 3D IC cause has become an annual SEMICON West tradition. In fact, I’ve probably spent more...

Industry Collaboration: Everybody’s Talking About It

Well, I missed half of Monday's activities at SEMICON West thanks to a two hour flight delay. I skidded into the imec ITF just in time to catch the tail end of Luc Van den hove's technology overview.  He was saying that the requirements of smart devices communicating with the Cloud...

SPTS – It’s all in the Timing

One year ago today, I was sitting with David Butler and Kevin Crofton, of SPTS, at the company headquarters in Newport, Wales, talking about the whirlwind year they’d just had, how well the company was doing since the merger of STS and Aviza, and the advantages of being part of...