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Threats are growing and widening, but what is considered sufficient can vary greatly by application or by user. Even then, it may not be enough. The post Why It’s So Difficult — And Costly — To Secure Chips appeared first on Semiconductor Engineering.
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Partitioning and floor-planning become big challenges. What goes on which die? The post Advanced Packaging Shifts Design Focus To System Level appeared first on Semiconductor Engineering.
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A look at how the open-source silicon movement is expanding chip design. The post The Democratization of Chip Design appeared first on EETimes.
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In this second SEMICON West preview episode, Françoise von Trapp talks with James Gellert, Chairman, and CEO of RapidRatings, a financial health, data, and analytics company based in New York City. James is delivering a keynote talk at SEMICON West titled – The Second Wave: Risk in Part Two of the Supply Chain Crisis. For […]
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Some segments are normalizing, others may continue through 2022. The post End In Sight For Chip Shortages? appeared first on Semiconductor Engineering.
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By Chris Jones, Edwards Vacuum In the last post to this blog, we introduced the theme of sustainable manufacturing, which will be our ongoing focus. We described the evolving framework for limiting carbon emissions and reviewed the vocabulary we will use going forward. This post will briefly overview the materials released off-site during semiconductor manufacturing […]
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Today’s chip shortage has put a spotlight on the degree to which the European economy depends on semiconductors. With limited local production capability and capacity, Europe risks its technological sovereignty and needs to correct course to maintain long-term competitiveness. Europe’s Urgent Need to Invest in a Leading Semiconductor Ecosystem was posted by Shannon Davis on Semiconductor […]
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We are really excited to announce that the 3D InCites Podcast will be the official podcast of SEMICON West Hybrid 2021, which kicks off in just four short weeks on December 7. SEMICON West in December? That’s right! Rather than holding it virtually for the second time in two years, the SEMI Americas team made […]
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The ramp-up of Chinese memory, the growth of flip-chip DRAM and 3D-stacking technologies are opening significant opportunities for packaging players. “Memory is a critical market in modern data-centric societies, fueled by important megatrends, such as mobility, cloud computing, AI, and the IoT.” asserts Simone Bertolazzi, Ph.D. Senior Market & Technology Analyst, Memory at Yole Développement […]
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Hybrid bonding has been a big story in heterogeneous integration and particularly 3D integration for quite some time. At the recent IMAPS International Symposium, it seemed like every keynote speaker mentioned some sort of hybrid bonding as an enabler for next-generation technology. Everybody is talking about it, everyone wants it – in fact, Xperi recently […]
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The two will establish a subsidiary to provide production at “specialty” nodes of 28nm and 22nm by the end of 2024. The post TSMC, Sony to Partner in $7B Fab in Japan appeared first on EETimes.
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TSMC recently held their 10th annual Open Innovation Platform (OIP) Ecosystem Forum. An earlier article summarized the highlights of the keynote presentation from L.C. Lu, TSMC Fellow and Vice-President, Design and Technology Platform, entitled “TSMC and Its Ecosystem for Innovation” (link). Overview of 3D Fabric The TSMC… Read More The post Update on TSMC’s 3D […]
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Investigate and predict early electrical performance to drive package development and selection. The post Optimizing System-Level Connectivity In Heterogenous Automotive Packages appeared first on Semiconductor Engineering.
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This week, we’re wrapping up our conversations from the IMAPS InternatinSymposium, with an extended episode. The questions I’m asking? How have the events of the last 18 months impacted the future of the semiconductor industry, and what are the three things we should be focusing on in advanced packaging right now? You’ll hear from Jan […]
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Demand for IC design services grows, but uptake in other chip sectors may have peaked. The post Semiconductor Sector Shows Signs of Cooling appeared first on EETimes.
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Vendors and market watchers are already promoting 6G. What will the wireless technology actually do if and when it arrives in 2030? The post 6G: More Hype Than Reality? appeared first on EETimes.
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Apple joins as first public partner in new imec research program that helps entire semiconductor value chain reduce its ecological footprint. Imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, today announces that Apple Inc. has joined imec’s brand-new Sustainable Semiconductor Technologies and Systems (SSTS) research program. The SSTS program is the […]
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If you liked Part 1 of Conversations from the IMAPS Symposium, you’re going to love part 2. While my questions are the same, the responses are quite varied. In this episode, you’ll hear from Andy Mackie of Indium Corporation, and Dirk Friebel, of Fraunhofer Institute, as we wrap up Day one of coverage. We’ll also […]
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Imec’s SVP drills down into GAA FETs, interconnects, chiplets, and 3D packaging. The post What’s Next For Transistors And Chiplets appeared first on Semiconductor Engineering.
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Putting several functions into a single SiP without interference. The post The New Technology Solutions For Advanced SiP Devices appeared first on Semiconductor Engineering.
