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SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021. The post SK hynix to Acquire Intel NAND Memory Business appeared first on Semiconductor Digest.
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Consolidation and speed-to-market success in foundries have enabled leading semiconductor companies to compete successfully without their own manufacturing fabs. The post The Future of Semiconductor Manufacturing appeared first on EETimes.
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Building together a verification approach for safety and security in automotive chips is complex, multi-faceted, and extremely difficult. The post Growing Complexity Adds To Auto IC Safety Challenges appeared first on Semiconductor Engineering.
We kicked off the post-Election Day show with an update on ballot initiatives in Massachusetts, Maine, and California that have an impact on the internet of things. After that, we discussed Google’s ability to predict HVAC problems and the promise of smart thermostats. Then we focused on two devices worth covering, a smart lamp from […]
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Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program aims to ensure that microelectronics packaging expertise and leadership is available for […]
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An iPhone teardown: There is no better entertainment than speculating about Apple’s next step in its silicon development in order differentiate its iPhones from others. The post 5G iPhone: What’s Apple’s Next Step in RF, Antenna? appeared first on EETimes.
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Intelligence at the edge is a hot topic these days. Not having to go all the way to the cloud to recognize objects, faces, speech and so on. But I find promoters can be rather fuzzy about what they mean by “the edge”. For many, intelligence at the edge means intelligence closer to the edge […]
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New equipment will help, but it’s expensive and requires more steps. The post Defect Challenges Grow For IC Packaging appeared first on Semiconductor Engineering.
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“The era of wearables is definitely here and confirmed by large consumer adoption.” asserts Jérôme Mouly, Senior Technology & Market Analyst and Business Developer at Yole Développement (Yole). “Whether wrist-worn, head-worn and hearable, body-worn, or smart clothing, we estimate the market to reach US$97.9 billion by 2025, with a 11.2% CAGR from 2019 to 2025”. […]
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Taiwan Semiconductor Manufacturing Co. expects the main driver of its growth in the next several years to be HPC, overtaking its current smartphone business The post TSMC Sees HPC As Next Inflection Point appeared first on EETimes.
In this SWE Diverse episode, Heather Doty, SWE FY21 President, speaks with one of our WE20 Keynote speakers and recipient of the Suzanne Jenniches Upward Mobility Award, Jennifer Rumsey, president of the Components Segment for Cummins Inc. Together they discuss Laura’s goals as President of Components at Cummins and a sneak peek at Jennifer’s WE20 […]
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For AMD to acquire a company as large as Xilinx comes as a shock to many. Reportedly, the deal would cost AMD $30 billion, which is almost a third of its market capitalization. The post AMD and Xilinx: A Match Made in Silicon Valley? appeared first on EETimes.
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Apple enters the 5G era with its new iPhone 12 series of smartphones. The company also introduced the HomePod smart speaker. The post Apple Finally Joins The 5G Party appeared first on EETimes.
This week’s IoT podcast kicks off with a focus on Apple’s new HomePod mini and the inclusion of the Thread protocol on the device. We then discuss how it fits into the world of smart speakers and my own recent purchases, such as my feelings about the Echo Studio and the Nest Audio. We then […]
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The number of options is increasing, but tooling and methodologies haven’t caught up. The post Confusion Grows Over Packaging And Scaling appeared first on Semiconductor Engineering.
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Chip disaggregation means a larger attack surface, increasing the chances of a successful trojan or man-in-the-middle attack. The post Protecting Chiplet Architectures With Hardware Security appeared first on Semiconductor Engineering.
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Nvidia-Arm deal ‘will be good for customers,’ while Arm GPU and NPU development will continue The post Huang ‘Confident’ Nvidia-Arm Deal Will Get Past Regulators appeared first on EETimes.
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The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The post Intel Wins US Government Advanced Packaging Project appeared first on Semiconductor Digest.
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Growing complexity is creating an array of confusing options. The post System-Level Packaging Tradeoffs appeared first on Semiconductor Engineering.
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Somewhat limited improvements of client and server CPUs coupled with delays of new process technologies made Intel look pale. But being a large company has its perks and Intel’s roadmap reveals a path to regaining market share and mind share. The post Intel’s Roadmap: A Closer Look at Process Technologies and Production Plans appeared first […]
