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We are entering the second quantum revolution, when engineering is needed to develop future quantum systems! With multiple announcements in 2019 related to quantum computing, the way to a universal quantum computer is getting clearer. But the question is still the same: when will universal quantum computers be available? The post-Snowden world is ahead! Data […]
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AEB is fundamental to ADAS. But AEB adapted to pedestrians is “an order of magnitude harder than AEB,” an expert says. The post Why ADAS Cars Go People-Blind appeared first on EETimes.
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Broad implications for a global supply chain. The post Chips, Business And The Coronavirus appeared first on Semiconductor Engineering.
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FPGAs, today and throughout the history of semiconductors, play a critical role in design enablement and electronic systems. Which is why we included the history of FPGAs in our book “Fabless: The Transformation of the Semiconductor Industry” and added a new chapter in the 2019 edition on the history of Achronix. In a recent blog… […]
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The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, […]
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3D stacked ICs will deliver next wave of innovation as the industry scales past 7nm. A standardized design for test (DfT) approach will help automated test access to each die layer. The post IEEE 1838 Allows Test Access to Every Die in 3D IC Stack appeared first on EETimes.
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Based on Nanoscribe’s 3D Microfabrication technology, scientists developed a 3D-microscaffold cochlear implant for steroid elution. For the first time, scientists combined a highly precise, porous 3D printed steroid reservoir with a 2D MEMS-based electrode array to fabricate a novel cochlear implant. This implant is designed to reduce the damage of residual hearing against electrode insertion […]
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How corners and multiple changes to designs can slow time to market. The post Dealing With ECOs In Complex Designs appeared first on Semiconductor Engineering.
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An important technique for capturing an electronic component’s response to simulated thermal, thermo-mechanical and mechanical loads. The post Using Digital Image Correlation To Determine BGA Warpage appeared first on Semiconductor Engineering.
This week’s show was dedicated to a wrap up of CES 2020. Kevin and I shared how the show has changed in the last 15 years, talked about technology for Boomers, the Withings ScanWatch and ran through several new maker boards. We covered the $2 Wemos W600-PICO board, a new Arduino board for industrial use […]
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The automotive industry is facing a downturn in car sales – this is accepted reality. The industry’s difficulties are partly linked to the political tension between China & USA, Brexit and the severe ecological regulations in Europe. These occurrences are global drivers that the automotive industry cannot predict or control but must live through. The […]
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Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch […]
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OneSpin’s CEO explains what’s changing in AI, where it’s being used, and what still has to be fixed. The post Uses And Limitations Of AI In Chip Design appeared first on Semiconductor Engineering.
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TECHCET—the electronic materials advisory services firm providing business and technology information— announced that global revenues for semiconductor manufacturing and packaging materials are expected to grow 5.7% year-over-year (YoY) in 2020 to US$49.5B, of which 65% represents semiconductor fab materials. The post Semiconductor Materials Growing to Nearly $50B Market in 2020 After Downturn appeared first on […]
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Image Removed This is the fourth of a four part series Many companies saw 2019 as a year when more and more regulations piled on to them. CEOs who were the legal representative for their company in China got increasingly nervous as legal teams updated them on their personal responsibility under new regulations. Unfortunately for… […]
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Image Removed After years of travel and computing remotely while on the road I have found that there are two magical experiences for the business traveler. One of those experiences is the hotline support I get from my preferred airline – United. The other is the live remote assistance I periodically receive from my company’s in-house… Read […]
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We present visual wonders of CES 2020, including a quantum computer, an enormous flying taxi, gorgeous displays ranging from the small and flexible to the gigantic and brilliant, virtual people and real crowds. The post CES Image Gallery: It’s a Wrap appeared first on EETimes.
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IoT, edge and cloud are becoming demarcations for where to process data. The post The Evolution Of Pervasive Computing appeared first on Semiconductor Engineering.
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Using such sophisticated AR/VR techniques to manipulate children to buy products is questionable. Being gleeful about it is unseemly. The post VR & Loathing in Las Vegas appeared first on EETimes.
This week Kevin and I went to Las Vegas for the annual CES event showcasing thousands of technology products under dozens of roofs. We recorded the show before we had the chance to see everything, but we did pull together this show with some of the big themes we saw developing and the news that […]
