Recommended Reads

Community Members Share Insights from ECTC 2024

Jun 14, 2024 | 3D InCites Podcast

Send us a Text Message. This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology […]

ECTC 2024: Can Photonics Solve the AI Energy Problem? Why is Process Control so Critical to Advanced Packaging?

Jun 07, 2024 | 3D InCites Podcast

Send us a Text Message. Recorded live at the 2024 Electronic Component Technology Conference, this episode features conversations Francoise von Trapp has with Keynote Speaker Keren Bergman, Columbia University and co-founder of Xscape Photonics,  and Chet Lennox, of KLA. Bergman explains the potential of photonics in AI applications to improve energy efficiency and bandwidth.  You’ll […]

SEMI America’s Joe Stockunas Talks About SEMICON West Past, Present and Future

May 31, 2024 | 3D InCites Podcast

In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West’s Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe updates listeners on semiconductor […]

The Race To Glass Substrates – SemiEngineering

May 29, 2024 | SemiEngineering

Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out. The post The Race To Glass Substrates appeared first on Semiconductor Engineering.

Mastering Copper TSV Fill Part 2 of 3 – SemiWiki

May 29, 2024 | SemiWiki.com

Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]

LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging

May 23, 2024 | 3D InCites Podcast

Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials.  This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss […]

Mastering Copper TSV Fill Part 1 of 3 – SemiWiki

May 22, 2024 | SemiWiki.com

Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]

Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification – SemiWiki

May 15, 2024 | SemiWiki.com

2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More The post Siemens EDA Makes 3D IC Design More […]

ICYMI: The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law

May 10, 2024 | 3D InCites Podcast

This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company,  IBM and Hemanth Dhavaleswarapu of AMD, about […]

SEMI ISS Europe Panel: Empowering Semiconductor Excellence in Europe

May 03, 2024 | 3D InCites Podcast

In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal.   Panelists include: Manfred Horstmann, GM and […]

Enabling Imagination: Siemens’ Integrated Approach to System Design – SemiWiki

May 01, 2024 | SemiWiki.com

In today’s rapidly advancing technological landscape, semiconductors are at the heart of innovation across diverse industries such as automotive, healthcare, telecommunications, and consumer electronics. As a leader in technology and engineering, Siemens plays a pivotal role in empowering the next generation … Read More The post Enabling Imagination: Siemens’ Integrated Approach to System Design appeared […]

Anirudh Keynote at CadenceLIVE 2024. Big Advances, Big Goals – SemiWiki

May 01, 2024 | SemiWiki.com

The great things about CEO keynotes, at least from larger companies, is that you not only learn about recent advances but you also get a sense of the underlying algorithm for growth. Particularly reinforced when followed by discussions with high profile partner CEOs on their directions and areas of common interest. I saw this recently… […]

IMAPS Global Business Council: Repatriating the U.S. Semiconductor Ecosystem

Apr 26, 2024 | 3D InCites Podcast

This episode was recorded live at IMAPS DPC, where the Spring version of the Global Business Council focused on Geopolitics Fueling the Repatriation of the Semiconductor Ecosystem. To get the complete picture of the collaboration happening, Françoise von Trapp speaks with representatives of the government, industry, and academia. Dan Berger,  National Advanced Packaging Manufacturing Program […]