|
GM Chief Mary Barra ticked off a list of EV advances during CES 2022, highlighting its Ultium platform while introducing a new lineup of EVs and partners. The post GM Outlines Its EV Strategy at CES appeared first on EETimes.
|
TAP-2.5D, an inter-chiplet physical network design methodology for heterogeneous 2.5D systems. The post TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems appeared first on Semiconductor Engineering.
|
There is value in attending live events, even as a new wave of COVID prompts more delays, cancellations, and shifts to virtual forums. The post The Value of In-Person Trade Shows appeared first on EETimes.
|
Introduction Heterogeneous integration (HI) is a general term used to represent the diverse possibilities for die technology incorporated into advanced 2.5D/3D packaging. At the recent International Electron Devices Meeting (IEDM) in San Francisco, a team from Synopsys and IC Knowledge presented data from analyses of … Read More The post Heterogeneous Integration – A Cost […]
|
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to […]
|
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members and other industry experts to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to […]
|
Advanced packaging has been an increasingly common theme with semiconductors over the last handful of years. In this multi-part series, SemiAnalysis will break down the mega-trend. We will do a deep dive into the technologies that enable advanced packaging such as high accuracy flip chip, thermocompression bonding (TCB),… Read More The post Advanced Packaging Part […]
|
This Christmas, weary parents must up their electronics game to the level of their tech-savvy kids. The post ‘So This is Christmas, and What Have You Done?’ appeared first on EETimes.
|
The “in-person” portion of the Design Automation Conference (DAC) was recently held in San Francisco. (As several presenters were unable to attend, a “virtual” program is also available.) The presentations spanned a wide gamut – e.g., technical advanced in design automation algorithms; new features in commercial EDA tools; … Read More The post Top 10 Takeaways […]
|
As part of our SEMICON West Hybrid 2021 podcast series, Françoise spent lots of time on the show floor, catching up in person with 3D InCites community members to find out how business has been since the last time they saw each other at SEMICON West in 2019. In addition to talking about what they […]
|
President Biden has united automakers and autoworkers to drive American leadership forward on clean cars, and he set an ambitious target of 50% of electric vehicle (EV) sale shares in the U.S. by 2030. Now, the Bipartisan Infrastructure Law will supercharge America’s efforts to lead the electric future, Building a Better America where we can strengthen domestic […]
|
This week (December 7-9) at SEMICON West in the Workforce Development Pavilion, one of the overarching topics has been how to address one of the current supply chain crises – not the chip shortage – but the talent shortage. If you’ve been following the news, you know that in response to the chip shortage, chip […]
|
By 2025, chip shortages and trends such as electrification and autonomy will drive 50% of the top 10 automotive original equipment manufacturers (OEMs) to design their own chips, according to Gartner, Inc. As a result, it will give them control over their product roadmap and supply chains. Gartner Predicts Chip Shortages Will Drive 50% of […]
|
Identifying the right combination of sensors requires consideration of roles, capabilities, and limitations. The post Choose The Right Sensors For Autonomous Vehicles appeared first on Semiconductor Engineering.
|
At SEMICON West Hybrid 2021, everyone was talking about the impact of the chip shortage, global fab expansion, the talent shortage, and the over-arching topic of the importance of sustainable semiconductor manufacturing. We spoke with Ajit Manocha, CEO of SEMI, to get his perspective on all these issues, and the role SEMI plays in providing […]
|
Do you suffer from FOMO – Fear of Missing Out? Our host, Françoise von Trapp, does. She had it bad when she couldn’t attend SEMICON Europa in November, and instead had to watch it play out on social media. So, she decided to invite some 3D InCites Community Members who were able to attend to […]
|
Cost, thermal dissipation, and overall reliability will likely determine which technologies get used where. The post Advanced Packaging For Automotive Chips appeared first on Semiconductor Engineering.
|
Threats are growing and widening, but what is considered sufficient can vary greatly by application or by user. Even then, it may not be enough. The post Why It’s So Difficult — And Costly — To Secure Chips appeared first on Semiconductor Engineering.
|
Partitioning and floor-planning become big challenges. What goes on which die? The post Advanced Packaging Shifts Design Focus To System Level appeared first on Semiconductor Engineering.
|
A look at how the open-source silicon movement is expanding chip design. The post The Democratization of Chip Design appeared first on EETimes.
