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Chiplets with multiple smaller dies integrated in a single package is a key to moving data faster. The post Advanced Packaging For Improved Network Communications appeared first on Semiconductor Engineering.
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In early April, Gabriele Saucier kicked off Design & Reuse’s IPSoC Silicon Valley 2021 Conference. IPSoC conference as the name suggests is dedicated to semiconductor intellectual property (IP) and IP-based electronic systems. There were a number of excellent presentations at the conference. The presentations had been… Read More The post Enabling Next Generation Silicon In […]
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Challenges rise for both advanced packages and for new innovations in older technologies. The post Making Chip Packaging More Reliable appeared first on Semiconductor Engineering.
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Recently, there have been a number of articles with titles such as “Study shows residential electronic scrap generation is declining” or “E-scrap generation on the decline, study finds.” or “E-Waste Is Declining, Government Needs To Change Laws To Keep Up – And Get Out Of The Recycling Business.” As a veteran of … Read More […]
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When I started in EDA the big three were Daisy, Mentor and Valid (DMV as we called them). Then came Synopsys in 1986 followed by Cadence, which was a clever merger between ECAD (Dracula DRC) and Solomon Design. Daisey and Valid were pushed aside and then there were, “Three dogs hovering over one bowl of […]
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The business agility invoked by Intel’s new CEO, including the creation of ISF, is new and based on sound reasoning. The post Intel 2.0 appeared first on EETimes.
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Increasingly complex systems are creating much different relationships between engineering specialities. The post How Heterogeneous ICs Are Reshaping Design Teams appeared first on Semiconductor Engineering.
Get a sneak peak into SWE Magazine’s State of Women in Engineering issue in this SWE Diverse episode with Roberta Rincon, SWE’s associate director of research, and Anne Perusek, SWE’s director of editorial and publications. Listen along as Roberta and Anne discuss SWE’s upcoming research issue (to be published in April 2021), with a large […]
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Has EDA failed to innovate, or has the semiconductor industry shown an unwillingness to adopt new tools and methodologies? As always, the answer is somewhere in between. The post Stuck In A Rut appeared first on Semiconductor Engineering.
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More woes for the global automotive manufacturing industry. A serious fire at Renesas’ chip making plant in Ibaraki Prefecture will, according to the company, have “a very large impact” on its ability to supply devices to the sector, as well as some other sectors. The fire destroyed a significant portion of the huge facility, including […]
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No single screening method will show all the possible defects that create opens. The post Hunting For Open Defects In Advanced Packages appeared first on Semiconductor Engineering.
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Combined, the two companies are forecast to represent 43% of global semiconductor industry capital spending this year. The post Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology appeared first on Semiconductor Digest.
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In a sudden but perhaps not too surprising announcement, Micron has stated that they are ceasing all R&D of 3D XPoint memory technology. Intel and Micron co-developed 3D XPoint memory, revealed in 2015 as a non-volatile memory technology with higher performance and endurance than NAND flash memory. Intel has been responsible for almost all of the commercial […]
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“Today, the scope for applications using glass substrates in the semiconductor field is broad and highly diversified.” asserts Amandine Pizzagalli, formerly Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole) and today Finance Project Manager at Yole Finance, part of Yole. She adds:“Nowadays, the number of glass vendors able to deliver wafers and panels […]
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The global semiconductor intellectual property (IP) market was valued at US$ 4,111.0 Million in 2019 and is expected to surpass US$ 7,103.0 Million by 2027, registering a CAGR of 8.9% during the forecast period (2020-2027), published by Coherent Market Insights. The post Global Semiconductor Intellectual Property (IP) Market to Reach US$ 7,103.0 Million by 2027 […]
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Written by Richard Stevenson for CompoundSemiconductor. net – The pandemic is behind soaring sales in some sectors of the compound semiconductor industry, while others take a hit or continue along an existing trajectory. We have all suffered from the pandemic on a personal level. Loved ones have been lost, many of us have had to […]
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The demand for rare earth elements used in smartphones and laptops has exploded within the last 20 years, but the supply chain is caught up in global politics. The post The Politics of Rare Earth Metals appeared first on EETimes.
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Chiplets are technically and commercially viable, but not yet accessible to the majority of the market. How does the ecosystem get established? The post Chiplets For The Masses appeared first on Semiconductor Engineering.
In this SWE Diverse episode, we wrap up Black History Month with Nikia Brown, African-American Affinity Group Black History Month Lead, and Louvere Walker-Hannon, SWE African-American Affinity Group Lead and MathWorks Senior Application Engineer. Listen as Louvere and Nikia discuss the challenges faced by Black women in STEM, the importance of mentoring and volunteering in […]
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US President’s executive order expects to add $37 billion investment to address short-term chip capacity shortfall. The post Executive Order Paves Way for $37bn to Boost U.S. Chip Capacity appeared first on EETimes.
