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SEMICON West 2022 coming up next week will kick-off, at least for the time being, the back to post-COVID normal for SEMI events. SEMI will be back on its normal schedule, and as concerns regarding COVID 19 are on a slow simmer, healthy attendance should be expected. We can expect...
On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four categories: • The Most Competitive Products of Optical Communication • Excellent Quality Award • Outstanding Technology Award • Brand Recommended...
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2021 Silver Honoree for the Laser Focus World Innovators Award in the Manufacturing Equipment for Photonic Components category. The MRSI-H-TO was recognized for an innovative design that...
The 17th Annual Device Packaging Conference (DPC 2021) will be held as an online global event, from April 12-15, 2021. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). Conference attendees can expect more than 65 on-demand session speakers across three technical tracks and 16 sessions. Recorded technical...
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are garnering more attention. Although the application segments are different, there is a commonality in how voltage conversion and power distribution are achieved at the system level. System demands are becoming...
Two years ago, IMAPS tested the waters for a new conference focused entirely on system-in-packaging (SiP) technologies. They had also recently acquired the 3D Architectures for Semiconductor Integration and Packaging Conference (3DASIP), originally produced by RTI Tech Venture Forum, which took place annually in December in San Francisco. The IMAPS...
The cynic inside often thinks “All hat, no cattle” about the newest new, new thing (right, Michael Lewis?). But if you were to consult the Gartner Hype Cycle listings from 2008 as I just did you would find, perhaps to your surprise, that Cloud Computing, 3-D Printing, Solid-State Drives, and...
The Winter Games are over and the athletes returned home, and the SEMICON Korea 2018 teams from February have their sights on SEMICON China this month after all that snow-in-Seoul settled, but I still have a few more comments about the Electropackage System and Interconnect Product technical session SEMI organized...
Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t...
It’s a good story that’s been 30 years in the making. From its founding by Erich and Aya Maria Thallner in 1980 and subsequent launch of the world’s first double-sided mask aligner for the emerging MEMS market five years later; to its most recent industry-first launch of a fully-automated wafer...
