This week on the IoT podcast we begin by talking about what the widespread adoption of ultrawideband chips in phones could mean for the IoT. From there, it’s on to Google’s always-listening software update, humans coming back into the QA loop, and earthquake detection on Android phones (there’s another earthquake project too!). Kevin also asks […]
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To manufacture highly integrated circuits here in the United States is no longer just a nice-if-we-can idea. It is building momentum. The post CHIPS Act Targets Post-Globalized Industry appeared first on EETimes.
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Die-integration technologies are revolutionizing packaging, assembly, and test. The post Advanced Packaging, Heterogeneous Integration And Test appeared first on Semiconductor Engineering.
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SVXR, Inc., a pioneer in inspection and metrology technology, announced today that Scott Jewler has been appointed President and Chief Executive Officer effective August 8th, 2020. Jewler previously held the position of Chief Operating Officer and is a co-founder of SVXR. The post SVXR Appoints Semiconductor Packaging Industry Veteran Scott Jewler as President and CEO […]
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Determining how third-party chiplets will work in complex systems is still a problem. The post Chiplet Reliability Challenges Ahead appeared first on Semiconductor Engineering.
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Capex: current forecast assumes a much steeper 2020 capex drop-off Prior to the COVID-19 outbreak expectations were for combined DRAM and NAND capex of US$38.8 billion in 2020, down 15% year-over-year, including both WFE and infrastructure spend. This decrease was a result of the memory market downturn that plagued 2019—and much of 2018 for NAND—as […]
In this SWE Diverse episode, Heather Doty, SWE FY20 president-elect, speaks with Brandie Dessauer, an integrated supply chain manager at Dow. Together they discuss working from home as a leader at Dow and parent during a pandemic.
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More customization and a different message for the chip industry. The post Challenges For A Post-Moore’s Law World appeared first on Semiconductor Engineering.
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Today, Intel CEO Bob Swan announced changes to the company’s technology organization and executive team to accelerate product leadership and improve focus and accountability in process technology execution. The post Intel Makes Changes to Technology Organization appeared first on Semiconductor Digest.
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The history of U.S.-China relations has been laced with a series of often gratuitous tit-for-tat trade sanctions. How did we even get here? The post US vs. China: How Did We Even Get Here? appeared first on EETimes.
The CEOs of Amazon, Apple, Facebook, and Google faced questions today from a House subcommittee. Some lawmakers believe those companies have too much economic and political power. Former Facebook policy executive Dipayan Ghosh agrees. Email the show at considerthis@npr.org.
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Reporter’s Notebook: Roadmap; Al Gore; panel; cyber standards. The post Semicon West Day One/Two appeared first on Semiconductor Engineering.
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Reporter’s notebook: Auto outlook; auto VC panel; SEMI board. The post Semicon West Day Three appeared first on Semiconductor Engineering.
This week’s show digs into the announcements made during Amazon’s Alexa Live event held Wednesday. We explain the Connect Kit hardware and Alexa skill upgrades and try to offer a bit of context about what it means for users and developers. After that, we move to Wyze’s ask for donations and our fears over its […]
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5G remains a hot topic in the smartphone market this year, as smartphone brands and mobile processor manufacturers, such as Qualcomm and MediaTek, strive to expand their shares in the 5G market. According to market research firm TrendForce, the Chinese government’s 5G commercialization efforts have been particularly aggressive, leading the country’s 5G base-station deployment and […]
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“ Once the traditional, exclusive domain of OSATs and IDMs today a paradigm shift is occurring in the assembly / packaging segment of the semiconductor manufacturing supply chain”, asserts Santosh Kumar, Principal Analyst and Director Packaging, Assembly & Substrates, Yole Korea, part of Yole Développement (Yole). “Players from different business models, including foundries, substrate/PCB suppliers, […]
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TSMC has increased its capital expenditure plan for this year by about $1 billion n the expected demand for 5G phones and high-performance computing products. The post TSMC Raises Capital Expenditure Plan on Improved Outlook appeared first on EETimes.
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The medical imaging industry has always been a place for high-end technology and innovative solutions. In its latest report “Status of Medical Imaging Equipment and Detectors 2020”, Yole Développement’s analysts estimate that the detector market for medical imaging equipment was worth $4.3B in 2019. It is forecasted to grow to $6.6B in 2025 with a Compound […]
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Imec, a world research and innovation hub in nanoelectronics and digital technologies, and GLOBALFOUNDRIES® (GF®), the world’s specialty foundry, announced a hardware demonstration of a new artificial intelligence chip. Based on imec’s Analog in Memory Computing (AiMC) architecture utilizing GF’s 22FDX® solution, the new chip is optimized to perform deep neural network calculations on in-memory […]
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Die-stitching techniques, the basic concept behind chiplets, aren’t new or necessarily propriety, but the approach could benefit from templates. The post Chiplet Uptake Creates Demand for Best Practices appeared first on EETimes.
