The Detritus of a Digital Life – EE Times
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My contacts are just part of the digital baggage I lug from one phone to the next. My photos are a bit out of control… The post The Detritus of a Digital Life appeared first on EETimes.
Recommended Reads
Is Apple the Most Valuable Semiconductor Company in the World? – SemiWiki
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– The new M1 chip unveils previously hidden asset – Could/should Apple sell semiconductors? – Are servers next? – The M1 chip appears to be a rousing success and the beginning of a new era Essentially 100% of all early reports on the performance of the M1 chip have come back with stellar reviews. Great […]
Episode 295: Project CHIP Goes Commercial and the Eero Pro Review – IoT Podcast
This week’s podcast kicks off with the news that Project Connected Home over IP (CHIP) will also have a commercial element focused on offices, apartments, and public buildings. Then we focus on edge computing with a new way to bring machine learning to the edge and Arm expanding its free IP license program to some […]
The Ten Commandments Of Packaging – SemiEngineering
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Reducing handling, predicting failures, and more tips for dealing with complex packaging technologies. The post The Ten Commandments Of Packaging appeared first on Semiconductor Engineering.
Apple M1 Processor, Passing on the Chiplets – EE Times
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In light of Apple’s M1 processor announcement this week, let me ponder why Apple passed on the chiplets, and where chiplets make sense. The post Apple M1 Processor, Passing on the Chiplets appeared first on EETimes.
TSMC to Build first US Fab in Arizona – SemiWiki
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Well, it’s official, the TSMC Board of Directors approved an investment to establish a wholly-owned subsidiary in Arizona with a paid-in capital of $3.5 billion. As history shows the investment may be more than that but $3.5B is a great starting point. This is being discussed in the SemiWiki Forum and I have been gathering […]
Qualcomm Allowed to Sell 4G Chips to Huawei in Exception to Ban – iMicronews
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Qualcomm received a license from the U.S. government to sell 4G mobile phone chips to China’s Huawei Technologies, an exemption to U.S. trade restrictions imposed amid rising tensions with China. “We received a license for a number of products, which includes some 4G products,” a Qualcomm spokeswoman told Reuters. Qualcomm and all other American semiconductor […]
Advances in AI, MEMS Usher in the Internet of Voice Era
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By Karen Field for Fierce Electronics – When it comes to sensor technologies for sound and voice control, innovation is happening on all fronts—from the audio device itself to the software and algorithms and big improvements in MEMS microphones themselves. AI-driven data analysis FierceElectronics recently spoke with Dimitrios Damianos, Technology & Market Analyst and Custom […]
Episode 294: Let’s Talk about Thread and Digital Twins – IoT Podcast
This week’s show starts off with a conversation about Thread because it’s clear that it’s going to become an important radio for the future of the smart home. We explain why before discussing an update to LoRaWAN and an alternative to the big voice-controlled smart speakers from Josh.ai. After that, we express frustration with exploding […]
Dealing With Two Very Different Sides Of 5G – SemiEngineering
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Experts at the Table: One side is well-behaved and predictable, the other is not. How to ensure reliability across both is a looming challenge. The post Dealing With Two Very Different Sides Of 5G appeared first on Semiconductor Engineering.
SK hynix to Acquire Intel NAND Memory Business – Semiconductor Digest
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SK hynix and Intel will endeavor to obtain required governmental approvals, expected in late 2021. The post SK hynix to Acquire Intel NAND Memory Business appeared first on Semiconductor Digest.
The Future of Semiconductor Manufacturing – EE Times
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Consolidation and speed-to-market success in foundries have enabled leading semiconductor companies to compete successfully without their own manufacturing fabs. The post The Future of Semiconductor Manufacturing appeared first on EETimes.
Growing Complexity Adds To Auto IC Safety Challenges – SemiEngineering
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Building together a verification approach for safety and security in automotive chips is complex, multi-faceted, and extremely difficult. The post Growing Complexity Adds To Auto IC Safety Challenges appeared first on Semiconductor Engineering.
Episode 293: Amazon’s Halo and the Election and IoT – IoT Podcast
We kicked off the post-Election Day show with an update on ballot initiatives in Massachusetts, Maine, and California that have an impact on the internet of things. After that, we discussed Google’s ability to predict HVAC problems and the promise of smart thermostats. Then we focused on two devices worth covering, a smart lamp from […]
Qorvo to create US-funded Heterogeneous Integrated Packaging RF Production and Prototyping Center – Semiconductor Today
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Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has been selected by the US government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production and prototyping center. The SHIP program aims to ensure that microelectronics packaging expertise and leadership is available for […]
5G iPhone: What’s Apple’s Next Step in RF, Antenna? – EE TImes
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An iPhone teardown: There is no better entertainment than speculating about Apple’s next step in its silicon development in order differentiate its iPhones from others. The post 5G iPhone: What’s Apple’s Next Step in RF, Antenna? appeared first on EETimes.
Low Energy Intelligence at the Extreme Edge – SemiWiki
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Intelligence at the edge is a hot topic these days. Not having to go all the way to the cloud to recognize objects, faces, speech and so on. But I find promoters can be rather fuzzy about what they mean by “the edge”. For many, intelligence at the edge means intelligence closer to the edge […]
Defect Challenges Grow For IC Packaging – SemiEngineering
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New equipment will help, but it’s expensive and requires more steps. The post Defect Challenges Grow For IC Packaging appeared first on Semiconductor Engineering.
Will Wearables boost the Consumer and Medical Electronics Market? – i-Micronews?
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“The era of wearables is definitely here and confirmed by large consumer adoption.” asserts Jérôme Mouly, Senior Technology & Market Analyst and Business Developer at Yole Développement (Yole). “Whether wrist-worn, head-worn and hearable, body-worn, or smart clothing, we estimate the market to reach US$97.9 billion by 2025, with a 11.2% CAGR from 2019 to 2025”. […]
TSMC Sees HPC As Next Inflection Point – EE Times
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Taiwan Semiconductor Manufacturing Co. expects the main driver of its growth in the next several years to be HPC, overtaking its current smartphone business The post TSMC Sees HPC As Next Inflection Point appeared first on EETimes.
