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Last November, Intel held their Innovation Days, with opening keynote by CEO Pat Gelsinger. Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1 was posted by Shannon Davis on Semiconductor Digest.
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Having made the transition to FinFET, new generations followed, and we now have the Intel 7 Alder Lake part, released towards the end of last year. Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2 was posted by Shannon Davis on Semiconductor Digest.
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We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them […]
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By Chris Jones, Edwards Vacuum This post will look at highlights of a similar report written by the International Energy Agency (IEA), which examines the issues through a more global lens. Net-Zero by 2050 – A Roadmap for the Global Energy Sector was posted by Shannon Davis on Semiconductor Digest.
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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotech, and semiconductor markets, and Teramount, a developer of scalable solutions for connecting optical fibers to silicon chips, have announced, at this week’s OFC expo, a collaboration on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber […]
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Several Yole Développement (Yole) reports, such as Fan-Out WLP and PLP Applications and Technologies 2021, highlight the expected growth in the Fan-out (FO) packaging market. A CAGR2020-2026 of 15% is expected and will drive the market to a value of $2.5B in 2026. This rapid growth is propelled by consumer and mobile applications, while automotive […]
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IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two […]
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5G-hyperscale convergence holds a lot of promise for businesses, cities, and consumers. But engineers must collaborate to deliver on that promise. The post Hyperscalers and 5G: Collision or Collusion? appeared first on EETimes.
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Ensuring the intended connectivity of the die, silicon interposer, and organic substrate. The post Dissolving The Barriers In Multi-Substrate 3D-IC Assembly Design appeared first on Semiconductor Engineering.
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Yole Développement (Yole) has recently published two technology & market reports, Imaging for Automotive (2022 edition coming soon)and Computing and AI Technologies for Mobile and Consumer Applications and one Processor Quarterly Market Monitor. These highlighted some interesting views relevant to the acquisition of Tower semiconductor by Intel Corp. Intel has subscribed to the “More Moore” […]
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One of our most listened-to episodes in Season 1 was on the importance of package design for chiplet integration. For those of you who are new to this podcast and chiplet technology, in a nutshell: Chiplets are hardened blocks of IP of different semiconductor technology nodes that result from disaggregating – literally taking apart a […]
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The package is playing an increasingly important role in cooling down HPC systems. The post Thermal Management Implications For Heterogeneous Integrated Packaging appeared first on Semiconductor Engineering.
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The global semiconductor market in 2021 was $555.9 billion, according to WSTS data released by the Semiconductor Industry Association (SIA). 2021 increased 26.2% from 2020, the largest annual increase since 31.8% in 2010, eleven years ago. We at Semiconductor Intelligence track publicly available semiconductor market forecasts… Read More The post Semiconductor Growth Moderating appeared first […]
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The good and bad of assembling dies from different foundries. The post Design Challenges Increasing For Mixed Die Packages appeared first on Semiconductor Engineering.
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By Chris Jones, Edwards Vacuum The International Technology Roadmap for Semiconductors (ITRS) and its successor, the International Roadmap for Devices and Systems (IRDS), have played a central organizing role in the development of the semiconductor manufacturing industry since the first ITRS was published in 1993. Roadmap to Decarbonizing Electrical Power in the United States was posted […]
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Workforce development is a critical and ongoing challenge in the microelectronics industry. SEMI Foundation is working to build awareness about the opportunities that come with a career in microelectronics through its Industry Image and Awareness Campaign. Part of that initiative is a partnership with Roadtrip Nation to create a video and documentary series focused on […]
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COVID was certainly a black swan event but semiconductors have seen similar events over the past 50 years, some of which I have experienced personally. The Dot-com bubble comes to mind but there were others. The question is will history repeat itself and the answer, according to Malcolm Penn of Future Horizons, is yes. Malcolm […]
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Certain conclusions can be drawn from a U.S. report on supply chain disruptions. Quick congressional approval of CHIPS Act funding isn’t one of them. The post How to Interpret Chip Supply Chain Data appeared first on EETimes.
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With the dawn of chiplet integration, advanced chip manufacturing and advanced packaging technologies are more complex than ever. Dies are being integrated from different wafers, and yield management is tricky. It requires a combination of both electrical test and optical measurement – or metrology. Even more, it requires hybrid metrology using multi-sensor technology. In this […]
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Hybrid bonding opens up whole new level of performance in packaging, but it’s not the only improvement. The post Next-Gen 3D Chip/Packaging Race Begins appeared first on Semiconductor Engineering.
