First-Mover Advantage: Fan-Out Panel Level Packaging at IWLPC 2016
“It is better to be first than it is to be better.” (Ries and Trout, in The 22 Immutable Laws of Marketing.) Or is it “Fast Followers Not First Movers Are The Real Winners?” Fan-Out Wafer Level Packaging has built up such a head of steam this year (see “iPhone...
