Recommended Reads

IBM’s Scott Sikorski Demystifies The CHIPS Act; Amkor’s Mike Kelly and ASE’s Ou Li Talk Chiplets

Aug 14, 2023 | 3D InCites Podcast

This episode was recorded live at IMAPS CHIPCon, where experts in heterogeneous integration and chiplet-enabled advanced packaging schemes gathered to address some of the semiconductor manufacturing industries most pressing technical and industry-related challenges. Françoise von Trapp speaks with Scott Sikorski, of IBM who demystifies the complexities of the CHIPS Act, and the opportunities available for […]

Semiconductor Industry Is Pulling AI Across A Diversity Of End Uses And Applications – SemiEngineering

Aug 09, 2023 | SemiEngineering

A successful AI outcome depends on how educated your customers are about their own data sets. The post Semiconductor Industry Is Pulling AI Across A Diversity Of End Uses And Applications appeared first on Semiconductor Engineering.

SEMICON West 2023 3D InCites Member Spotlight

Aug 09, 2023 | 3D InCites Podcast

Françoise von Trapp speaks with 3D InCites Member companies who exhibited and or attended SEMICON West 2023. She posed one main question, based on the show’s three key topic areas. What role do they play in helping the semiconductor industry succeed in becoming a $1T industry by 2030, how are they addressing the path to […]

Former U.S. Officials Urge New Export Alliance on China – EE Times

Aug 09, 2023 | EE Times

Current export restrictions are losing their effectiveness. The post Former U.S. Officials Urge New Export Alliance on China appeared first on EE Times.

Battling Over Shrinking Physical Margin In Chips – SemiEngineering

Aug 03, 2023 | SemiEngineering

Increasing density and complexity makes it imperative to capture and integrate more data, from design through manufacturing and into the field. The post Battling Over Shrinking Physical Margin In Chips appeared first on Semiconductor Engineering.

ASU-TSMC Partnership Will Focus on Student Support, Recruitment, Faculty Research – Semiconductor Digest

Aug 03, 2023 | Semiconductor Digest

Arizona State University and the Taiwan Semiconductor Manufacturing Company (TSMC) today announced a partnership agreement focused on student support, training and recruitment, and faculty work projects and research that will deepen the existing relationship between ASU and the world’s leading manufacturer of semiconductor chips. ASU-TSMC Partnership Will Focus on Student Support, Recruitment, Faculty Research was […]

Michigan Semiconductor Hands-On Research Experience to Help Frow US Workforce – Semiconductor Today

Jul 27, 2023 | Semiconductor Today

In a program designed to help grow the US semiconductor workforce, a cohort of college students from across the country is spending summer at the University of Michigan learning how to make, study and improve advanced semiconductors…

Are In-Person Conferences Sustainable? – SemiEngineering

Jul 27, 2023 | SemiEngineering

Virtual conferences are already in the rear-view mirror, but I am not convinced that in-person conferences should be continued. The post Are In-Person Conferences Sustainable? appeared first on Semiconductor Engineering.

SEMI’s Mousumi Bhat and Collin O’Mara, NWF, Talk About Climate Equity and Social Justice

Jul 27, 2023 | 3D InCites Podcast

At SEMICON West, one of the key areas of discussion was the Path to Net Zero. What can we do to make sure the semiconductor industry grows in a way that is beneficial to the planet and shows cross-industry leadership? Françoise von Trapp talks to SEMI’s Dr. Mousumi Bhat, VP of Global Sustainability Programs, and […]

A Chiplet-Based Supercomputer For Generative LLMs That Optimizes Total Cost of Ownership – SemiEngineering

Jul 26, 2023 | SemiEngineering

A technical paper titled “Chiplet Cloud: Building AI Supercomputers for Serving Large Generative Language Models” was published by researchers at University of Washington and University of Sydney. Abstract: “Large language… » read more The post A Chiplet-Based Supercomputer For Generative LLMs That Optimizes Total Cost of Ownership appeared first on Semiconductor Engineering.

Bettina Weiss and Bindiya Vakil Talk about Building an Agile Semiconductor Supply Chain

Jul 21, 2023 | 3D InCites Podcast

In this episode, Françoise von Trapp talks with SEMI’s Bettina Weiss, and Bindiya Vakil, of Resilinc about how to navigate the complexities of the semiconductor supply chain. The electronics industry continues to be in a state of flux. After two years of shortages, delays, and skyrocketing costs, the causes of supply chain disruptions keep changing […]

DAC/SEMICON West 2023 Roundup – SemiEngineering

Jul 20, 2023 | SemiEngineering

SEMI Europe’s 3D System Summit Panel: Partnering to Overcome Challenges in 3D Integration

Jul 14, 2023 | 3D InCites Podcast

For this week’s episode, we’re taking you to SEMI Europe’s 3D and System Summit, which took place last month in Dresden Germany. If you didn’t get to attend, you’re in luck, because in this episode, Françoise hands over the microphone to Jan Vardaman, who moderated a panel Panel Discussion titled: Customer-Supplier Partnering to Overcome Challenges […]

KLA’s Dave Thomas Talks about Advanced Plasma Processes for Wafer Level Packaging

Jul 13, 2023 | 3D InCites Podcast

Françoise von Trapp interviews Dave Thomas, of the SPTS Division at KLA, to talk about the evolution of wafer-level packaging, what’s been driving the market to adopt more advanced processes over the past 20 years, and the role KLA and specifically the SPTS division has played in bringing these technologies to commercialization. The specific technology […]

Arizona State University and Applied Materials to Create “Materials-to-Fab” Center – Semiconductor Digest

Jul 13, 2023 | Semiconductor Digest

More than $270 million in corporate and state investment will help advance Arizona’s semiconductor industry. Arizona State University and Applied Materials to Create “Materials-to-Fab” Center was posted by Shannon Davis on Semiconductor Digest.

The Siemens Digital Industries Software View of AI and its Impact on System Design – SemiWiki

Jul 13, 2023 | SemiWiki.com

The impact of AI seems to be everywhere. Products are smarter, doing more of what used to be done by the humans. Complex tasks can be completed quicker and with greater accuracy and failures can now be predicted more reliably and repaired before they even occur. The AI technologies used to make all this happen […]

AI Can’t Design Chips Without People – EE Times

Jul 06, 2023 | EE Times

AI needs human domain expertise to solve chip design challenges. The post AI Can’t Design Chips Without People appeared first on EE Times.

The Password is Hybrid Bonding – Insights from ECTC 2023

Jun 29, 2023 | 3D InCites Podcast

This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! At ECTC 2023, which took place earlier this month, the password was hybrid bonding. […]

Leti Innovation Days: Do More With Less – EE Times

Jun 29, 2023 | EE Times

An exclusive EE Times video interview with CEA-Leti CEO Sebastien Dauvé. The post Leti Innovation Days: Do More With Less appeared first on EE Times.

Tom Sonderman of SkyWater Talks about Growing the Semiconductor Workforce

Jun 22, 2023 | 3D InCites Podcast

In this SEMICON West podcast preview episode, Françoise talks with SkyWater’s CEO Tom Sonderman, who will deliver a keynote talk, “Creating a Path to Talent”. addressing the workforce shortage currently facing the semiconductor industry. Semiconductor manufacturing is on a path to becoming a $1Trillion industry somewhere around 2030. New fabs are being constructed all over […]