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Last November AMD held their AMD Accelerated Data Center Premiere, Intel had their Innovation Days, and Stephen Shankland of CNET visited Intel’s fabs 42 and CH-4 in Chandler. AMD, Intel Display Chiplet Packaging Prowess was posted by Shannon Davis on Semiconductor Digest.
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We’re kicking it off Season 2 of the 3D InCites Podcast with a conversation about CES 2022. As you probably know, the Consumer Electronics Showcase took place Live in Las Vegas earlier this month. The official attendee report is 45,000 in-person attendees and 2300 exhibitors, as well as 1800 global media representatives. 1/3 of the […]
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In response to what seems to be insatiable demand for ICs, the world’s biggest foundry signaled yet another increase in its expansion plans. The post TSMC’s 2022 Expansion Budget Exceeds $40 Billion appeared first on EETimes.
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Huawei ranks second in the 2021 EU Industrial R&D Investment Scoreboard. This is a jump of one place for Huawei compared to last year when the company ranked 3rd in the 2020 EU Industrial R&D Investment Scoreboard. The 2021 EU Industrial R&D Investment Scoreboard is a European Commission publication. It ranks the research investment levels of 2500 […]
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Above average increases are expected in all major product categories, which will lift the global market to record-high revenues in 2022 despite growth rates easing from last year’s economic rebound, says report. 2022 Semiconductor Sales to Grow 11% After Surging 25% in 2021 was posted by Shannon Davis on Semiconductor Digest.
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The few designs to reach silicon today are completely customized, with inconsistent tool support. That has to change for this packaging approach to succeed. The post Setting Ground Rules For 3D-IC Designs appeared first on Semiconductor Engineering.
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In this episode, sponsored by EMD Electronics, Françoise speaks with Anand Nambiar, who heads the semiconductor materials business of EMD Electronics, a business of Merck KGAA Darmstadt, Germany. In addition to providing his perspectives on the chip shortage, supply chain issues, and managing the growth of the semiconductor industry, he shared some exciting news. First, […]
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OmniVision Technologies, announced at CES 2022 that it has adopted a new brand with a new look: OMNIVISION. The updated branding reflects its latest expansion in product offerings and capabilities, going beyond sensing technologies and solutions. “As a new OMNIVISION, we look forward to expanding our product offerings in analog and touch & display, and […]
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GM Chief Mary Barra ticked off a list of EV advances during CES 2022, highlighting its Ultium platform while introducing a new lineup of EVs and partners. The post GM Outlines Its EV Strategy at CES appeared first on EETimes.
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TAP-2.5D, an inter-chiplet physical network design methodology for heterogeneous 2.5D systems. The post TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems appeared first on Semiconductor Engineering.
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There is value in attending live events, even as a new wave of COVID prompts more delays, cancellations, and shifts to virtual forums. The post The Value of In-Person Trade Shows appeared first on EETimes.
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Introduction Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging. At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of … Read More The post Heterogeneous Integration – A Cost […]
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As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to […]
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As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to […]
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Advanced packaging has been an increasingly common theme with semiconductors over the last handful of years. In this multi-part series, SemiAnalysis will break down the mega-trend. We will do a deep dive into the technologies that enable advanced packaging such as high accuracy flip chip, thermocompression bonding (TCB),… Read More The post Advanced Packaging Part […]
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This Christmas, weary parents must up their electronics game to the level of their tech-savvy kids. The post ‘So This is Christmas, and What Have You Done?’ appeared first on EETimes.
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The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco. (As several presenters were unable to attend, a “virtual” program is also available.) The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms; new features in commercial EDA tools; … Read More The post Top 10 Takeaways […]
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As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they […]
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President Biden has united automakers and autoworkers to drive American leadership forward on clean cars, and he set an ambitious target of 50% of electric vehicle (EV) sale shares in the U.S. by 2030. Now, the Bipartisan Infrastructure Law will supercharge America’s efforts to lead the electric future, Building a Better America where we can strengthen domestic […]
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This week (December 7-9) at SEMICON West in the Workforce Development Pavilion, one of the overarching topics has been how to address one of the current supply chain crises – not the chip shortage – but the talent shortage. If you’ve been following the news, you know that in response to the chip shortage, chip […]
