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Advances in imaging systems aim to improve throughput without sacrificing measurement accuracy. The post Progress In Wafer And Package Level Defect Inspection appeared first on Semiconductor Engineering.
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Chiplet communication will be impossible without interconnect protocols. The post Interconnects Essential To Heterogeneous Integration appeared first on Semiconductor Engineering.
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TSMC will resume production overnight following Taiwan’s biggest earthquake in 25 years, saying there is no damage to “critical tools.”
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The biggest quake in 25 years struck off of the island’s east coast and chipmakers TSMC and UMC evacuated some factories.
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The network on chip has become essential for complex designs, but it needs to evolve to support 3D designs and enable the integration of chiplets. The post The NoC In 3D Space appeared first on Semiconductor Engineering.
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A research team led by the Agency for Science, Technology and Research (A*STAR) in partnership with National University of Singapore (NUS) has created an innovative microelectronic device that can potentially function as a sustainable, high-performance “bit-switch”1. This paves the way for future computing technologies to process data much faster while using significantly less energy.
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The semiconductor industry continually pushes packaging technology boundaries to meet the demand for higher chip performance and efficiency. Bandwidth is one of the critical factors defining the amount of data transmitted between dies on a package IDTechEx Explores Technology Trends in Dielectric Materials for Next Generation 2.5D and 3D Semiconductor Packaging was posted by Shannon […]
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Intel executives confirmed today that Microsoft’s Copilot AI service will soon run locally on PCs and have a requirement for a minimum of 40 TOPS of NPU performance.
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Community outreach and partnerships can drive interest in STEM subjects and chip jobs among children, parents, and teachers. The post Early STEM Education Key To Growing Future Chip Workforce appeared first on Semiconductor Engineering.
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Suppliers of chipmakers postpone or scale back their U.S. plants due to rising costs and uncertainties.
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The growing need for adaptive test in heterogeneous designs. The post Cost And Quality Of Chiplets appeared first on Semiconductor Engineering.
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This week’s episode was recorded at ISS Europe, in Vienna, where the European semiconductor industries key strategists gathered to plan the path forward and forge a sustainable path to securing 20% of the global semiconductor market. One of the main topics continues to be building a resilient semiconductor supply chain. In the first segment of […]
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Data management, trust, traceability, and provenance tracking are essential to making a chiplet marketplace work. The post Security Is Critical For Commercial Chiplets appeared first on Semiconductor Engineering.
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Ajit Manocha provides insight into the big challenges the semiconductor industry faces today. The post We’ll Need Many More Fabs to Meet $1 Trillion by 2030 Goal appeared first on EE Times.
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In honor of International Women’s Day (IWD 2024), 3D InCites partnered with SEMI ISS to bring you this episode on how companies are fostering and implementing DEIB and allyship into their corporate culture. Françoise von Trapp speaks with Nigel Wenden, CEO of WGNSTAR, Laura Matz, CTO of Merck KGAA Darmstadt Germany; and Mike Rosa, CMO, […]
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Increased onshore manufacturing will require more diverse skills to operate the facilities. The post STEM Education Scales to Strengthen Chip Sector Skills appeared first on EE Times.
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Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications. The post Chiplet IP Standards Are Just The Beginning appeared first on Semiconductor Engineering.
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Françoise von Trapp and SEMI Europe’s Laithe Altimime discuss the status of the European Chips Act, which aims to double Europe’s market share in global manufacturing by 2030 and increase chip production by 20%. The discussion focuses on European industry growth and resilience, and the importance of collaboration. They also discuss ISS Europe which takes […]
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Multi-die systems require new tools, technologies, and some very different approaches to design automation. The post Thinking Big: From Chips To Systems appeared first on Semiconductor Engineering.
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The Commerce Department is now accepting applications for up to three $100 million awards for semiconductor packaging R&D.
