Recommended Reads

30 Years of Underfill Technology: How Societal and Technological Challenges Impact Materials Development

Aug 23, 2024 | 3D InCites Podcast

Send us a Text Message. In this episode, Françoise von Trapp and underfill materials expert, Dick Jensen, NAMICS corporation explore the societal and technological challenges that impact microelectronic materials development. The conversation focuses on the evolution of underfill materials development over the past 30 years. They discuss the importance of underfill materials in semiconductor manufacturing, […]

Intel 18A Advanced Packaging is Key to Tech Leadership – EE Times

Aug 19, 2024 | EE Times

The chip industry can’t just continue to scale by focusing on transistor poly pitch or gate oxide thickness. The post Intel 18A Advanced Packaging is Key to Tech Leadership appeared first on EE Times.

SEMICON West 2024: Updates on The SEMI Climate Consortium and Workforce Development

Aug 16, 2024 | 3D InCites Podcast

Send us a Text Message. This episode was recorded live at SEMICON West 2024 – SEMI’s flagship tradeshow where the global industry gathers to showcase its latest products and technologies; and discuss topics critical to the industry’s growth. Two of these continue to be Sustainability and Workforce Development. Today’s guests will address both these topics. […]

Texas Instruments Set to Receive Up to $1.6 billion in CHIPS and Science Act Funding – Tom’s Harware

Aug 16, 2024 | Tom's Hardware

U.S. government to support TI’s fab projects in Texas and Utah with $1.6 billion in direct funding and up to $8 billion in investment tax credits.

Why Glass Substrates? – SemiWiki

Aug 14, 2024 | SemiWiki.com

The demand for high-performance and sustainable computing and networking silicon for AI has undoubtedly increased R&D dollars and the pace of innovation in semiconductor technology. With Moore’s Law slowing down at the chip level, there is a desire to pack as many chiplets as possible inside ASIC packages and get … Read More The post […]

Navigating The Touchpoints of the Semiconductor Equipment Journey

Aug 09, 2024 | 3D InCites Podcast

Send us a Text Message. The semiconductor industry supply chain continues to capture attention as general awareness about the importance of semiconductors in our everyday lives grows. The news of global expansion and ongoing delays of new fabs coming online is constant. But have you ever stopped to think how complicated it is to outfit […]

TSMC Arizona Struggles to Overcome Vast Differences between Taiwanese and US Work Culture – Tom’s Hardware

Aug 09, 2024 | Tom's Hardware

As TSMC fights to bring its new Arizona fabs online, the company learns the Taiwanese way isn’t going to work in America and needs to change.

The Multiphysics Challenges of 3D IC Designs – EE Times

Aug 09, 2024 | EE Times

The semiconductor industry has integrated ever more functionality into smaller footprints and is starting to build upward. With the rise of three-dimensional integrated circuits (3D ICs), designers can pack more processing power and functionality into smaller spaces. However, this new dimension brings with it a host of challenges, including mechanical stresses and thermal effects, that […]

Metrology And Inspection For The Chiplet Era – SemiEngineering

Aug 07, 2024 | SemiEngineering

Recent developments address imminent needs of advanced nodes and packages, but not all the pieces are in place yet. The post Metrology And Inspection For The Chiplet Era appeared first on Semiconductor Engineering.

U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility – Semiconductor Digest

Aug 07, 2024 | Semiconductor Digest

The preliminary memorandum of terms between the South Korean semiconductor manufacturer and the U.S. Department of Commerce will support high-bandwidth-memory AI chip production and advanced packaging R&D. U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility was posted by Shannon Davis on Semiconductor Digest.

3D InCites Members Share Perspectives from SEMICON West 2024

Aug 02, 2024 | 3D InCites Podcast

Send us a Text Message. This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers […]

Researchers Develop Device to Make Artificial Intelligence More Energy Efficient – Semiconductor Digest

Jul 31, 2024 | Semiconductor Digest

Energy consumption from artificial intelligence could be reduced by a factor of at least 1,000 with this device. Researchers Develop Device to Make Artificial Intelligence More Energy Efficient was posted by Shannon Davis on Semiconductor Digest.

TSMC VP Says ‘I don’t care if Moore’s Law is alive or dead’ if Technology Keeps Scaling — Tom’s Hardware

Jul 31, 2024 | Tom's Hardware

TSMC’s Kevin Zhang states that while Moore’s Law’s traditional focus on transistor density may be less relevant, TSMC’s continual advancements in technology scaling and 2.5D and 3D integration make it more than alive.

Undersecretary Jose Fernandez Talks About Securing Critical Supply Chains in the 21st Century

Jul 26, 2024 | 3D InCites Podcast

Send us a Text Message. Recorded live at SEMICON West 2024, SEMI’s flagship tradeshow where the global semiconductor industry gathers to discuss important matters and showcase new products and technology. This episode features Françoise von Trapp’s conversation with Jose Fernandez, Under Secretary of Economic Growth, Energy, and The Environment for the Department of State, to […]

GlobalWafers Assigned $400m CHIPS Act Funding to Boost Onshore Wafer Manufacturing in USA – Semiconductor Today

Jul 25, 2024 | Semiconductor Today

The US Department of Commerce has signed a non-binding preliminary memorandum of terms (PMT) to provide GlobalWafers America LLC and MEMC LLC (subsidiaries of GlobalWafers Co Ltd of Hsinchu, Taiwan, the world’s third largest supplier of semiconductor wafers) up to $400m in proposed direct funding under the CHIPS and Science Act to help onshore critical […]

Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity – SemiEngineering

Jul 25, 2024 | SemiEngineering

Using formal to exhaustively verify all interconnections between IC blocks right after package planning and prototyping. The post Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity appeared first on Semiconductor Engineering.

Canada Bolsters NY Semiconductor Corridor – EE Times

Jul 23, 2024 | EE Times

The CHIPS Act has spurred regional cross-border collaboration in Eastern Canada. The post Canada Bolsters NY Semiconductor Corridor appeared first on EE Times.

Precision Patterning Options Emerge For Advanced Packaging – SemiEngineering

Jul 23, 2024 | SemiEngineering

Photolithography is still mainstream, but innovative new solutions are coming. The post Precision Patterning Options Emerge For Advanced Packaging appeared first on Semiconductor Engineering.

Dr. Laurie Locascio, Undersecretary of Commerce, Talks about U.S. Investment in Semiconductor Manufacturing

Jul 19, 2024 | 3D InCites Podcast

Send us a Text Message. Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies. Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and […]

Siemens’ AJ Incorvaia Explains the Evolution of EDA Tools for Advanced Packaging and 3D ICs

Jul 15, 2024 | 3D InCites Podcast

Send us a Text Message. Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing […]