Qualcomm Reportedly Loses Interest in Intel Takeover – Tom’s Hardware
|
Qualcomm is not interested in buying Intel anymore but could consider separate parts of it.
Recommended Reads
SEMICON Europa 2024: How Do We Power Sustainable Exponential Growth?
|
Send us a text This episode was recorded live at SEMICON Europa in Munich. This year’s theme of this year’s conference is “Innovation and Collaboration: Powering Sustainable Exponential Growth”. In other words, how the semiconductor industry can work together to sustainably reach the trillion dollar goal by 2030 without compromising its Net Zero goals. It’s […]
Scholarship Scheme May Provide Solution for Talent Shortage – EE Times
|
Companies must join scholarship schemes to build a skilled workforce and combat talent shortages. The post Scholarship Scheme May Provide Solution for Talent Shortage appeared first on EE Times.
One Chip Vs. Many Chiplets – SemiEngineering
|
Challenges and options vary widely depending on markets, workloads, and economics. The post One Chip Vs. Many Chiplets appeared first on Semiconductor Engineering.
The U.S. CHIPS for America Mash-Up
|
Send us a text It’s been quite an exciting year for the U.S. Chips for America as the funding starts rolling out. All year long, Françoise von Trapp has interviewed various government dignitaries about various elements of the CHIPS Act. This episode brings these episodes together in order of appearance, to give you a timeline […]
The Chips R&D Program Seeks to Accelerate Innovation – SemiWiki
|
The CHIPS and Science Act has allocated $11 billion for semiconductor R&D, including for advanced packaging and AI-driven design. Companies should apply now. In 2022, the United States signed the $50 billion Chips and Science Act. Under the act, the National Institute of Standards and Technology (NIST), which is part of … Read More The […]
Onto Innovation’s PACE Partners Talk About Collaborating on Panel-Level Packaging
|
Send us a text On September 30, 2024, Onto Innovation held the grand opening of its Packaging Applications Center of Excellence – or as it’s being called, PACE. Françoise von Trapp attended the grand opening to learn why the company has partnered with like-minded suppliers of the panel-level packaging ecosystem to accelerate the development of […]
New PFAS Removal Process Aims to Stamp Out Pollution Ahead of Semiconductor Industry Growth – Semiconductor Digest
|
A University of Illinois Urbana-Champaign study is the first to describe an electrochemical strategy to capture, concentrate and destroy mixtures of diverse chemicals known as PFAS — including the increasingly prevalent ultra-short-chain PFAS — from water in a single process. New PFAS Removal Process Aims to Stamp Out Pollution Ahead of Semiconductor Industry Growth was […]
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem – Semiconductor Digest
|
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector. European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem was posted by Shannon Davis on […]
Hybrid Bonding Makes Strides Toward Manufacturability – SemiEngineering
|
Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications. The post Hybrid Bonding Makes Strides Toward Manufacturability appeared first on Semiconductor Engineering.
LIVE from Boston MA: Member Highlights from IMAPS Symposium 2024
|
Send us a text Recorded live at the IMAPS Symposium 2024 in Boston MA, where 3D InCites member companies presented their latest technologies and showcased their products. This episode features conversations with nine of our member companies. Brendan Wells, Amkor Technologies, Inc., explains the difference between laminate and strip-based substrates for advanced packaging and when […]
The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing – SemiEngineering
|
Identify killer failure mechanisms early in the process flow and prevent crack propagation. The post The Long Climb: Bringing Through Glass Vias (TGV) To High-Volume Manufacturing appeared first on Semiconductor Engineering.
SEMICON Europa Spotlighting Innovation and Collaboration Powering Sustainable Growth – Semiconductor Today
|
Themed ‘Innovation and Collaboration: Powering Sustainable Exponential Growth’, SEMICON Europa 2024 is gathering industry experts at Messe München in Munich, Germany (12–15 November) for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce. Co-located with electronica, it features keynotes from the electronics design and manufacturing ecosystem, academia […]
Chiplet Marketplace, Sustainability Top Discussions at OCP Summit – EE Times
|
Explore chiplet and AI breakthroughs at the OCP Summit through our video interviews. The post Chiplet Marketplace, Sustainability Top Discussions at OCP Summit appeared first on EE Times.
IMAPS Society Award Winners Talk About How Belonging to IMAPS Enriched Their Microelectronics Careers
|
Send us a text At IMAPS Symposium 2024, the annual IMAPS Society Awards were presented. These awards recognize IMAPS members who stand out for their efforts. They are peer-nominated awards and selected by a panel of previous winners, so it’s very special to receive one, as it means many members have noticed their efforts. In […]
Photonics Startup Exits Stealth with $44M to Solve Data Center Escape Bandwidth Problem – EE Times
|
The CEO of Xscape Photonics spoke to EE Times about the AI data center escape bandwidth issue and how funding will help the company bring its technology to market. The post Photonics Startup Exits Stealth with $44M to Solve Data Center Escape Bandwidth Problem appeared first on EE Times.
3DIO IP For Multi-Die Integration – SemiEngineering
|
Accelerate the scaling of system functionality with 3D packaging. The post 3DIO IP For Multi-Die Integration appeared first on Semiconductor Engineering.
Live from IMAPS Symposium 2024: Updates on the NAPMP, Silicon Photonics and RDL Packaging
|
Send us a text This episode was recorded live at the IMAPS International Symposium in Boston MA. Françoise von Trapp speaks with Dev Palmer, director of the National Advanced Packaging Manufacturing Program; Sandeep Sane of Lightmatter; Craig Bishop, Deca and Brett Wilkerson, AMD. Dev Palmer explains Chips Act’s funding distribution and its impact on the […]
Maximizing 3DIC Design Productivity with 3DBlox – SemiWiki
|
At the 2024 TSMC OIP Ecosystem Forum, one of the technical talks by TSMC focused on maximizing 3DIC design productivity and rightfully so. With rapid advancements in semiconductor technology, 3DICs have become the next frontier in improving chip performance, energy efficiency, and density. TSMC’s focus on streamlining the… Read More The post Maximizing 3DIC Design […]
SEMI Sets Sights on Security – EE Times
|
The SEMI SMCC will develop a semiconductor manufacturing industry profile for NIST Cybersecurity Framework 2.0. The post SEMI Sets Sights on Security appeared first on EE Times.
