On this week’s show, privacy was a big theme beginning with our conversation about Ring’s sharing of certain user data with third-party tracking sites, a plea from 40 organizations for the U.S. to stop using facial recognition technology, and a new way to think about smart cities. Kevin and I also discussed proposed device security […]
|
Should there be a “Finishing School” for electrical and electronic engineers in which they were taught a suite of real-world nitty-gritty skills?
|
“The last few years have witnessed the rise of the leading-edge GPU/ CPU markets”, announces Yohann Tschudi, PhD. Technology & Market Analyst at Yole Développement (Yole). “This has been driven by a host of datacenter applications, such as exascale computing and AI training.” Among these, the market research and strategy consulting company Yole has decided […]
|
Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, 6 March 2020 in Swansea, UKat the University of Swansea. Sponsored by SEMI, the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations […]
|
Aspencore Media, the publishing house that owns EE Times, has launched a Special Project, “Outbreak in Wuhan,” seeking to define the global impact of the deadly virus in the electronic industry. The post Outbreak in Wuhan appeared first on EETimes.
|
Common trends and bottlenecks in DRAM architecture are identified. The post The History and Future of DRAM Architecture in Different Application Domains: An Analysis appeared first on Semiconductor Digest.
|
As concerns about the latest coronavirus escalate, events are getting delayed or canceled, at no small cost. Semi has put off Semicon Korea and Semicon China. The post Events Across SE Asia Cancelled Due to China Virus Outbreak appeared first on EETimes.
In this week’s podcast, we are tackling two of the biggest themes at this year’s Embedded Tech Trends Conference: SOSA (Sensor Open Systems Architecture) and artificial intelligence processing at the edge. First up, I take a closer look at SOSA with Rodger Hoskins from Pentek. Rodger and I discuss the role SOSA will have in […]
|
We are entering the second quantum revolution, when engineering is needed to develop future quantum systems! With multiple announcements in 2019 related to quantum computing, the way to a universal quantum computer is getting clearer. But the question is still the same: when will universal quantum computers be available? The post-Snowden world is ahead! Data […]
|
AEB is fundamental to ADAS. But AEB adapted to pedestrians is “an order of magnitude harder than AEB,” an expert says. The post Why ADAS Cars Go People-Blind appeared first on EETimes.
|
Broad implications for a global supply chain. The post Chips, Business And The Coronavirus appeared first on Semiconductor Engineering.
|
FPGAs, today and throughout the history of semiconductors, play a critical role in design enablement and electronic systems. Which is why we included the history of FPGAs in our book “Fabless: The Transformation of the Semiconductor Industry” and added a new chapter in the 2019 edition on the history of Achronix. In a recent blog… […]
|
The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, […]
|
3D stacked ICs will deliver next wave of innovation as the industry scales past 7nm. A standardized design for test (DfT) approach will help automated test access to each die layer. The post IEEE 1838 Allows Test Access to Every Die in 3D IC Stack appeared first on EETimes.
|
Based on Nanoscribe’s 3D Microfabrication technology, scientists developed a 3D-microscaffold cochlear implant for steroid elution. For the first time, scientists combined a highly precise, porous 3D printed steroid reservoir with a 2D MEMS-based electrode array to fabricate a novel cochlear implant. This implant is designed to reduce the damage of residual hearing against electrode insertion […]
|
How corners and multiple changes to designs can slow time to market. The post Dealing With ECOs In Complex Designs appeared first on Semiconductor Engineering.
|
An important technique for capturing an electronic component’s response to simulated thermal, thermo-mechanical and mechanical loads. The post Using Digital Image Correlation To Determine BGA Warpage appeared first on Semiconductor Engineering.
This week’s show was dedicated to a wrap up of CES 2020. Kevin and I shared how the show has changed in the last 15 years, talked about technology for Boomers, the Withings ScanWatch and ran through several new maker boards. We covered the $2 Wemos W600-PICO board, a new Arduino board for industrial use […]
|
The automotive industry is facing a downturn in car sales – this is accepted reality. The industry’s difficulties are partly linked to the political tension between China & USA, Brexit and the severe ecological regulations in Europe. These occurrences are global drivers that the automotive industry cannot predict or control but must live through. The […]
|
Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch […]
