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If we look at the semiconductor industry expansion during the last 25 years, adoption of design IP in every application appears to be one of the major factors of success, with silicon technology incredible development by a x100 factor, from 250nm in 2018 to 3nm (if not 2nm) in 2023. We foresee the move to […]
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Once again, Cassandra Melvin, SEMI Europe, takes over the mike from Françoise von Trapp to lead a panel discussion on the Future of Work in the semiconductor industry. We join the panel discussion in progress, as it was part of a session on the Future of Work that took place in Munich during SEMICON Europa. […]
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The Arizona Commerce Authority (ACA) has announced a $17.5m investment in Arizona State University (ASU) to expand Arizona’s advanced semiconductor manufacturing capabilities. The expansion will enhance Arizona’s fan-out wafer-level packaging R&D and workforce training capabilities and drive the creation of a gallium nitride (GaN) manufacturing and research ecosystem in the state to enable technology of […]
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Who wins, who loses, and where are the big challenges for multi-vendor heterogeneous integration. The post Proprietary Vs. Commercial Chiplets appeared first on Semiconductor Engineering.
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Innovation in Europe’s semiconductor industry shows growth can remain consistent with a net zero roadmap. The post Shaping A Sustainable $1 Trillion Era appeared first on Semiconductor Engineering.
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In this episode, which was recorded live at SEMICON Europa 2023, Françoise hands over the mike to Cassandra Melvin, Senior Director of Business Development and Operations at SEMI. She led the session during the Fab Manager Forum on How To Cultivate the Workforce of Tomorrow and moderated a panel discussion on Achieving EU Ambitions Through […]
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Finding defects in stacked die is a daunting challenge. Equipment, processes, and methodologies all need modifications, and that’s just for starters. The post Closing The Test And Metrology Gap In 3D-IC Packages appeared first on Semiconductor Engineering.
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At the recent RISC-V Summit, the very last session was a panel about chiplets called Chiplets in the RISC-V Ecosystem. It was moderated by Calista Redmond, the CEO of RISC-V International. The panelists were: Laurent Moll, COO of Arteris Aniket Saha, VP of Product Management of Tenstorrent Dale Greenley, VP of Engineering of Ventana … […]
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It’s no secret: the semiconductor industry is at a crossroads. Keeping the Pace of Moore’s Law through Industry Collaboration was posted by Shannon Davis on Semiconductor Digest.
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In this episode, Françoise von Trapp hands over the mike to imec’s Katrien Marent, who hosted imec’s ITF Towards NetZero at SEMICON Europa. She introduces a panel discussion on Collaborative Strategies and Practical Solutions Toward a More Sustainable Semiconductors Future. The panel kicks off by polling the audience on what they think are the most […]
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Engineering alumnus’ discovery laid the foundation for advanced packaging, system integration research. Purdue’s New Institute for Advanced System Integration and Packaging Honors Boilermaker and Innovative Visionary in Semiconductors was posted by Shannon Davis on Semiconductor Digest.
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China’s ‘Big Fund’ is investing $1 billion in another in another domestic foundry, to advance sub-10nm chip manufacturing. HLMC (Huahong’s Shanghai Huali Microelectronics Corp.) is the recipient, and will use the funds to help it continue developing new process technologies.
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This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. The topic of the week was Shaping a Sustainable $Trillion Era. Members weigh in on what their companies are doing to support this effort. They also discuss their impression […]
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The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.
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Delayed German budget may have a drastic effect on German subsidies for new Intel’s and TSMC’s fabs in the country.
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This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about […]
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The global semiconductor market is now solidly in a turnaround. WSTS revised its data for 2Q 2023 growth over 1Q 2023 to 6.0% from 4.2% previously. 3Q 2023 was up 6.3% from 2Q 2023. With our Semiconductor Intelligence forecast of 3% growth in 4Q 2023, the year-to-year growth in 4Q 2023 will be a positive […]
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In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners. You’ll learn about the driving applications for advanced IC […]
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Today, the Biden-Harris Administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program was posted by Shannon Davis on Semiconductor Digest.
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Workflows and tool integration are disconnected, mechanical stress is ill-defined, and co-planarity is nearly impossible. But there are solutions on the horizon. The post What Can Go Wrong In Heterogeneous Integration appeared first on Semiconductor Engineering.
