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Challenges and opportunities in manufacturing, testing, and deploying increasingly complex microelectromechanical systems. The post MEMS: New Materials, Markets And Packaging appeared first on Semiconductor Engineering.
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While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff. While Industry Booms, China […]
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The 71st IEEE Electronic Components and Technology Conference (ECTC) started on June 1 and remained open until July 16, 2021 due to popular demand. The conference was held virtually, and attracted 1,380 attendees from 23 countries. The 71st ECTC included 346 papers in 46 technical sessions and a record 14 special sessions and panels, delivering […]
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Through enabling design and supply chain agility, SiP will reach more than $19B by 2026. “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the […]
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In the relentless pursuit to increase performance while reducing size, the semiconductor industry is exploring every avenue possible. Packaging, the process of combining different parts of a component, provides a promising area for advancements. An expert from SK hynix offers insights on how new packaging technologies, such as TSV (through-silicon via), are helping create smaller, […]
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In the aftermath of Gay Pride Month, we bring you a very special episode of the 3D InCites Podcast. Even though it’s July, we believe it is important to be allies to the LGBTQ community all year round. While many companies showed support for the LGBTQ+ community by adapting their logos with rainbow colors and […]
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How the end of scaling and the electrification of everything are changing chip design. The post CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets appeared first on Semiconductor Engineering.
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The MEMS market will grow due to new opportunities in audio for microphones, microspeakers and inertial MEMS, AR/VR for optical MEMS, and other emerging applications. “Last year when COVID-19 erupted, the effects on various industries were felt immediately, which in turn had an after-effect on the MEMS business. But the crisis did not impact all […]
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What’s changing in vehicles and how that will impact chip inspection, metrology, and manufacturing. The post Automotive Innovations In Semiconductors appeared first on Semiconductor Engineering.
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When a heatwave taxes the power grid, that’s when we discovered how much energy our electronics were actually drawing. The post Heatwaves, The Grid, and Your Electronics appeared first on EETimes.
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The dominance of MEMS pressure sensors in the automotive market may be under threat as the industry moves to replace Internal Combustion Engine (ICE) vehicles with EVs. Electrification will reduce many ‘traditional’ application areas in hybrid models and eliminate them altogether in fully electric vehicles. The market research and strategy consulting company, Yole Développement (Yole) […]
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Micron Technology, Inc. announced today that it has entered into a definitive agreement to sell its Lehi, Utah, fab to Texas Instruments. Micron to Sell Lehi, Utah, Fab to Texas Instruments was posted by Shannon Davis on Semiconductor Digest.
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In this first Member Spotlight episode, we have a conversation with Zia Karim, Yield Engineering Systems, and Mie Lillethorup, RadiSurf about their collaboration to bring unique nanotech-based surface enhancement materials from the lab to the fab. What’s exciting about these materials and processes is the potential they hold for simplifying both temporary and permanent wafer […]
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The potential risks of an unsecured supply chain and how to achieve supply chain security through tools, testing, and/or professional services. The post Supply Chain Resiliency appeared first on Semiconductor Engineering.
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ENEOS Holdings, (CEO: Katsuyuki Ota, hereinafter referred to as “ENEOS”) and Ample, (CEO: Khaled Hassounah, President: John de Souza, hereinafter referred to as “Ample”), a U.S-based startup that ENEOS invested in, are announcing a business collaboration to launch an EV battery swapping service in Japan. Through this partnership, both companies aim to develop an energy […]
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There’s an ongoing push to strengthen the semiconductor supply chain, but making gains in that area is not as straightforward as some people initially believed. Here are five of the top vulnerabilities for the semiconductor sector to solve. The post 5 Key Vulnerabilities in the Semiconductor Supply Chain appeared first on Semiconductor Digest.
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In this episode, Françoise interviews Bharat Kapoor, lead partner, Americas, at Kearney. a global strategy and management consulting firm, where he founded and leads PERLab, the firm’s design innovation service. Bharat has solid roots in semiconductor engineering and design. His interest in electrical engineering began in his hometown in the Himalayas when he was in […]
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Global IC market expected to exceed $500 billion for the first time. The post IC Insights Raises Its 2021 Worldwide IC Market Forecast to +24% appeared first on Semiconductor Digest.
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The recent TSMC Technology Symposium provided several announcements relative to their advanced packaging offerings. General 3DFabricTM Last year, TSMC merged their 2.5D and 3D package offerings into a single, encompassing brand – 3DFabric. 2.5D package technology – CoWoS The 2.5D packaging options are divided into the CoWoS… Read More The post Highlights of the TSMC […]
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TSMC’s Fan-Out success with Apple and high-performance computing are pushing Intel, Samsung, ASE, and all other competitors to find new innovative solutions. “As part of advanced packaging, FO solutions have become critical and effective for foundries and IDMs, increasing device performance and bandwidth and reducing the gap between Silicon and substrate.” asserts Stefan Chitoraga, Technology […]
