Hunting For Open Defects In Advanced Packages – SemiEngineering
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No single screening method will show all the possible defects that create opens. The post Hunting For Open Defects In Advanced Packages appeared first on Semiconductor Engineering.
Recommended Reads
Samsung and TSMC Seek to Spend Their Way to Worldwide Domination of Advanced IC Technology – Semiconductor Digest
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Combined, the two companies are forecast to represent 43% of global semiconductor industry capital spending this year. The post Samsung and TSMC Seeking to Spend Their Way to Worldwide Domination of Advanced IC Technology appeared first on Semiconductor Digest.
Micron Abandons 3D XPoint Memory Technology – iMicronews
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In a sudden but perhaps not too surprising announcement, Micron has stated that they are ceasing all R&D of 3D XPoint memory technology. Intel and Micron co-developed 3D XPoint memory, revealed in 2015 as a non-volatile memory technology with higher performance and endurance than NAND flash memory. Intel has been responsible for almost all of the commercial […]
Glass for Semiconductors: Many Applications, Few Players – iMicronews
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“Today, the scope for applications using glass substrates in the semiconductor field is broad and highly diversified.” asserts Amandine Pizzagalli, formerly Technology & Market Analyst, Semiconductor Manufacturing at Yole Développement (Yole) and today Finance Project Manager at Yole Finance, part of Yole. She adds:“Nowadays, the number of glass vendors able to deliver wafers and panels […]
Global Semiconductor Intellectual Property (IP) Market to Reach US$ 7,103.0 Million by 2027 – Semiconductor Digest
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The global semiconductor intellectual property (IP) market was valued at US$ 4,111.0 Million in 2019 and is expected to surpass US$ 7,103.0 Million by 2027, registering a CAGR of 8.9% during the forecast period (2020-2027), published by Coherent Market Insights. The post Global Semiconductor Intellectual Property (IP) Market to Reach US$ 7,103.0 Million by 2027 […]
Covid-19 Delivers a Mixed Blessing – iMicronews
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Written by Richard Stevenson for CompoundSemiconductor. net – The pandemic is behind soaring sales in some sectors of the compound semiconductor industry, while others take a hit or continue along an existing trajectory. We have all suffered from the pandemic on a personal level. Loved ones have been lost, many of us have had to […]
The Politics of Rare Earth Metals – EE Times
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The demand for rare earth elements used in smartphones and laptops has exploded within the last 20 years, but the supply chain is caught up in global politics. The post The Politics of Rare Earth Metals appeared first on EETimes.
Chiplets For The Masses – SemiEngineering
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Chiplets are technically and commercially viable, but not yet accessible to the majority of the market. How does the ecosystem get established? The post Chiplets For The Masses appeared first on Semiconductor Engineering.
Louvere Walker-Hannon on Getting More Black Women Involved in STEM – SWE Podcast
In this SWE Diverse episode, we wrap up Black History Month with Nikia Brown, African-American Affinity Group Black History Month Lead, and Louvere Walker-Hannon, SWE African-American Affinity Group Lead and MathWorks Senior Application Engineer. Listen as Louvere and Nikia discuss the challenges faced by Black women in STEM, the importance of mentoring and volunteering in […]
Executive Order Paves Way for $37bn to Boost U.S. Chip Capacity – EE Times
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US President’s executive order expects to add $37 billion investment to address short-term chip capacity shortfall. The post Executive Order Paves Way for $37bn to Boost U.S. Chip Capacity appeared first on EETimes.
Episode 309: Why your IoT device shipments are delayed – IoT
We’re really excited about radar in this week’s episode, so we discuss Ring’s new doorbell that added it for motion detection and Apple’s patent that plans to use radar for detecting vital signs. We also talk about radar being a feature that Plume plans to add to its Wi-Fi devices in the near future while […]
Shortages, Challenges Engulf Packaging Supply Chain – SemiEngineering
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Innovative business models emerge, but so does possibility of consolidation. The post Shortages, Challenges Engulf Packaging Supply Chain appeared first on Semiconductor Engineering.
Post-GDSII ASIC Packaging and Manufacturing – EE Times
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Packaging and verifying the integrity of advanced and connected semiconductor devices is proving challenging when it comes to gaining user trust in new applications. This topic has become even more critical as circuit design, semiconductor manufacturing, chip design tools, and IP involves collaborating with different teams and/or parties across the globe. ASIC packaging design is […]
CEOs Urge President Biden to Fund Chips, Executive Order Expected – EE Times
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The SIA and leading chip company CEOs ask US President for support The post CEOs Urge President Biden to Fund Chips, Executive Order Expected appeared first on EETimes.
Design Support For A Green IoT
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How model-based systems engineering can help minimize the growing amount of energy consumed by IoT devices. The post Design Support For A Green IoT appeared first on Semiconductor Engineering.
TSMC to Raise $9 Billion for Expansion Amid Shortages – EE Times
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TSMC said that it plans two sales of bonds that would raise about $9 billion to expand production, possibly helping to ease a critical shortage of silicon. The post TSMC to Raise $9 Billion for Expansion Amid Shortages appeared first on EETimes.
Auto Industry Chip Shortages Reflect Wider Shortfall – EE Times
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The failure of auto companies to secure supplies of chips reflects widespread shortages in the semiconductor industry. The post Auto Industry Chip Shortages Reflect Wider Shortfall appeared first on EETimes.
Bridging The Gap Between Smart Cities And Autonomous Vehicles – SemiEngineering
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Communication, security, and power issues still need to be solved, but there is progress. The post Bridging The Gap Between Smart Cities And Autonomous Vehicles appeared first on Semiconductor Engineering.
Roaring ’20s For The Chip Industry – SemiEngineering
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New markets, different architectures, and continued virtual work environments all point to positive and sustained growth. The post Roaring ’20s For The Chip Industry appeared first on Semiconductor Engineering.
New Intel CEO Commits to Remaining an IDM – Semi Wiki
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-Intel good results had a little extra help to be great -New CEO commits to remaining an IDM versus fabless -Claims of strong progress on 7NM fuel optimism inside -Outsourcing to TSMC will not go away but will increase A good quarter but with some silicon enhancements from ICAP Intel reported Revenues of $20B and […]
