How Much AI Is Really Needed? – SemiEngineering
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Performance depends on the application it is being applied to. The post How Much AI Is Really Needed? appeared first on Semiconductor Engineering.
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Performance depends on the application it is being applied to. The post How Much AI Is Really Needed? appeared first on Semiconductor Engineering.
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North Carolina State University has been awarded $39.4m from the US Department of Defense to serve as the leader of a regional innovation hub in wide-bandgap semiconductors…
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As autonomous vehicles take to the roads, the jury is still out on the readiness of these vehicles in terms of safety. Technologies being used are still in nascent stages, and there is still work to be done before these vehicles can be operated in driverless mode. In this episode, Françoise von Trapp sits down […]
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Solutions to mitigate future materials supply vulnerabilities. Semiconductor Supply Chain Problems Running Rampant? was posted by Shannon Davis on Semiconductor Digest.
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There’s no one-fits-all solution when it comes to chiplet design. The post How the Worlds of Chiplets and Packaging Intertwine appeared first on EE Times.
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Samsung and SK Hynix can continue buying new tools for Chinese fabs, for now.
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We’ve made changes to the 3D InCites Awards Program and the 2024 Yearbook! This recording of the recent 3D InCites 411 explains everything you need to know to participate in these programs. In this information session and Q&A you’ll learn about: 💡 The new 3D InCites Awards Format and Nomination Process 💡The 2024 Yearbook Opportunities […]
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The SEMI Semiconductor Climate Consortium (SCC) today issued its first report of the semiconductor ecosystem’s greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain’s carbon footprint and priority-ranked carbon emission sources for the industry to address. SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain’s Carbon Emissions was […]
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Leading-edge applications, from biotech to co-packaged optics, require choices in architectures, assembly methods, and materials for system performance. The post Building Better Bridges In Advanced Packaging appeared first on Semiconductor Engineering.
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You are now listening to the 100th Episode of the 3D InCites Podcast! To celebrate, Françoise sits down with Erica Folk and Tarak Railkar, both representatives of the International Microelectronics and Packaging Society – also known as IMAPS. 3D InCites is the official Industry Partner of IMAPS and the Official podcast of the IMAPS Symposium. […]
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On 7 September, the European Committee of the Regions (CoR) in Brussels, Belgium — in a signing ceremony hosted by the Minister-President of the Free State of Saxony (Freistaat Sachsen) Michael Kretschmer — launched the European Semiconductor Regions Alliance (ESRA) as a political network engaged to strengthen Europe’s capacity to produce semiconductors and microelectronics, reducing […]
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TSMC’s Arizona fab will start small-volume production of 4,000 – 5,000 wafer starts per month in Q1 2024.
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Vietnam’s semiconductor industry, bolstered by significant investments from industry giants like Samsung and Intel, and the relocation of major manufacturers from China, has partly helped the country shine amidst a global economic downturn. Vietnam Thriving Semiconductor Industry Fuels Economic Resilience Amidst Global Challenges was posted by Shannon Davis on Semiconductor Digest.
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The semiconductor industry is in an interesting position – on one side, the demand is there for it to become a $1T industry sometime in the next 7-10 years. But headwinds – including a current downturn, has many companies putting the brakes on spending. In this episode, Françoise von Trapp talks with Joe Cestari and […]
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Intel’s advanced 300mm manufacturing facility in New Mexico to provide new capacity corridor for Tower, helping fuel future growth. Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement was posted by Shannon Davis on Semiconductor Digest.
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Industry veterans examine the inner workings of how standards are created. The post Setting Standards For The Chip Industry appeared first on Semiconductor Engineering.
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This episode of the 3D InCites podcast was recorded live at SEMICON West. Françoise von Trapp speaks with Alex Wei and Omar Ma about the memory challenges facing the semiconductor industry, as AI and machine learning create a need for more advanced Flash Memory and DRAM. As memory specialists who recently joined the UCIe Consortium, […]
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This week’s episode dives deep into the world of X-ray inspection and its many uses in today’s high-density 3D heterogeneous integration technologies for semiconductor manufacturing. Françoise von Trapp speaks with subject matter expert, Chris Rand, of Nordson Test and Inspection. You’ll learn the basics – how X-ray inspection is used in semiconductor manufacturing and how […]
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This episode was recorded live at SEMICON West 2023, where one of the main topics of conversation was the importance of creating a collaborative supply chain. Françoise von Trapp speaks with Bruce Kim, CEO of SurplusGLOBAL, and team members Danny Kim and Rose Lee, about the critical role secondary equipment and parts play in this […]
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Intel should get the biggest slice of CHIPS Act funding as it conducts its R&D in the US, reckons CEO Pat Gelsinger.