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Industrial, consumer ad automotive are driving the adoption of neuromorphic with first products. “AI is hungry for performance, and Moore’s law dynamics will not suffice to cover the needs of the ongoing 5G/IoT/AR/Robotic revolution. The ecosystem is and will stay R&D-oriented for the next 3 to 5 years.” asserts Adrien Sanchez, Technology & Market Analyst, […]
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Long lead times expected at least through the end of this year, as chipmakers scramble for solutions. The post Automotive IC Shortage Drags On appeared first on Semiconductor Engineering.
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Welcome to our very first episode! Because podcasting is becoming an essential part of any business’s marketing toolbox, we thought it would be great to kick it off with a basic discussion about ways to market your company in this competitive industry. To do that, we tapped into Joe Cestari, Executive Director of our community […]
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While high-volume chips are expected to recover from recent shortages relatively quickly, small and medium-sized IC orders face a rocky path. The post Chiplets: A Solution For The Shortage Of Chips appeared first on Semiconductor Engineering.
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An extreme hypothetical scenario of complete disruption of Taiwanese foundries for one year could cause the global electronics supply chain to come to a halt. The post The Chip Shortage Wake-up Call appeared first on Semiconductor Digest.
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Is there any technology you took for granted until you discovered that others had no idea of its existence?
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Businesses have limited options to solve the current chip shortages, but they can prepare for the next crisis. The post What Chip Shortages Taught Us About Supply Chain Resiliency appeared first on EETimes.
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IBM announced a breakthrough in semiconductor design and process with the development of the world’s first chip announced with 2 nm nanosheet technology. The new design is projected to achieve 45 percent higher performance and 75 percent lower energy use than today’s 7 nm chips. It will likely not be in production until 2024. The […]
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Awareness grows, but so does the complexity of systems and the potential attack surface. The post IC Security Threat Grows As More Devices Are Connected appeared first on Semiconductor Engineering.
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Mobility app developer Lyft has signed an agreement with Woven Planet Holdings, a subsidiary of Toyota Motor Corporation, for the acquisition of Lyft’s self-driving vehicle division, Level 5. The transaction also includes multi-year non-exclusive commercial agreements between Lyft and Woven Planet to accelerate the development and enhance the safety of automated driving technology. “Announcement launches […]
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– Business is about as good as it gets- $75B WFE in 2021? – China remains strong at 32% despite SMIC lack of license – NAND remains 48% of revs versus 31% foundry – DRAM steady @ 14% – Service was record $1.3B Strong results in a strong market Lam reported revenues of $3.85B and […]
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5G may have just arrived, but there’s lots of room to grow. The post Hyperconnectivity And The Path To 6G appeared first on Semiconductor Engineering.
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The chip shortage is now mainstream news and something people on the street have actually heard of. The post The Chip Shortage: Moore Than Potatoes appeared first on EETimes.
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Chiplets with multiple smaller dies integrated in a single package is a key to moving data faster. The post Advanced Packaging For Improved Network Communications appeared first on Semiconductor Engineering.
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In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More The post Enabling Next Generation Silicon In […]
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Challenges rise for both advanced packages and for new innovations in older technologies. The post Making Chip Packaging More Reliable appeared first on Semiconductor Engineering.
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Recently, there have been a number of articles with titles such as “Study shows residential electronic scrap generation is declining” or “E-scrap generation on the decline, study finds.” or “E-Waste Is Declining, Government Needs To Change Laws To Keep Up – And Get Out Of The Recycling Business.” As a veteran of … Read More […]
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When I started in EDA the big three were Daisy, Mentor and Valid (DMV as we called them). Then came Synopsys in 1986 followed by Cadence, which was a clever merger between ECAD (Dracula DRC) and Solomon Design. Daisey and Valid were pushed aside and then there were, “Three dogs hovering over one bowl of […]
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The business agility invoked by Intel’s new CEO, including the creation of ISF, is new and based on sound reasoning. The post Intel 2.0 appeared first on EETimes.
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Increasingly complex systems are creating much different relationships between engineering specialities. The post How Heterogeneous ICs Are Reshaping Design Teams appeared first on Semiconductor Engineering.
