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When a heatwave taxes the power grid, that’s when we discovered how much energy our electronics were actually drawing. The post Heatwaves, The Grid, and Your Electronics appeared first on EETimes.
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The dominance of MEMS pressure sensors in the automotive market may be under threat as the industry moves to replace Internal Combustion Engine (ICE) vehicles with EVs. Electrification will reduce many ‘traditional’ application areas in hybrid models and eliminate them altogether in fully electric vehicles. The market research and strategy consulting company, Yole Développement (Yole) […]
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Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments. Micron to Sell Lehi, Utah, Fab to Texas Instruments was posted by Shannon Davis on Semiconductor Digest.
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In this first Member Spotlight episode, we have a conversation with Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What’s exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer […]
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The potential risks of an unsecured supply chain and how to achieve supply chain security through tools, testing, and/or professional services. The post Supply Chain Resiliency appeared first on Semiconductor Engineering.
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ENEOS Holdings, (CEO: Katsuyuki Ota, hereinafter referred to as “ENEOS”) and Ample, (CEO: Khaled Hassounah, President: John de Souza, hereinafter referred to as “Ample”), a U.S-based startup that ENEOS invested in, are announcing a business collaboration to launch an EV battery swapping service in Japan. Through this partnership, both companies aim to develop an energy […]
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There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve. The post 5 Key Vulnerabilities in the Semiconductor Supply Chain appeared first on Semiconductor Digest.
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In this episode, Françoise interviews Bharat Kapoor, lead partner, Americas, at Kearney. a global strategy and management consulting firm, where he founded and leads PERLab, the firm’s design innovation service. Bharat has solid roots in semiconductor engineering and design. His interest in electrical engineering began in his hometown in the Himalayas when he was in […]
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Global IC market expected to exceed $500 billion for the first time. The post IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24% appeared first on Semiconductor Digest.
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The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings. General 3DFabricTM Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric. 2.5D package technology – CoWoS The 2.5D packaging options are divided into the CoWoS… Read More The post Highlights of the TSMC […]
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TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions. “As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology […]
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Ultra-High-Density Fan-Out (UHD FO) Packaging has started to be commercialized in the market. This advanced packaging market segment has been deeply analyzed by Yole Développement (Yole) and the advanced packaging team with a dedicated report, Fan-Out WLP and PLP Applications and Technologies 2021. In this new technology & market report, the market research & strategy […]
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The chip shortage in the wake of COVID 19 is such a big story that it’s attracting mainstream media attention, and it feels like the general public now knows what semiconductors are. The upshot is that the shortage combined with the demand for chips is putting a strain on the entire semiconductor supply chain. With […]
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TSMC said its customers are looking for high performance computing to support autonomous driving in vehicles. That’s new. And also old. The post TSMC’s Zhang: Automotive is Going HPC appeared first on EETimes.
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Tapping into multiple services, both inside and outside a car, requires a rethinking of everything from architectures to security. The post Big Changes Ahead For Connected Vehicles appeared first on Semiconductor Engineering.
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It was bad enough when only the walls had ears. It’s going to be far worse when everything has ears.
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By Junko Yoshida for EETIMES – An accelerated U.S. vs. China trade war has elevated “decoupling” into a trendy buzzword to describe the possibility of a breakup between two of the world’s most powerful economies. The question at hand, though, is if there really is a decoupling going on? Perhaps not on the macro-economic level, […]
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Today we are talking about the importance of sustainability in semiconductor manufacturing, which you may have noticed is a really hot topic right now. And it's also one we feel really strongly about because of its impact on the future of society. Our guests today are Dean Freeman, who has been blogging about it for […]
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Industrial, consumer ad automotive are driving the adoption of neuromorphic with first products. “AI is hungry for performance, and Moore’s law dynamics will not suffice to cover the needs of the ongoing 5G/IoT/AR/Robotic revolution. The ecosystem is and will stay R&D-oriented for the next 3 to 5 years.” asserts Adrien Sanchez, Technology & Market Analyst, […]
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Long lead times expected at least through the end of this year, as chipmakers scramble for solutions. The post Automotive IC Shortage Drags On appeared first on Semiconductor Engineering.
