Designing Chiplets and AI with RISC-V – EE Times
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Our daily roundup from DAC 2024 day one. The post DAC 2024 Day One: Designing Chiplets and AI with RISC-V appeared first on EE Times.
Recommended Reads
Pulsed Laser Deposition at Wafer Level Is a Game Changer – EE Times
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Lam Research’s PLD technique allows chipmakers to accelerate their product roadmaps and explore longer-range capabilities. The post Pulsed Laser Deposition at Wafer Level Is a Game Changer appeared first on EE Times.
Highlights and Aha! Moments of ECTC 2024: A Recap with Karlheinz Bock and Michael Mayer
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Send us a Text Message. Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the […]
Quantum Computing Revolution Poised to Reshape Industries – EE Times
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Quantum computing, once a futuristic concept limited to science fiction, is quickly becoming applicable in real-world scenarios. The post Quantum Computing Revolution Poised to Reshape Industries appeared first on EE Times.
Is the US Falling Behind in the Semiconductor Race? A $692.7 Billion Question – Semiconductor Digest
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Averroes.ai conducted a study on the semiconductor industry’s funding, focusing on both government and private sector investments over the last five years. The objective of the study was to identify which countries have invested the most in this sector. Is the US Falling Behind in the Semiconductor Race? A $692.7 Billion Question was posted by […]
Community Members Share Insights from ECTC 2024
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Send us a Text Message. This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology […]
The US is Spending More on Chip Manufacturing Construction this Year than the Previous 28 Years Combined – Tom’s Hardware
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The United States is on pace to add more investment into electronics manufacturing construction this year as it did from 1996 to 2023. The CHIPS Act is largely to credit for the meteoric growth.
Rapid AI and HPC Requires Collaboration and Co-optimization – EE Times
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Several companies provided perspective at ECTC on the technologies needed to power the next industrial revolution: AI. The post Rapid AI and HPC Requires Collaboration and Co-optimization appeared first on EE Times.
SEMI America’s Joe Stockunas Talks About SEMICON West Past, Present and Future
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In this preview episode for SEMICON West 2024, Françoise von Trapp and SEMI America’s President Joe Stockunas talk about SEMICON West’s Past, Present, and Future. The discussion emphasizes the need for collaboration in the semiconductor industry and the important role SEMI plays in supporting the interests of its global members. Joe updates listeners on semiconductor […]
The Race To Glass Substrates – SemiEngineering
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Replacing silicon and organic substrates requires huge shifts in manufacturing, creating challenges that will take years to iron out. The post The Race To Glass Substrates appeared first on Semiconductor Engineering.
Mastering Copper TSV Fill Part 2 of 3 – SemiWiki
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Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]
LPKF Laser & Electronic’s Richard Noack Explains the Growing Importance of Glass Substrates for HPC and Chiplet Advanced Packaging
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Glass has long been explored as an alternative substrate material to organic laminates and silicon. As high-performance computing and chiplets HPC push the boundaries of existing technology, they are demanding innovative packaging solutions, beginning with innovative substrate materials. This is paving the way for glass. In this episode, Françoise von Trapp and Richard Noack discuss […]
Veterans Could Close The Semi Industry’s Workforce Gap – SemiEngineering
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A Penn State-led model to bring veterans into the chip industry could scale for broad workforce development. The post Veterans Could Close The Semi Industry’s Workforce Gap appeared first on Semiconductor Engineering.
Mastering Copper TSV Fill Part 1 of 3 – SemiWiki
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Establishing void-free fill of high aspect ratio TSVs, capped by a thin and uniform bulk layer optimized for removal by CMP, means fully optimizing each of a series of critical phases. As we will see in this 3-part series, the conditions governing outcomes for each phase vary greatly, and the complexity of interacting factors means… […]
Siemens EDA Makes 3D IC Design More Accessible with Early Package Assembly Verification – SemiWiki
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2.5D and 3D ICs present special challenges since these designs contain multiple chiplets of different materials integrated in all three dimensions. This complexity demands full assembly verification of the entire stack, considering all the subtle electrical and physical interactions of the complete system. Identifying… Read More The post Siemens EDA Makes 3D IC Design More […]
Semiconductor Manufacturers Must Adapt to Shifting Landscape – EE Times
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Semiconductor manufacturers face mounting pressure as the industry evolves. The post Semiconductor Manufacturers Must Adapt to Shifting Landscape appeared first on EE Times.
ICYMI: The AI Explosion, Chiplet Architectures, and Enabling the Future of Moore’s Law
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This episode was recorded live at the IMAPS Device Packaging Conference in Fountain Hill AZ, where several of the keynote talks focused on chiplet architectures and heterogeneous integration for semiconductor device manufacturing, assembly, test, and packaging. Françoise von Trapp talks with Arvind Kumar, of 3D InCites member company, IBM and Hemanth Dhavaleswarapu of AMD, about […]
Overcoming Chiplet Integration Challenges With Adaptability – SemiEngineering
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The evolution of chiplets is realizing real-world integration problems that can be mitigated with adaptable solutions provided by embedded programmable logic. The post Overcoming Chiplet Integration Challenges With Adaptability appeared first on Semiconductor Engineering.
Can Models Created With AI Be Trusted? – SemiEngineering
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Evaluating the true cost and benefit of AI can be difficult, especially within the semiconductor industry. The post Can Models Created With AI Be Trusted? appeared first on Semiconductor Engineering.
SEMI ISS Europe Panel: Empowering Semiconductor Excellence in Europe
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In this episode, recorded live at SEMI ISS Europe, Françoise von Trapp hands over the mic to SEMI Europe President, Laith Altimime, who leads a discussion on the European chip industry’s growth and challenges, and whether the European Chips Act will strengthen Europe towards its 20% vision goal. Panelists include: Manfred Horstmann, GM and […]
