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Whether we start calling it Chip Canyon, the Silicon Zone, or Silicon Diyógí (say Dare-yo-ghee), it looks like Arizona is on track for becoming the epicenter of semiconductor resurgence, not just in the U.S. but in all of North America. And we have the collective visions of Governor Katie Hobbs,...
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS 2024 to take stock of the economic trends and market drivers to set their corporate strategies for 2024. Appropriately, the weather outside the Ritz-Carlton, overlooking the Pacific Ocean, matched the...
The 55th International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS) starts next week in Boston with a focus on PACKAGING TECHNOLOGIES ENABLING THE NEW NORMAL. The technical program will span three days of sessions with emphasis on packaging technologies that serve 5G, High Performance Computations, Automotive, Industrial,...
While I am very dedicated to my role as a blogger for the semiconductor industry, there is one thing to which I am more dedicated: A good night’s sleep. So for the Live days of ISS Europe 2021, I only attended the panel discussions that were scheduled at 7 am...
Substrate capacity remains tight for both flip chip ball grid array (FC-BGA) substrates and laminate-based chip scale packages (CSPs). Substrate suppliers are adding capacity to meet the demand for FC-BGA substrates for server, graphics processor, and networking applications, but demand continues to outstrip supply. Regardless of the package type—whether silicon...
As predicted, 2020 will go down as the year 5G hit the big time. But it got off to a rocky start. Back in January, the semiconductor industry—and the world as a whole—had high hopes for the 5G rollout. Then COVID-19 hit, and two things happened. First, progress on the...
At last month’s IMAPS Device Packaging Conference, when I was not in keynote sessions, I was spending time chatting with industry colleagues to get their take on industry drivers. In all honesty, there was less talk about technology and more about the Coronavirus, which was still just barely hitting US...
It’s official. The world is becoming more data-driven by the second and everything – I mean EVERYTHING – hinges on the success of 5G. 5G will make smart factories more efficient; bring medical care to remote places; make the autonomous vehicle infrastructure possible so you stop rear-ending the person in...
The 2021 3D InCites Awards program recognized industry-wide contributions in the development of heterogeneous integration and 3D technologies. We expanded our scope of coverage, adding a special focus on sustainable manufacturing efforts, as well as diversity equity and inclusion (DEI) with two special award categories. Like every other awards event in the...
