|
Engineering alumnus’ discovery laid the foundation for advanced packaging, system integration research. Purdue’s New Institute for Advanced System Integration and Packaging Honors Boilermaker and Innovative Visionary in Semiconductors was posted by Shannon Davis on Semiconductor Digest.
|
China’s ‘Big Fund’ is investing $1 billion in another in another domestic foundry, to advance sub-10nm chip manufacturing. HLMC (Huahong’s Shanghai Huali Microelectronics Corp.) is the recipient, and will use the funds to help it continue developing new process technologies.
|
This episode features conversations with 3D InCites members who attended or exhibited at SEMICON Europa 2023, which took place in Munich, Germany from November 14-17, 2023. The topic of the week was Shaping a Sustainable $Trillion Era. Members weigh in on what their companies are doing to support this effort. They also discuss their impression […]
|
The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.
|
Delayed German budget may have a drastic effect on German subsidies for new Intel’s and TSMC’s fabs in the country.
|
This episode was recorded live from Munich, as the official podcast of SEMICON Europa. The theme of this year’s event is Shaping a Sustainable $1 Trillion Era. Françoise von Trapp talks with some of the keynote speakers about the roles their companies play in achieving this goal. talking with some of the Keynote speakers about […]
|
The global semiconductor market is now solidly in a turnaround. WSTS revised its data for 2Q 2023 growth over 1Q 2023 to 6.0% from 4.2% previously. 3Q 2023 was up 6.3% from 2Q 2023. With our Semiconductor Intelligence forecast of 3% growth in 4Q 2023, the year-to-year growth in 4Q 2023 will be a positive […]
|
In this episode, Françoise von Trapp talks with AT&S’s Markus Leitgeb and Tony Gueli, about the complex world of IC substrates for advanced microelectronics. The conversation focuses on technical and commercial challenges, and how they can be overcome when you work with the right substrate partners. You’ll learn about the driving applications for advanced IC […]
|
Today, the Biden-Harris Administration announced its vision to boost U.S. capabilities for advanced packaging, a key technology for manufacturing state-of-the-art semiconductors. CHIPS for America Releases Vision for Approximately $3 Billion National Advanced Packaging Manufacturing Program was posted by Shannon Davis on Semiconductor Digest.
|
Workflows and tool integration are disconnected, mechanical stress is ill-defined, and co-planarity is nearly impossible. But there are solutions on the horizon. The post What Can Go Wrong In Heterogeneous Integration appeared first on Semiconductor Engineering.
|
Beyond the ICT industry, imec aims to guide academics and policy makers with actionable data. Imec Grants Public Access to Virtual Fab for Quantifying Environmental Impact of IC Manufacturing was posted by Shannon Davis on Semiconductor Digest.
|
Chinese companies go above and beyond to get wafer fab tools from American companies.
|
Unexpected problems that can develop across the whole RDL stack. The post Total Overlay With Multiple RDL Layers appeared first on Semiconductor Engineering.
|
The global system in package (SiP) technology market is growing at a CAGR of 8.4% from 2020 to 2027. System in Package (SiP) Technology Market Worth $22.01B by 2027 was posted by Shannon Davis on Semiconductor Digest.
|
SEMI announced today that Industry Strategy Symposium (ISS) 2024 will be held January 7-10 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Ready, Set and Ramp? Industry Strategy Symposium 2024 to Highlight Chip Innovation and Business Opportunities on Path to $1 Trillion was posted by Shannon Davis on Semiconductor Digest.
|
The emerging interconnect architecture of signal nets and power delivery networks call for an innovative EDA tools with ultra-large data capacity and scalable compute technology. The post 3D Heterogenous Integration: Design And Verification Challenges appeared first on Semiconductor Engineering.
|
United Microelectronics Corporation, a global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products. UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI was posted by Shannon Davis on […]
|
What’s needed to secure data across multiple chiplets and interoperable systems. The post Data Leakage In Heterogeneous Systems appeared first on Semiconductor Engineering.
|
Diversity leads to more successful businesses. Men and women can capitalize on each other’s abilities by learning about differences and viewing them as strengths. The post Wired for Success: Women in Electronics appeared first on EE Times.
|
This Member Spotlight episode was recorded live at the IMAPS International Symposium. Françoise von Trapp speaks with community members who attended and exhibited about what they were showcasing, and what they learned. They shared their opinions on everything from the possibility of the U.S. onshoring advanced packaging technology in high volumes, to the impact of […]
