How Do I Come To Trust An Electronic Component? – SemiEngineering
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Determining what makes a dependable system. The post How Do I Come To Trust An Electronic Component? appeared first on Semiconductor Engineering.
Recommended Reads
SEMI ISS 2022: A Conversation about The Ukrainian Neon Gas Shortage
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SEMI’s annual Industry Strategy Symposium (ISS) took place April 4-7, 2022 at the Riz Carlton resort in Half Moon Bay, CA. The event usually takes place in January, but due to Omicron, was postponed at the last minute and rescheduled to April. This annual event is where industry leaders gather for mission-critical discussions that the […]
Intel Looks for Growth – iMicronews
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The current semiconductor growth trend does not resemble those that came before. Taking stock of the past cycles, at Yole Développement (Yole) we see a common theme: a certain application finds its place in society, and the OEMs and major semiconductor companies race to fill the massive, growing demand. The winners are those OEMs that […]
Gartner Says Worldwide Semiconductor Revenue Grew 26% in 2021 – Semiconductor Digest
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Worldwide semiconductor revenue totaled $595 billion in 2021, an increase of 26.3% from 2020, according to final results by Gartner, Inc. Gartner Says Worldwide Semiconductor Revenue Grew 26% in 2021 was posted by Shannon Davis on Semiconductor Digest.
Veeco Releases ESG Goals for 2022 and Beyond – Semiconductor Today
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Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has unveiled its Environmental, Social and Governance (ESG) goals for 2022 and beyond, showcasing its on-going commitment to corporate social responsibility. Based on feedback received from the company’s stakeholders and results of its 2021 materiality assessment, the goals relate to climate change, […]
Slowdown, But No Correction – SemiEngineering
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Materials supply chain still bumpy and consumer buying has peaked for now, but growth continues. The post Slowdown, But No Correction appeared first on Semiconductor Engineering.
A Conversation about the New Vision for IMAPS
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In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward. Beth and Erica provide details on three major initiatives: One is to create awareness in the US […]
Members Spotlight: Conversations from IMAPS DPC 2022
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In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022. In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that […]
SEMI Wins $1 Million Grant to Create Community College Apprenticeship Program for Microelectronics Industry Workforce Development – Semiconductor Digest
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The SEMI Foundation partners with Foothill College, Ignited Education, and Krause Center for Innovation to develop microelectronics career training program. SEMI Wins $1 Million Grant to Create Community College Apprenticeship Program for Microelectronics Industry Workforce Development was posted by Shannon Davis on Semiconductor Digest.
Intel, Community College District in Arizona Launch First-of-its-Kind AI Lab – Semiconductor Digest
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Maricopa County, Arizona, program aims to teach American workers new skills and make artificial intelligence more accessible. Intel, Community College District in Arizona Launch First-of-its-Kind AI Lab was posted by Shannon Davis on Semiconductor Digest.
SiC Market, a Multi-billion-dollar Prospect – iMicronews
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The SiC market is anticipating incredible growth, with a new wave of capacity expansion and supply chain integration. The market research and strategy consulting company Yole Développement (Yole) has developed a core compound semiconductor expertise with a dedicated team of technology and market experts for more than 20 years. Throughout the year, Yole’s analysts deliver […]
A Conversation about The Status of US Onshoring and the DoD’s SHIP Program
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The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate […]
US Electronics Reshoring Plan Risks Missing the Boat – EE Times
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The US is intent on reshoring electronics, but it’s ignoring entire industry segments. The risk will be frittering away $52 billion. The post US Electronics Reshoring Plan Risks Missing the Boat appeared first on EETimes.
Patent Trends Foretell Chipmakers’ Fortunes – EE Times
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TSMC has been building the largest and strongest patent portfolio, followed by Samsung, and Intel. Patent quality is a concern for some semiconductor companies, however. The post Patent Trends Foretell Chipmakers’ Fortunes appeared first on EETimes.
Advanced Furnace Technology’s Research Director Wins ‘Women in Innovation’ Award – Semiconductor Today
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Engineering and materials science company Advanced Furnace Technology Ltd of Cambridge, UK (which provides specialist graphite services such as graphite cleaning, purification and coating) says that its director of research Dr Zoe Tolkien has won £50,000 and a mentoring and support package after being named a winner at the ‘Women in Innovation’ awards of the […]
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1 – Semiconductor Digest
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Last November, Intel held their Innovation Days, with opening keynote by CEO Pat Gelsinger. Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead: Part 1 was posted by Shannon Davis on Semiconductor Digest.
Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2 – Semiconductor Digest
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Having made the transition to FinFET, new generations followed, and we now have the Intel 7 Alder Lake part, released towards the end of last year. Pat Gelsinger Takes Us on a Trip Down Memory Lane – and a Look Ahead: Part 2 was posted by Shannon Davis on Semiconductor Digest.
Conversations with the 2022 3D InCites Award Winners – Part 1
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We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them […]
Net-Zero by 2050 – A Roadmap for the Global Energy Sector – Semiconductor Digest
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By Chris Jones, Edwards Vacuum This post will look at highlights of a similar report written by the International Energy Agency (IEA), which examines the issues through a more global lens. Net-Zero by 2050 – A Roadmap for the Global Energy Sector was posted by Shannon Davis on Semiconductor Digest.
OFC 2022: EV Group and Teramount developing packaging tech for PICs – iMicronews
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EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotech, and semiconductor markets, and Teramount, a developer of scalable solutions for connecting optical fibers to silicon chips, have announced, at this week’s OFC expo, a collaboration on implementing wafer-level optics to solve a major obstacle of silicon photonics, namely fiber […]
