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3D and heterogeneous system integration research including capillary self-assembly of tiny dies with a size of less than 0.1 mm & advanced FHE using FOWLP. The post Chiplet-Based Advanced Packaging Technology from 3D/TSV to FOWLP/FHE appeared first on Semiconductor Engineering.
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A new report predicts that the global semiconductor packaging market will reach $60.44 billion by 2030 from $27.10 billion in 2020, growing at a CAGR of 9.10% from 2021 to 2030. Semiconductor Packaging Market to Reach $60.44B by 2030 was posted by Pete Singer on Semiconductor Digest.
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Over the last 18 months, the European semiconductor industry has felt the repercussions of supply chain interruptions due COVID 19 and trade wars, combined with exploding global demand for chips driven by the digital transformation. There are also questions about regional sovereignty and the need to strengthen the local supply chain. To address these topics […]
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At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars. Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia was posted by Pete Singer on Semiconductor Digest.
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Over the last 50 years, global temperatures have risen due to increased greenhouse gas emissions. A shared commitment and technological innovation can help reverse the impact of climate change. The post Renewable Energy, Tech Innovation Needed to Slow Climate Change appeared first on EETimes.
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The benefits of WLFO versus flip-chip land grid array (FCLGA) packaging for a radio frequency (RF) MEMS digital tunable capacitor array. The post Wafer-Level Fan-Out For High-Performance, Low-Cost Packaging Of Monolithic RF MEMS/CMOS appeared first on Semiconductor Engineering.
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Arizona, New York and Texas are in the running, with U.S. tax breaks likely the deciding factor. The post Samsung Considering 3 U.S. Fab Locations appeared first on EETimes.
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Experts at the Table: Rising costs and the physical limits of reticles is forcing more companies to examine alternatives to shrinking geometries. The post Current And Future Packaging Trends appeared first on Semiconductor Engineering.
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Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool expected to ship during third quarter of 2021 ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, announced the launch of its Bevel Etch product, which further expands ACM’s […]
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The acronyms involving funding for semiconductor manufacturing are flying around Washington. There is the Chips for America Act, focused on re-shoring, The Facilitating American-Built Semiconductors (FABS) Act that promises tax credits for investments in, either equipment or fabs. and then there’s the $250 billion US Innovation and Competition Act, which earmarks $52bn for new chip […]
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Highlights • Amkor is advancing the evolution of 5G RF module design • Amkor DSMBGA enables integration of more components • The advanced packaging market for 5G RF Front End Module (FEM) projected to reach US $2.3B by 2026 • Amkor continues to innovate in advanced SiP technologies Amkor Technology, Inc. (Nasdaq: AMKR), a leading […]
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Sales in June were 2.1% more than the May 2021 total of $43.6 billion. Global Semiconductor Sales Increase 29.2% Year-to-Year in June; Q2 Sales Up 8.3% Over Q1 was posted by Shannon Davis on Semiconductor Digest.
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Earlier this year, on February 18, 2021, the next-generation Mars Rover, Perseverance, successfully landed on Mars. According to Earth and Sky Magazine, Perseverance was the first artificial object to land on Mars since 2018, and the first Rover to land since 2012 when Curiosity touched down. Perseverance traveled 293 million miles (472 million km) – […]
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Challenges and opportunities in manufacturing, testing, and deploying increasingly complex microelectromechanical systems. The post MEMS: New Materials, Markets And Packaging appeared first on Semiconductor Engineering.
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While China’s share of all semiconductor production has shot up, the Americas region has declined, raising alarm bells in Washington. “We see a continuation of this trend, with the Americas dropping by one more percent point next year and China building out its lead.” – SEMI senior principal analyst Christian Dieseldorff. While Industry Booms, China […]
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The 71st IEEE Electronic Components and Technology Conference (ECTC) started on June 1 and remained open until July 16, 2021 due to popular demand. The conference was held virtually, and attracted 1,380 attendees from 23 countries. The 71st ECTC included 346 papers in 46 technical sessions and a record 14 special sessions and panels, delivering […]
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Through enabling design and supply chain agility, SiP will reach more than $19B by 2026. “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.” asserts Vaibhav Trivedi, Senior Technology & Market analyst, Packaging, within the […]
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In the relentless pursuit to increase performance while reducing size, the semiconductor industry is exploring every avenue possible. Packaging, the process of combining different parts of a component, provides a promising area for advancements. An expert from SK hynix offers insights on how new packaging technologies, such as TSV (through-silicon via), are helping create smaller, […]
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In the aftermath of Gay Pride Month, we bring you a very special episode of the 3D InCites Podcast. Even though it’s July, we believe it is important to be allies to the LGBTQ community all year round. While many companies showed support for the LGBTQ+ community by adapting their logos with rainbow colors and […]
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How the end of scaling and the electrification of everything are changing chip design. The post CEO Outlook: Chiplets, Longer IC Lifetimes, More End Markets appeared first on Semiconductor Engineering.
