Are Apple’s Mobile Chips Now Made in the U.S? – Tom’s Hardware
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TSMC’s Fab 21 in Arizona already produces A16 processors on the N4P node.
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Send us a text In this episode, Françoise von Trapp talks with Onto Innovation’s Monita Pau and Jiangtao Hu about metrology for advanced packaging – why do we need it? What are the challenges, and how do we solve them? In semiconductor manufacturing front-end processes, metrology has always been a critical step to ensure consistency […]
Intel’s CHIPS Act Fund Delayed by Officials – Tom’s Hardware
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Intel’s CHIPS Act funds are reportedly being delayed as Washington requests a more concrete manufacturing roadmap from the company.
Material Export Restrictions Poised to Strain Semiconductors – Semiconductor Digest
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TECHCET has identified a potential strain on US semiconductor manufacturing capability as Chinese export restrictions on key materials have been announced. Material Export Restrictions Poised to Strain Semiconductors was posted by Shannon Davis on Semiconductor Digest.
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Intel and Cadence Collaborate to Advance the All-Important UCIe Standard – SemiWiki
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The Universal Chiplet Interconnect Express™ (UCIe™) 1.0 specification was announced in early 2022 and a UCIe 1.1 update was released on August 8, 2023. This open standard facilitates the heterogeneous integration of die-to-die link interconnects within the same package. This is a fancy way of saying the standard opens the door… Read More The post […]
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UC Riverside team develops new superconductor material for quantum computing – Tom’s Hardware
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A UCIe case study. The post Intel and Cadence Collaboration on UCIe: Demonstration of Simulation Interoperability appeared first on Semiconductor Engineering.
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Intel 18A Advanced Packaging is Key to Tech Leadership – EE Times
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Texas Instruments Set to Receive Up to $1.6 billion in CHIPS and Science Act Funding – Tom’s Harware
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U.S. government to support TI’s fab projects in Texas and Utah with $1.6 billion in direct funding and up to $8 billion in investment tax credits.
Why Glass Substrates? – SemiWiki
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TSMC Arizona Struggles to Overcome Vast Differences between Taiwanese and US Work Culture – Tom’s Hardware
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As TSMC fights to bring its new Arizona fabs online, the company learns the Taiwanese way isn’t going to work in America and needs to change.
The Multiphysics Challenges of 3D IC Designs – EE Times
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Metrology And Inspection For The Chiplet Era – SemiEngineering
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Recent developments address imminent needs of advanced nodes and packages, but not all the pieces are in place yet. The post Metrology And Inspection For The Chiplet Era appeared first on Semiconductor Engineering.
U.S. Department of Commerce Announces Funds to SK hynix’s AI Memory Chip Facility – Semiconductor Digest
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Send us a Text Message. This week’s episode was recorded live at SEMICON West where 10 of our community members have news to share. The conversation focused on the latest advancements in semiconductor technology, including lithography, packaging, and materials. Speakers discussed the need to reduce power consumption in AI chips, the potential of using interposers […]
