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Multi-die systems require new tools, technologies, and some very different approaches to design automation. The post Thinking Big: From Chips To Systems appeared first on Semiconductor Engineering.
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The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
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Exploring the latest iteration of IBMs supercomputer technology. The post IBM Refreshes Its Vela Research AI Supercomputer appeared first on EE Times.
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Achieving chiplet interoperability is a competitive necessity, but it will require clearing a number of technical hurdles. The post Why Chiplets Are So Critical In Automotive appeared first on Semiconductor Engineering.
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The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ. In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, […]
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A formalized approach is essential for nurturing younger talent as the semiconductor industry grays out. The post Chip Industry Needs More Mentors appeared first on EE Times.
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Can legislation drive the semiconductor industry forward? The post Chips Are a National Security Issue: Is the CHIPS Act Enough? appeared first on EE Times.
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In this episode, Françoise von Trapp and Jean Christophe Eloy of Yole Group, discuss the future of advanced packaging and chiplets in the semiconductor industry, and how these technologies will revolutionize the industry. Get ready for a deep dive into a technology discussion. From Jean-Christophe, you’ll learn how chiplets differ from multichip modules (MCM) and […]
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SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States was posted by Shannon Davis on […]
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Tracking innovation in advanced package design. The post NHanced Project Puts U.S. on Advanced-Packaging Map appeared first on EE Times.
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The U.S. may make significant investments in Vietnam to boost its semiconductor sector.
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More than Moore is off to a good start, but the next steps are a lot more difficult. The post Why There Are Still No Commercial 3D-ICs appeared first on Semiconductor Engineering.
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The compound semiconductor substrate market is growing at a compound annual growth rate (CAGR) of 17% to $3.3bn in 2029, according to the report ‘Status of Compound Semiconductors Industry 2024’ by market analyst firm Yole Group…
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At SEMI ISS, Paul Triolo, Albright Stonebridge Group (ASG) delivered a presentation on the geopolitical headwinds impacting the semiconductor industry in 2024. He explains challenges of industrial policies, export controls, and supply chain perturbations. Triolo is Senior Vice President for China and Technology Policy Lead at ASG, where he is also an Associate Partner. He […]
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For the first few episodes of Season 4 of the 3D InCites Podcast, Françoise von Trapp headed to the SEMI Industry Strategy Symposium, (ISS) where semiconductor industry executives gather to gain and share insight on where the semiconductor industry is headed, and how they can work together to get there. Economic trends, industry markets, and […]
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Tenstorrent and Alphawave foresee a day when they may overcome the likes of Qualcomm. The post Chiplet Makers Expect to Disrupt Incumbents appeared first on EE Times.
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Many young people don’t know they can apply their field of study to chipmaking work. The post Students of Many Stripes Can Aspire to Chip-Building Careers appeared first on EE Times.
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Françoise von Trapp talks to SEMI President and CEO Ajit Manocha, about the semiconductor industry’s journey on the path to becoming a $1 Trillion and what SEMI is doing to address the headwinds that could prevent that from happening. The semiconductor industry is growing at an amazing rate as demand for computer chips increases in […]
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Problems need to be solved before this technology goes mainstream, but the benefits are significant. The post Glass Substrates Gain Foothold In Advanced Packages appeared first on Semiconductor Engineering.
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Investments boom as countries and companies vie for supply chain security and technology leadership. The post Money Pours Into New Fabs And Facilities appeared first on Semiconductor Engineering.
