In this SWE Diverse episode, Heather Doty, SWE FY21 President, speaks with one of our WE20 Keynote speakers and recipient of the Suzanne Jenniches Upward Mobility Award, Jennifer Rumsey, president of the Components Segment for Cummins Inc. Together they discuss Laura’s goals as President of Components at Cummins and a sneak peek at Jennifer’s WE20 […]
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For AMD to acquire a company as large as Xilinx comes as a shock to many. Reportedly, the deal would cost AMD $30 billion, which is almost a third of its market capitalization. The post AMD and Xilinx: A Match Made in Silicon Valley? appeared first on EETimes.
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Apple enters the 5G era with its new iPhone 12 series of smartphones. The company also introduced the HomePod smart speaker. The post Apple Finally Joins The 5G Party appeared first on EETimes.
This week’s IoT podcast kicks off with a focus on Apple’s new HomePod mini and the inclusion of the Thread protocol on the device. We then discuss how it fits into the world of smart speakers and my own recent purchases, such as my feelings about the Echo Studio and the Nest Audio. We then […]
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The number of options is increasing, but tooling and methodologies haven’t caught up. The post Confusion Grows Over Packaging And Scaling appeared first on Semiconductor Engineering.
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Chip disaggregation means a larger attack surface, increasing the chances of a successful trojan or man-in-the-middle attack. The post Protecting Chiplet Architectures With Hardware Security appeared first on Semiconductor Engineering.
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Nvidia-Arm deal ‘will be good for customers,’ while Arm GPU and NPU development will continue The post Huang ‘Confident’ Nvidia-Arm Deal Will Get Past Regulators appeared first on EETimes.
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The U.S. Department of Defense has awarded Intel Federal LLC the second phase of its State-of-the-Art Heterogeneous Integration Prototype (SHIP) program. The post Intel Wins US Government Advanced Packaging Project appeared first on Semiconductor Digest.
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Growing complexity is creating an array of confusing options. The post System-Level Packaging Tradeoffs appeared first on Semiconductor Engineering.
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Somewhat limited improvements of client and server CPUs coupled with delays of new process technologies made Intel look pale. But being a large company has its perks and Intel’s roadmap reveals a path to regaining market share and mind share. The post Intel’s Roadmap: A Closer Look at Process Technologies and Production Plans appeared first […]
This week’s show covers device launches from Amazon last week and Google this week. We also talk about connected coffee machines getting hacked, Amazon letting people pay with their palm, and Apple’s smart home patents. After that, we switch to developer news with Twilio’s new IoT platform and ARM’s chip designs for autonomous robots and […]
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“Consumer appetite for data has not been reduced by the COVID-19 pandemic” asserts Cédric Malaquin, Technology & Market Analyst, specialized in RF devices & technologies within the Power & Wireless division at Yole Développement (Yole). “In fact, it’s the opposite. People realized the importance of being connected during lockdown. Most of the data traffic increase […]
This week’s podcast covers our thinking on Amazon’s new Sidewalk network, but not the devices the retailer launched on Thursday. As part of the network conversation, we also discussed LoRaWAN network operator Senet’s new $16 million in funding before detailing three upcoming products from Wyze. We then talked about sharing Alexa routines, Google’s new mystery […]
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GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC) a significantly enhanced design for manufacturability (DFM) kit embedded with advanced machine learning (ML) capabilities. The post GLOBALFOUNDRIES and Mentor Collaborate to Launch New Semiconductor Verification Solution Embedded with Advanced Machine Learning Capabilities appeared first on Semiconductor Digest.
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The Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), today released a study analyzing the impact of proposed federal incentives for domestic semiconductor manufacturing. The post Study Finds Federal Incentives for Domestic Semiconductor Manufacturing Would Strengthen America’s Chip Production, Economy, National Security, Supply Chains appeared first on Semiconductor Digest.
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Making all the components work properly is only the beginning. The post How Secure Is The Package? appeared first on Semiconductor Engineering.
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Factors driving the development of edge computing and the benefits it could provide to a network. The post Artificial Intelligence & IP In Edge Computing For Faster 5G And The IoT appeared first on Semiconductor Engineering.
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An article written by Pradeep Chakraborty for Pradeep’s TechPoint – Yole Developpement, France, organized a session on the NAND landscape. It also looked at how Kioxia, and the other leading memory players are doing. Overview Walt Coon, VP, NAND and Memory Research, Yole Developpement, provided the NAND market overview. The market is dominated by six […]
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The unexpected consequences of the pandemic are showing up in forecasts for production equipment and microprocessors The post Forecasts: ICs, Fabs, Help Maintain Our Virtual Presence appeared first on EETimes.
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Designing with ICs created specifically for automotive applications mitigates the need to make the performance tradeoffs that chips repurposed from other uses require. The post Why Designing ICs From The Ground Up For Automotive Applications Matters appeared first on Semiconductor Engineering.
