TSMC dominates the Fan-Out market: ASE and Others are Catching Up – iMicronews
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TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions. “As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology […]