Chiplet Reliability Challenges Ahead – SemiEngineering
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Determining how third-party chiplets will work in complex systems is still a problem. The post Chiplet Reliability Challenges Ahead appeared first on Semiconductor Engineering.
Recommended Reads
COVID-19 has considerably changed the DRAM & NAND industry | Quarterly Market Monitor
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Capex: current forecast assumes a much steeper 2020 capex drop-off Prior to the COVID-19 outbreak expectations were for combined DRAM and NAND capex of US$38.8 billion in 2020, down 15% year-over-year, including both WFE and infrastructure spend. This decrease was a result of the memory market downturn that plagued 2019—and much of 2018 for NAND—as […]
Episode 93: Working From Home as a Dow Leader and Parent During a Pandemic
In this SWE Diverse episode, Heather Doty, SWE FY20 president-elect, speaks with Brandie Dessauer, an integrated supply chain manager at Dow. Together they discuss working from home as a leader at Dow and parent during a pandemic.
Challenges For A Post-Moore’s Law World – SemiEngineering
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More customization and a different message for the chip industry. The post Challenges For A Post-Moore’s Law World appeared first on Semiconductor Engineering.
Intel Makes Changes to Technology Organization – Semiconductor Digest
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Today, Intel CEO Bob Swan announced changes to the company’s technology organization and executive team to accelerate product leadership and improve focus and accountability in process technology execution. The post Intel Makes Changes to Technology Organization appeared first on Semiconductor Digest.
US vs. China: How Did We Even Get Here? – EE Times
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The history of U.S.-China relations has been laced with a series of often gratuitous tit-for-tat trade sanctions. How did we even get here? The post US vs. China: How Did We Even Get Here? appeared first on EETimes.
In The Pandemic, Big Tech Is Bigger Than Ever. Should Consumers Be Worried? Coronvirus Podcast Daily, NPR
The CEOs of Amazon, Apple, Facebook, and Google faced questions today from a House subcommittee. Some lawmakers believe those companies have too much economic and political power. Former Facebook policy executive Dipayan Ghosh agrees. Email the show at considerthis@npr.org.
Semicon West Day One/Two – SemiEngineering
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Reporter’s Notebook: Roadmap; Al Gore; panel; cyber standards. The post Semicon West Day One/Two appeared first on Semiconductor Engineering.
Semicon West Day Three – SemiEngineering
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Reporter’s notebook: Auto outlook; auto VC panel; SEMI board. The post Semicon West Day Three appeared first on Semiconductor Engineering.
Episode 278: Amazon’s Alexa Developer News and 5G’s Next wave
This week’s show digs into the announcements made during Amazon’s Alexa Live event held Wednesday. We explain the Connect Kit hardware and Alexa skill upgrades and try to offer a bit of context about what it means for users and developers. After that, we move to Wyze’s ask for donations and our fears over its […]
5G handsets to Comprise 18.9% of Smartphone Production in 2020 – Semiconductor Today
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5G remains a hot topic in the smartphone market this year, as smartphone brands and mobile processor manufacturers, such as Qualcomm and MediaTek, strive to expand their shares in the 5G market. According to market research firm TrendForce, the Chinese government’s 5G commercialization efforts have been particularly aggressive, leading the country’s 5G base-station deployment and […]
Advanced Packaging: OSATs, Foundries, and IDMs All Want to be In the Game – iMicronews
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“ Once the traditional, exclusive domain of OSATs and IDMs today a paradigm shift is occurring in the assembly / packaging segment of the semiconductor manufacturing supply chain”, asserts Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea, part of Yole Développement (Yole). “Players from different business models, including foundries, substrate/PCB suppliers, […]
TSMC Raises Capital Expenditure Plan on Improved Outlook – EE Times
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TSMC has increased its capital expenditure plan for this year by about $1 billion n the expected demand for 5G phones and high-performance computing products. The post TSMC Raises Capital Expenditure Plan on Improved Outlook appeared first on EETimes.
The Disposable Endoscopy Show has Begun and Image Sensors are Under the Spotlight ─ iMicronews
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The medical imaging industry has always been a place for high-end technology and innovative solutions. In its latest report “Status of Medical Imaging Equipment and Detectors 2020”, Yole Développement’s analysts estimate that the detector market for medical imaging equipment was worth $4.3B in 2019. It is forecasted to grow to $6.6B in 2025 with a Compound […]
Imec and GLOBALFOUNDRIES announce Breakthrough in AI Chip – iMicronews
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Imec, a world research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES® (GF®), the world’s specialty foundry, announced a hardware demonstration of a new artificial intelligence chip. Based on imec’s Analog in Memory Computing (AiMC) architecture utilizing GF’s 22FDX® solution, the new chip is optimized to perform deep neural network calculations on in-memory […]
Chiplet Uptake Creates Demand for Best Practices – EE Times
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Die-stitching techniques, the basic concept behind chiplets, aren’t new or necessarily propriety, but the approach could benefit from templates. The post Chiplet Uptake Creates Demand for Best Practices appeared first on EETimes.
Episode 276: Google Inches Toward a Smarter Home – IOT Podcast
This week Kevin and I discuss the news from Google’s smart home event, and what it means for the big players in the game, standards efforts, your television, and whether Amazon can compete without a smartphone when it comes to the smart home. From there we talk about Arm’s decision to spin out its IoT […]
How COVID-19 is Accelerating Healthcare Projects and BioMEMS Device Integration – i-Micronews
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Each new crisis, whether economic, ecological or – as currently – health, sees emerging and accelerating development of new products adapted to the situation. Urgency creates needs and needs foster the emergence of new projects. In this article based on Yole Développement’s update of our “BioMEMS Market and Technology 2020”, we analyze the MEMS market […]
Enabling Cost-Effective, High-Performance Die-to-Die Connectivity – SemiEngineering
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When it comes to die-to-die PHY interfaces, the best solution is highly dependent on the end application. The post Enabling Cost-Effective, High-Performance Die-to-Die Connectivity appeared first on Semiconductor Engineering.
Creating A Community to Help Women Negotiate for Equal Pay and Power in the Workplace – Women in Tech
Don’t miss out on the next #womenintech podcast episode, get notified by signing up here: http://womenintechshow.com. Be featured in the Women in Tech Community by creating your profile here: http://womenintechvip.com/ Claire Wasserman of Ladies Get Paid “Creating A Community to Help Women Negotiate for Equal Pay and Power in the Workplace” **#womenintech Show is a […]
