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Using formal to exhaustively verify all interconnections between IC blocks right after package planning and prototyping. The post Here At Last! Automated Verification Of Heterogeneous 2D/3D Package Connectivity appeared first on Semiconductor Engineering.
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The CHIPS Act has spurred regional cross-border collaboration in Eastern Canada. The post Canada Bolsters NY Semiconductor Corridor appeared first on EE Times.
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Photolithography is still mainstream, but innovative new solutions are coming. The post Precision Patterning Options Emerge For Advanced Packaging appeared first on Semiconductor Engineering.
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Send us a Text Message. Recorded live at SEMICON West 2024, the flagship tradeshow for SEMI, where the entire industry gathers to showcase their latest products and technologies. Françoise von Trapp interviews Laurie Locascio, Director of NIST and the Under Secretary of Commerce for Standards and Technology to learn more about the US CHIPS and […]
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Send us a Text Message. Françoise von Trapp and AJ Incorvaia discuss the evolution of EDA tools for 3D integration and design tools for 3D ICs and packaging. They talk about the need for real-time 3D visualization and automation capabilities to enable the design and manufacturing of complex 3D ICs. They also highlighted the growing […]
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The program will train facility technician apprentices over the next five years in Arizona. Intel Launches Its First US Apprenticeship for Manufacturing Facility Technicians was posted by Shannon Davis on Semiconductor Digest.
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This is Costa Rica’s first time at SEMICON West, for which CINDE has joined SEMI, the leading global microelectronics association for driving business and addressing the industry’s global challenges. CINDE Promotes Development in Costa Rica at SEMICON West 2024 was posted by Shannon Davis on Semiconductor Digest.
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Technology will speed time to yield and add efficiency, but standards are needed for it to live up to its potential. The post Digital Twins Find Their Footing In IC Manufacturing appeared first on Semiconductor Engineering.
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Send us a Text Message. In this episode, Françoise von Trapp speaks with Christine King, the world’s first woman CEO of a semiconductor company, about her journey from near destitution to success in a male-dominated industry. Christine recently published a memoir about her journey, called Breaking Through the Silicon Ceiling, which details her journey and […]
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New complexities include partitioning trade-offs, signal integrity across multiple substrates, and thermal behavior of stacked dies. The post Navigating Chiplet-Based Automotive Electronics Design With Advanced Tools And Flows appeared first on Semiconductor Engineering.
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The NSTC intends to allocate grants between $500,000 and $2 million to 10 workforce development projects.
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Send us a Text Message. Saxony, Germany, has a strong potential to become a global semiconductor location due to its long history in traditional industries, technological base, vast talent pool, strategic location, and investment in education and new talent. In this episode, Françoise von Trapp speaks with Andreas Lippert, of Saxony Trade and Invest, and […]
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Our daily roundup from DAC 2024 day one. The post DAC 2024 Day One: Designing Chiplets and AI with RISC-V appeared first on EE Times.
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Lam Research’s PLD technique allows chipmakers to accelerate their product roadmaps and explore longer-range capabilities. The post Pulsed Laser Deposition at Wafer Level Is a Game Changer appeared first on EE Times.
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Send us a Text Message. Françoise von Trapp talks with ECTC 2024 General Chair, Karlheinz Bock and Program Chair, Michael Mayer about highlights and key takeaways from the 2024 IEEE Electronic Component Technology Conference. (ECTC 2024). Bock and Mayer discussed the growth of ECTC 2024, and how focusing on strategic decisions such as changing the […]
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Quantum computing, once a futuristic concept limited to science fiction, is quickly becoming applicable in real-world scenarios. The post Quantum Computing Revolution Poised to Reshape Industries appeared first on EE Times.
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Averroes.ai conducted a study on the semiconductor industry’s funding, focusing on both government and private sector investments over the last five years. The objective of the study was to identify which countries have invested the most in this sector. Is the US Falling Behind in the Semiconductor Race? A $692.7 Billion Question was posted by […]
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Send us a Text Message. This episode features conversations at ECTC 2024 with 11 of 3D InCites community members. You’ll learn about their perspectives on the hottest topics of the times such as thermal management and power issues for AI devices, and glass core substrates versus organic substrates. You’ll also learn about their latest technology […]
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The United States is on pace to add more investment into electronics manufacturing construction this year as it did from 1996 to 2023. The CHIPS Act is largely to credit for the meteoric growth.
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Several companies provided perspective at ECTC on the technologies needed to power the next industrial revolution: AI. The post Rapid AI and HPC Requires Collaboration and Co-optimization appeared first on EE Times.
