|
The microprocessor market’s string of nine straight record-high annual sales between 2010 and 2018 is expected to end this year with worldwide MPU revenue dropping 4% to about $77.3 billion because of weakness in smartphone shipments, excess inventories in data center computers, and the global fallout from the U.S.-China trade war, according to IC Insights’ […]
|
Researchers from Aalto University and VTT Technical Research Centre of Finland have built a super-sensitive bolometer, a type of thermal radiation detector. The new radiation detector, made of a gold-palladium mixture makes it easier to measure the strength of electromagnetic radiation in real time. Bolometers are used widely in thermal cameras in the construction industry […]
|
Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA, which provides silicon carbide (SiC) substrates for power electronics, has introduced what it says are the first prototype 200mm-diameter semi-insulating silicon carbide substrates for RF power amplifiers in 5G wireless base-station antennas and other high-performance RF applications…
|
Packaging project; 5nm; 3D chips; neural-net-on-a-chip. The post Week In Review: Manufacturing, Test appeared first on Semiconductor Engineering.
|
How to reduce margin and improve performance on very large devices. The post Monitoring Heat On AI Chips appeared first on Semiconductor Engineering.
|
Arm adds custom instructions; Synopsys’ functional safety verification; 5nm certifications; CCIX spec; Adesto’s satellite deal. The post Week In Review: Design, Low Power appeared first on Semiconductor Engineering.
|
Arm TechCon; broken security; Nissan CEO. The post Week in Review – IoT, Security, Autos appeared first on Semiconductor Engineering.
|
Automotive makers and their suppliers are jacking up the processing power being introduced to cars along with higher speed wireless external connections. These high speed systems promise to collect, process, interpret and transmit sensor data for the purpose of enabling advanced collision avoidance and, ultimately, automated … Read More
|
Image RemovedThe International Electron Devices Meeting is a premier event to learn about the latest in semiconductor process technology. Held every year in early December is San Francisco this years conference will be held from Decembers 7th through December 11th. You can learn more about the conference at their web site here… Read More
