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Communication, security, and power issues still need to be solved, but there is progress. The post Bridging The Gap Between Smart Cities And Autonomous Vehicles appeared first on Semiconductor Engineering.
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New markets, different architectures, and continued virtual work environments all point to positive and sustained growth. The post Roaring ’20s For The Chip Industry appeared first on Semiconductor Engineering.
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-Intel good results had a little extra help to be great -New CEO commits to remaining an IDM versus fabless -Claims of strong progress on 7NM fuel optimism inside -Outsourcing to TSMC will not go away but will increase A good quarter but with some silicon enhancements from ICAP Intel reported Revenues of $20B and […]
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The latest gadgets were unveiled at CES 2021 including robots, drones, health monitors, holographs, and smart perfume. The post The Latest Gadgets Unveiled at CES 2021 appeared first on EETimes.
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Before we were all blindsided by Covid-19, 5G, edge computing, and Wi-Fi 6 were being rolled out. How did the pandemic affect all that? The post 5G and the Covid-19 Effect appeared first on EETimes.
This week’s show kicks off with Kevin and I discussing a smart camera vulnerability before digging into what it means when the White House becomes a smart home. We then discuss Wi-Fi 6E and what it means for IoT. Next up: new devices from Signify which makes Philips Hue-branded gear. Then we dig into Google […]
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The power electronics industry is transitioning from silicon to wide bandgap compound semiconductor materials such as silicon carbide and gallium nitride. The post Mobility And 5G Drive Adoption Of New Materials For Power Devices appeared first on Semiconductor Engineering.
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We just witnessed Intel reportedly having forced Bob Swan to install Pat Gelsinger, its prodigal son, while Qualcomm handed over the baton to president Cristiano Amon. The post Traps Intel’s Prodigal Son Should Avoid appeared first on EETimes.
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Despite short-term struggles, escalating US restrictions will bolster China’s domestic semiconductor industry in the long-term. At Yole Développement (Yole) we follow this industry and deliver our vision all year long through an impressive collection of technology & market reports as well as monitors: Status of the Advanced Packaging Industry, Status of the Power Electronics Industry, […]
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Advanced nodes and packaging are turning minor issues into major ones. The post Die-To-Die Stress Becomes A Major Issue appeared first on Semiconductor Engineering.
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Challenges persist for DRAM, flash, and new memories. The post More Data, More Memory-Scaling Issues appeared first on Semiconductor Engineering.
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For tech lovers and engineers alike, it’s that time of year again, where the best and brightest minds in the industry gather together at the Consumer Electronics Show (CES) to show off the latest tech and gadgets. The Taiwan Tech Arena, in particular, will be showcasing many new developments in the fields of cloud services, […]
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Bandwidth, latency, and power consumption are the primary challenges for upcoming 5G designs. The post The Impact Of 5G On Silicon Design appeared first on Semiconductor Engineering.
This week Kevin and I discuss Allegion’s acquisition of Yonomi, and what that means for those of you using the cloud service or consumers using the app. We then turn to a mention of the rebranding of GE Lighting after its acquisition by Savant last summer before talking about Singapore’s about-face on the use of […]
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Samsung is advocating jumping past 5G NR to 5G Stand Alone (SA). The company established a transmission rate record with partner Intel. The post Samsung Touts Superiority of Stand Alone Version of 5G appeared first on EETimes.
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Experts at the Table: Any chip can be reverse-engineered, so what can be done to minimize the damage? The post Why It’s So Hard To Stop Cyber Attacks On ICs appeared first on Semiconductor Engineering.
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How a FOCoS chip production line that yielded over 99% was established, and higher integration complexity achieved to meet the growing needs of the 5G era. The post A Production-Worthy Fan-Out Solution — ASE FOCoS Chip Last appeared first on Semiconductor Engineering.
This week’s show kicked off with us discussing a fascinating interview with the head of the LoRa Alliance about its efforts to bring Amazon’s Sidewalk network into compliance with the LoRaWan standard. We then discussed Apple’s app privacy labels, a similar option for Google users, and the nutrition-style label for connected device security. Then it […]
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CEA-Leti presented two papers this week at IEDM 2020 that confirm the advantages of combining 3D architectures and resistive-random-access-memories (RRAM) for in-memory computing (IMC), and their applications for Edge-AI and neural networks. The post CEA-Leti Scientists Present In-Memory Computing Pathways for Edge-AI & Neural Networks with 3D Architectures & Resistive-RAM appeared first on Semiconductor Digest.
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The shift to finer chip geometries and China’s SMIC accounted for the sharp increase in foundry spending. The post Chip Scaling, China Spending Fuel Fab Capex Surge appeared first on EETimes.
